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US5474649A Expired / Lapsed US ⏱️ 0.0 years remaining

Plasma processing apparatus employing a textured focus ring

Assignee: Applied Materials Inc
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Filing: 1994-03-08
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Granted: 1995-12-12
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Expires: 2014-03-08
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Abstract

Abstract The invention is directed to a focus ring for surrounding a workpiece/surface substrate during plasma processing comprising a hollow annular assembly comprised of electrically insulating material and having a texturized surface. The texturized ring is preferably in the geometry of a generally cylindrical structure. The texturizing of the ring can be effected by any means of surface abrasion including bead blasting or chemical etching.

Inventors

  • 👤 Joseph Kava
  • 👤 Richard J. McGovern
  • 👤 Greg A. Blackburn

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 04:28
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/32431; H01J37/32623; H01J37/32642; H01J37/32532; H01J37/32633; H10; H10P; H10P72/00; H10P72/04; H10P72/0402; H10P72/0418; H10P72/0421; Y; Y10; Y10S; Y10S156/00; Y10S156/915; Y10S156/917

Claims Analysis

Total Claims: 15
Claim 1
Independent Claim 109 words
A method for plasma processing of a semiconductor workpiece comprising: a) placing a semiconductor workpiece to be processed on an electrode disposed in a plasma reactor chamber; b) surrounding the workpiece with a focus ring comprised of a hollow annular assembly further comprised of insulating material and having a texturized surface; c) evacuating said reactor chamber and introducing reactive gas into the chamber; and d) generating a plasma in the chamber by applying power to the substrate supporting electrode whereby the workpiece is processed by the plasma generated reactive gases and a stable coating of plasma generated particulate material is formed on the texturized surface of the focus ring.
Claim 2
Independent Claim 109 words
A method for plasma processing of a semiconductor workpiece comprising: a) placing a semiconductor workpiece to be processed on an electrode disposed in a plasma reactor chamber; b) surrounding the workpiece with a focus ring comprised of a hollow annular assembly further comprised of insulating material and having a texturized surface; c) evacuating said reactor chamber and introducing reactive gas into the chamber; and d) generating a plasma in the chamber by applying power to the substrate supporting electrode whereby the workpiece is processed by the plasma generated reactive gases and a stable coating of plasma generated particulate material is formed on the texturized surface of the focus ring.
Claim 3
Dependent Claim 21 words
The method of claim 1 wherein the focus ring is a substantially cylindrical structure and is texturized in a pitted configuration.
Claim 4
Dependent Claim 37 words
The method of claim 2 wherein the focus ring surrounding the semiconductor workpiece is comprised of material selected from the group of engineering resins or engineering ceramics consisting essentially of polycarbonate resins, ceramic materials, and quartz materials.
Claim 5
Dependent Claim 37 words
The method of claim 3 wherein the focus ring is a polycarbonate resin and one planar end of the substantially cylindrical ring is biased at an angle of about 3° from the plane of the other end.
Claim 6
Dependent Claim 82 words
A semiconductor plasma processing apparatus for processing workpieces comprising: a) a semiconductor processing chamber having a reactive gas inlet and a reactive gas outlet; b) an electrode disposed in the processing chamber for supporting a semiconductor workpiece; c) power supply connected to the substrate supporting electrode; and d) a focus ring for surrounding the workpiece comprising a hollow annular assembly comprised of insulating material and having a texturized surface to enhance the stability of plasma generated residual coatings formed on said surface.
Claim 7
Dependent Claim 82 words
A semiconductor plasma processing apparatus for processing workpieces comprising: a) a semiconductor processing chamber having a reactive gas inlet and a reactive gas outlet; b) an electrode disposed in the processing chamber for supporting a semiconductor workpiece; c) power supply connected to the substrate supporting electrode; and d) a focus ring for surrounding the workpiece comprising a hollow annular assembly comprised of insulating material and having a texturized surface to enhance the stability of plasma generated residual coatings formed on said surface.
Claim 8
Dependent Claim 21 words
The apparatus of claim 5 wherein the focus ring is a substantially cylindrical structure and is texturized in a pitted configuration.
Claim 9
Dependent Claim 36 words
The apparatus of claim 6 wherein the insulating material of the focus ring is selected from the group of engineering resins or engineering ceramics consisting essentially of polycarbonate resins, polypropylene resins, ceramic materials, and quartz materials.
Claim 10
Dependent Claim 37 words
The apparatus of claim 7 wherein the focus ring is a polycarbonate resin and one planar end of the substantially cylindrical ring is biased at an angle of about 3° from the plane of the other end.
Claim 11
Dependent Claim 53 words
A focus ring for surrounding a semiconductor workpiece in a plasma processing apparatus comprising a hollow annular assembly of a substantially cylindrical structure comprised of insulating material and having a texturized surface in the form of a micropatterned line configuration to enhance the stability of plasma generated residual coatings formed on said surface.
Claim 12
Dependent Claim 53 words
A focus ring for surrounding a semiconductor workpiece in a plasma processing apparatus comprising a hollow annular assembly of a substantially cylindrical structure comprised of insulating material and having a texturized surface in the form of a micropatterned line configuration to enhance the stability of plasma generated residual coatings formed on said surface.
Claim 13
Dependent Claim 23 words
The focus ring of claim 1 wherein the micropattern surface contains from about 50 to 350 lines or repeating geometric units per inch.
Claim 14
Dependent Claim 19 words
The focus ring of claim 1 wherein the texturized surface is a texturized coating on the annular insulator surface.
Claim 15
Dependent Claim 30 words
The focus ring of claim 1 wherein one planar end of the annular ring structure is angularly biased from the plane of the other end of the annular ring structure.

References Cited (Backward Citations)

US4793975A Cited
US5001327A Cited
US4975327A Cited
US5246532A Cited
US5316620A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1998-12-11 1999-06-12 1999-12-12 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2002-12-11 2003-06-12 2003-12-12 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2006-12-11 2007-06-12 2007-12-12 $7700.00 Window Closed / Lapsed

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