US3313013A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making solid-state circuitry
Assignee: Fairchild Semiconductor Corp
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Filing: 1964-10-05
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Granted: 1967-04-11
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Expires: 1984-10-05
Abstract
No abstract record available.
Inventors
- 👤 Jay T Last
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 11:30
CPC Classifications
H; H10; H10D; H10D99/00; H10P; H10P90/00; H10P90/19; H10P90/1904; H10P90/1906; H10W; H10W10/00; H10W10/01; H10W10/011; H10W10/019; H10W10/021; H10W10/061; H10W10/10; H10W10/181; H10W10/20; H10W10/014; H10W10/17; Y; Y10; Y10S; Y10S148/00; Y10S148/085; Y10S438/00; Y10S438/928
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
105 words
AN IMPROVED PROCESS OF MANUFACTURING SOLID-STATE ELECTRONIC CIRCUITS COMPRISING FORMING A PLURALITY OF JUNCTION-TYPE SEMICONDUCTOR DEVICES ADJACENT THE SURFACE OF A SINGLE WAFER OF SEMICONDUCTING MATERIAL, FORMING AN INSULATING PROTECTIVE COATING UPON THE WAFER SURFACE WHEREAT RECTIFYING JUNCTIONS OF THE DEVICES EMERGE AND EXTENDING BETWEEN THE DEVICES, ETCHING AT LEAST ONE CHANNEL THROUGH THE WAFER FROM A BACK SIDE THEREOF TO, BUT NOT THROUGH SAID PROTECTIVE COATING INTERMEDIATE THE DEVICES, AND FILLING SAID CHANNELS WITH AN INSULATING MATERIAL WHILE BONDING SAME TO THE WAFER TO REJOIN THE PORTIONS OF THE WAFER PROPER AND PROVIDE ELECTRICAL ISOLATION BETWEEN PORTIONS OF THE WAFER SEPARATED BY SAID INSULATION.
Claim 2
Dependent Claim
105 words
AN IMPROVED PROCESS OF MANUFACTURING SOLID-STATE ELECTRONIC CIRCUITS COMPRISING FORMING A PLURALITY OF JUNCTION-TYPE SEMICONDUCTOR DEVICES ADJACENT THE SURFACE OF A SINGLE WAFER OF SEMICONDUCTING MATERIAL, FORMING AN INSULATING PROTECTIVE COATING UPON THE WAFER SURFACE WHEREAT RECTIFYING JUNCTIONS OF THE DEVICES EMERGE AND EXTENDING BETWEEN THE DEVICES, ETCHING AT LEAST ONE CHANNEL THROUGH THE WAFER FROM A BACK SIDE THEREOF TO, BUT NOT THROUGH SAID PROTECTIVE COATING INTERMEDIATE THE DEVICES, AND FILLING SAID CHANNELS WITH AN INSULATING MATERIAL WHILE BONDING SAME TO THE WAFER TO REJOIN THE PORTIONS OF THE WAFER PROPER AND PROVIDE ELECTRICAL ISOLATION BETWEEN PORTIONS OF THE WAFER SEPARATED BY SAID INSULATION.
References Cited (Backward Citations)
US2748041A
Cited
US2981877A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1970-04-10 | 1970-10-10 | 1971-04-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1974-04-10 | 1974-10-10 | 1975-04-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1978-04-10 | 1978-10-10 | 1979-04-11 | $7700.00 | Window Closed / Lapsed |