Method of attaching leads to a semiconductor body and the article formed thereby

Claim 1

A SEMICONDUCTOR DEVICE COMPRISING A BODY OF SEMICONDUCTOR MATERIAL, A PAIR OF ELECTRODES, AT LEAST ONE OF SAID ELECTRODES INCLUDING A BLOCK OF ELECTRICALLY CONDUCTIVE MATERIAL HAVING A COEFFICIENT OF THERMAL EXPANSION SUBSTANTIALLY GREATER THAN SAID SEMICONDUCTOR MATERIAL, ONE END OF SAID BLOCK HAVING FIRST AND SECOND SETS OF DEEP CHANNELS FORMED THEREIN, SAID FIRST SET BEING PERPENDICULAR TO SAID SECOND SET WHEREBY A PLURALITY OF GENERALLY PARALLEL, SUBSTANTIALLY WIRE-SHAPED CONDUCTORS EXTEND FROM THE OTHER END OF SAID BLOCK, A LAYER OF SOLDER BONDING THE ENDS OF SAID CONDUCTORS DIRECTLY TO SAID BODY, SAID CONDUCTORS BEING SUFFICIENTLY LONG RELATIVE TO THEIR THICKNESS SO THAT HEATING OF SAID CONDUCTORS CAUSES THEM TO BOW AND REDUCE STRESS ON SAID BODY CAUSED BY THE DIFFERENCE IN THE COEFFICIENTS OF THERMAL EXPANSION OF AID SEMICONDUCTOR MATERIAL AND SAID CONDUCTIVE MATERIAL.