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US5455070A Expired / Lapsed US ⏱️ 0.0 years remaining

Variable rate distribution gas flow reaction chamber

Assignee: Applied Materials Inc
•
Filing: 1993-09-16
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Granted: 1995-10-03
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Expires: 2013-09-16
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Abstract

Abstract A wafer processing reactor having an input manifold to enable control of a process gas flow profile over a wafer that is being processed. Both process gas relative concentrations and flow rates can be controlled, thereby enabling an increased uniformity of processing across the wafer.

Inventors

  • 👤 Roger N. Anderson
  • 👤 Paul R. Lindstrom
  • 👤 Wayne Johnson

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 02:52
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/44; C23C16/455; Y; Y10; Y10S; Y10S438/00; Y10S438/935

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 78 words
A method for processing a substrate mounted horizontally within a reaction chamber comprising the steps of: mounting a substrate within said chamber, directing a plurality of streams of a processing gas across and parallel to a surface of said substrate which is rotating during processing, and separately controlling respective flows of said plurality of gas streams wherein a higher flux of processing gas is directed at the center of the substrate than at the perimeter of the substrate.
Claim 2
Independent Claim 78 words
A method for processing a substrate mounted horizontally within a reaction chamber comprising the steps of: mounting a substrate within said chamber, directing a plurality of streams of a processing gas across and parallel to a surface of said substrate which is rotating during processing, and separately controlling respective flows of said plurality of gas streams wherein a higher flux of processing gas is directed at the center of the substrate than at the perimeter of the substrate.
Claim 3
Dependent Claim 17 words
A method according to claim 1 wherein said processing gases are preheated before they reach the substrate.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1998-10-02 1999-04-03 1999-10-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2002-10-02 2003-04-03 2003-10-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2006-10-02 2007-04-03 2007-10-03 $7700.00 Window Closed / Lapsed

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