Plasma etching apparatus II-conical-shaped projection

Claim 2

In a radial flow plasma etcher including an upper circular electrode, a lower circular electrode spaced apart from the upper electrode and including means for receiving one or more wafers thereon, the improvement wherein said electrodes are formed to provide a gap between the electrodes which is greatest at the circumference and smallest at the center thereof, the face of one of said upper and lower electrodes being substantially planar and the face of the other of said upper and lower electrodes having an annular area proximate its circumference which is substantially planar and substantially parallel to the face of said one electrode.

Claim 3

The radial flow plasma etcher of claim 1 including means for introducing the gas forming the plasma from substantially the center of the upper electrode.

Claim 4

The radial flow plasma etcher of claim 1 wherein said lower electrode possesses a substantially cone-shaped member within said annular area.

Claim 5

The radial flow plasma etcher of claim 1 wherein said annular area is formed on the bottom electrode and said one or more wafers are received within said annular area.

Claim 6

A plasma etch apparatus comprising: a vacuum chamber, a first electrode having a substantially circular face positioned within said chamber and having a first surface defining one side of the plasma etching region, a second electrode having a substantially circular face positioned within said chamber and having a second surface defining the other side of the plasma etching region, said first and second surfaces facing one another to define the plasma etching region therebetween, said first and second surfaces shaped to provide a greater distance therebetween adjacent the periphery, as defined by an annular area upon the periphery of the second surface, than inwardly from adjacent their peripheries, means for establishing an electrical potential difference between said electrodes, and means for introducing gas into said vacuum chamber with the gas flowing between the portion of the plasma etching region adjacent the periphery of said first and second surfaces and the portion of the plasma etching region inwardly from the periphery of said surfaces to produce an etching plasma in the region between said first and second surfaces.

Claim 7

A plasma etch apparatus comprising: a vacuum chamber, a first electrode having a substantially circular face positioned within said chamber and having a first surface defining one side of the plasma etching region, a second electrode having a substantially circular face positioned within said chamber and having a second surface defining the other side of the plasma etching region, said first and second surfaces facing one another to define the plasma etching region therebetween, said first and second surfaces shaped to provide a greater distance therebetween adjacent the periphery, as defined by an annular area upon the periphery of the second surface, than inwardly from adjacent their peripheries, means for establishing an electrical potential difference between said electrodes, and means for introducing gas into said vacuum chamber with the gas flowing between the portion of the plasma etching region adjacent the periphery of said first and second surfaces and the portion of the plasma etching region inwardly from the periphery of said surfaces to produce an etching plasma in the region between said first and second surfaces.

Claim 8

The plasma etch apparatus of claim 5 wherein the distance between the substantially circular faces of second and first electrodes increases in the direction radially outward from the center of the electrodes.