Method of manufacturing semi-conductive electrode systems

Abstract

Abstract 899,997. Semi-conductor devices. PHILIPS ELECTRICAL INDUSTRIES Ltd. Nov. 3, 1958 [Nov. 5, 1957], No. 35207/58. Class 37. Semiconductor devices are manufactured by securing a semiconductor wafer, to a plurality of supports and then breaking the wafer between the supports to form a plurality of bodies each mounted on a support. The wafer 1 may be secured to the fingers of a comb 3 as in Fig. 2, and emitter 5 and base 6 electrodes provided before cutting the support along lines 8 and breaking the wafer between the fingers to provide a plurality of transistors. Alternatively a wafer 23 may be soldered to the ends of a series of supports clamped together in a stack 20 (Fig. 4), broken along lines 24 to provide a number of elements each comprising a line of support elements which is then broken again to provide the plurality of separate elements each bearing a piece of the wafer. The semi-conductor may consist of germanium and the supports of nickel.

Inventors

• 👤 Jochems Pieter Johan Wilhelmus

Bibliographic Details