Patent US5434199A successfully refreshed from Google Patents.
US5434199A
Expired / Lapsed
US
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Epoxy molding composition for surface mount applications
Assignee: Cookson Singapore Pte Ltd
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Filing: 1994-10-07
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Granted: 1995-07-18
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Expires: 2014-10-07
Abstract
Abstract Epoxy molding compositions for surface mount applications are disclosed. The compositions contain multifunctional epoxy resin and multifunctional hardener along with silicone rubber particles, organofunctional silicone fluid and a high loading of silica.
Inventors
- 👤 Michael K. Gallagher
- 👤 Michael A. Petti
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:15
CPC Classifications
C; C08; C08L; C08L63/00; H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W74/473; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31511
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
75 words
A low stress epoxy molding composition for surface mount integrated circuits comprising: a) from about 5% to 15% tris-phenolmethane multifunctional epoxy resin; b) from about 2.5% to about 8% tris-phenolmethane multifunctional phenolic hardener; c) from about 70 to about 85% fused silica in a blend which includes 65-85% spherical and 35-15% crushed particles; d) from about 0.25 to about 3% spherical silicone rubber powder; and e) from about 0.25 to about 3% organofunctional silicone fluid.
Claim 2
Dependent Claim
75 words
A low stress epoxy molding composition for surface mount integrated circuits comprising: a) from about 5% to 15% tris-phenolmethane multifunctional epoxy resin; b) from about 2.5% to about 8% tris-phenolmethane multifunctional phenolic hardener; c) from about 70 to about 85% fused silica in a blend which includes 65-85% spherical and 35-15% crushed particles; d) from about 0.25 to about 3% spherical silicone rubber powder; and e) from about 0.25 to about 3% organofunctional silicone fluid.
Claim 3
Dependent Claim
53 words
A low stress epoxy molding composition for surface mount integrated circuits according to claim 1 in which the amount of fused silica is at least 75% by weight of the formulation, and the fused silica is a blend of from 65 to 85% spherical silica and from about 35 to 15% crushed silica.
Claim 4
Dependent Claim
20 words
A low stress epoxy molding composition according to claim 1 wherein the silicone fluid has both epoxy and polyalkyleneoxy-functional groups.
Claim 5
Dependent Claim
10 words
An integrated circuit encapsulated with the composition of claim 1.
Claim 6
Dependent Claim
10 words
An integrated circuit encapsulated with the composition of claim 2.
Claim 7
Dependent Claim
10 words
An integrated circuit encapsulated with the composition of claim 3.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-07-17 | 1999-01-16 | 1999-07-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-07-17 | 2003-01-16 | 2003-07-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-07-17 | 2007-01-16 | 2007-07-18 | $7700.00 | Window Closed / Lapsed |