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US5456797A
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Method of planarizing trench structures
Assignee: Robert Bosch GmbH
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Filing: 1994-01-14
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Granted: 1995-10-10
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Expires: 2014-01-14
Abstract
Abstract A method of planarizing trench-like structures, particularly on semiconductor substrates, by filling in the trench-like structures. For this purpose, a pre-polymer is selectively filled into the trench-like structures, is hardened and is then expanded.
Inventors
- 👤 Lothar Weber
- 👤 Monika Lorkowski
- 👤 Klaus-Michael Mayer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 07:05
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4249; G02B6/10; G02B6/12; G02B6/122; G02B6/1221; G02B6/36; G02B6/38; G02B6/3628; G02B6/3648; G02B6/3652; G02B6/3684; G02B6/3688; G02B6/3692
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
36 words
In a method of planarizing trench structures in a substrate surface by filling in the trench structures, the steps of selectively filling a pre-polymer into the trench structures, hardening the pre-polymer, and then expanding the pre-polymer.
Claim 2
Dependent Claim
36 words
In a method of planarizing trench structures in a substrate surface by filling in the trench structures, the steps of selectively filling a pre-polymer into the trench structures, hardening the pre-polymer, and then expanding the pre-polymer.
Claim 3
Dependent Claim
18 words
A method as defined in claim 1, wherein the substrate containing the trench structure is a semiconductor substrate.
Claim 4
Dependent Claim
16 words
A method as defined in claim 1, wherein non-cross-linked or partially cross-linked pro-polymer is filled in.
Claim 5
Dependent Claim
21 words
A method as defined in claim 1, wherein the prepolymer is hardened by exposure to UV light over the entire surface.
Claim 6
Dependent Claim
15 words
A method as defined in claim 1, wherein the propolymer is hardened by thermal treatment.
Claim 7
Dependent Claim
23 words
A method as defined in claim 1, wherein the hardened pro-polymer is chemically expanded so that it experiences a permanent change in structure.
Claim 8
Dependent Claim
22 words
A method as defined in claim 6, wherein the chemical expansion is effected by diffusing in non-cross-linked pre-polymer and by subsequent cross-linking.
Claim 9
Dependent Claim
15 words
A method as defined in claim 7, wherein the cross-linking is effected by UV illumination.
Claim 10
Dependent Claim
20 words
A method as defined in claim 6, wherein the chemical expansion is effected by the application of an inorganic substance.
Claim 11
Dependent Claim
17 words
A method as defined in claim 9, wherein the inorganic substance is an acid or a base.
Claim 12
Dependent Claim
19 words
A method as defined in claim 6, wherein the chemical expansion is effected by diffusing in an organic solvent.
Claim 13
Dependent Claim
13 words
A method as defined in claim 11, wherein the diffusion occurs under pressure.
Claim 14
Dependent Claim
13 words
A method as defined in claim 1, further comprising polishing the expanded pre-polymer.
Claim 15
Dependent Claim
25 words
A method as defined in claim 13, wherein the substrate is a semiconductor substrate, and the semiconductor substrate is flexibly pressed on during the polishing.
Claim 16
Dependent Claim
24 words
A method as defined in claim 2, wherein the entire semiconductor substrate surface together with the planarized trench structures is subjected to fine planarization.
Claim 17
Dependent Claim
22 words
A method as defined in claim 15, wherein the fine planarization is effected by centrifugal or immersion coating with a cross-linked polyimide.
Claim 18
Dependent Claim
26 words
A method as defined in claim 15, wherein the planarized trench structures are provided with a metalization layer before the fine planarization, thereby protecting the structures.
Claim 19
Dependent Claim
25 words
A method as defined in claim 15, wherein the fine planarization is effected by one or repeated steps of alternating polyimide coating and plasma etching.
Claim 20
Dependent Claim
40 words
A method as defined in claim 2, wherein the filling of the pre-polymer into the trench structures is effected with at least one dosaging reservoir that is additionally disposed on the semiconductor substrate and is connected with the trench structures.
Claim 21
Dependent Claim
33 words
A method as defined in claim 1, wherein the prepolymer employed for the filling in is pre-heated or has its viscosity characteristics, surface tension and wetting capability adapted by dilution or partial polymerization.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-10-09 | 1999-04-10 | 1999-10-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-10-09 | 2003-04-10 | 2003-10-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-10-09 | 2007-04-10 | 2007-10-10 | $7700.00 | Window Closed / Lapsed |