Patent US5455070A successfully refreshed from Google Patents.
US5455070A
Expired / Lapsed
US
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Variable rate distribution gas flow reaction chamber
Assignee: Applied Materials Inc
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Filing: 1993-09-16
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Granted: 1995-10-03
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Expires: 2013-09-16
Abstract
Abstract A wafer processing reactor having an input manifold to enable control of a process gas flow profile over a wafer that is being processed. Both process gas relative concentrations and flow rates can be controlled, thereby enabling an increased uniformity of processing across the wafer.
Inventors
- 👤 Roger N. Anderson
- 👤 Paul R. Lindstrom
- 👤 Wayne Johnson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 03:05
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/44; C23C16/455; Y; Y10; Y10S; Y10S438/00; Y10S438/935
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
78 words
A method for processing a substrate mounted horizontally within a reaction chamber comprising the steps of: mounting a substrate within said chamber, directing a plurality of streams of a processing gas across and parallel to a surface of said substrate which is rotating during processing, and separately controlling respective flows of said plurality of gas streams wherein a higher flux of processing gas is directed at the center of the substrate than at the perimeter of the substrate.
Claim 2
Independent Claim
78 words
A method for processing a substrate mounted horizontally within a reaction chamber comprising the steps of: mounting a substrate within said chamber, directing a plurality of streams of a processing gas across and parallel to a surface of said substrate which is rotating during processing, and separately controlling respective flows of said plurality of gas streams wherein a higher flux of processing gas is directed at the center of the substrate than at the perimeter of the substrate.
Claim 3
Dependent Claim
17 words
A method according to claim 1 wherein said processing gases are preheated before they reach the substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-10-02 | 1999-04-03 | 1999-10-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-10-02 | 2003-04-03 | 2003-10-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-10-02 | 2007-04-03 | 2007-10-03 | $7700.00 | Window Closed / Lapsed |