US5068267A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device encapsulant consisting of epoxy resin composition
Assignee: Toshiba Corp
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Filing: 1989-09-12
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Granted: 1991-11-26
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Expires: 2009-09-12
Abstract
Abstract An encapsulant consisting of an epoxy resin composition and suitably used to encapsulate a semiconductor device which is to be surface-mounted contains (a) an epoxy resin, (b) a rubber-modified phenolic resin comprising a phenolic resin, and a methylmethacrylate-butadiene-styrene copolymer and a thermosetting silicon rubber dispersed in said phenolic resin, (c) a curing accelerator, and (d) a silica powder.
Inventors
- 👤 Ken Uchida
- 👤 Michiya Higashi
- 👤 Naoko Kihara
- 👤 Hiroshi Shimozawa
- 👤 Akira Yoshizumo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:32
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; C; C08; C08G; C08G59/00; C08G59/18; C08G59/20; C08G59/32; C08G59/3218; C08K; C08K3/00; C08K3/34; C08K3/36; C08L; C08L51/00; C08L51/04; C08L61/00; C08L61/04; C08L63/00; C08L83/00; C08L2201/00; C08L2201/02; C08L2203/00; C08L2203/20; C08L2203/206
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
134 words
A semiconductor device encapsulant consisting of an epoxy resin composition, comprising: (a) an epoxy resin; (b) a rubber-modified phenolic resin comprising a phenolic resin, and 0.1 to 7 wt. % of a graft copolymer of metharcylate and styrene onto a styrene-butadiene copolymer or butadiene polymer, and 0.1 to 5 wt. % of a thermosetting silicone rubber dispersed in said phenolic resin, where the total content of these modifiers is 0.2 to 10 wt. % with respect to the entire encapsulant, (c) a curing accelerator; and (d) 50 to 90 wt % of a silica powder with respect to the entire encapsulant, where said rubber-modified phenolic resin and epoxy resin are mixed such that the equivalent weight ratio between a phenolic hydroxyl group and an epoxy group falls within the range of 0.5 to 1.5.
Claim 2
Dependent Claim
134 words
A semiconductor device encapsulant consisting of an epoxy resin composition, comprising: (a) an epoxy resin; (b) a rubber-modified phenolic resin comprising a phenolic resin, and 0.1 to 7 wt. % of a graft copolymer of metharcylate and styrene onto a styrene-butadiene copolymer or butadiene polymer, and 0.1 to 5 wt. % of a thermosetting silicone rubber dispersed in said phenolic resin, where the total content of these modifiers is 0.2 to 10 wt. % with respect to the entire encapsulant, (c) a curing accelerator; and (d) 50 to 90 wt % of a silica powder with respect to the entire encapsulant, where said rubber-modified phenolic resin and epoxy resin are mixed such that the equivalent weight ratio between a phenolic hydroxyl group and an epoxy group falls within the range of 0.5 to 1.5.
Claim 3
Dependent Claim
16 words
An encapsulant according to claim 1, wherein the epoxy resin is a polyfunctional heat-resistant epoxy compound.
Claim 4
Dependent Claim
44 words
An encapsulant according to claim 1, wherein the rubber-modified phenolic resin contains 0.2 to 5 wt % of the graft copolymer and 0.2 to 3 wt % of the thermosetting silicone rubber, the total content of these modifiers being 0.5 to 6 wt %.
Claim 5
Dependent Claim
36 words
An encapsulant according to claim 1, wherein 0.01 to 10 wt % of the curing accelerator is contained with respect to a total weight of the epoxy resin, the rubber-modified phenolic resin, and the curing accelerator.
Claim 6
Dependent Claim
24 words
An encapsulant according to claim 1, wherein the silica powder contains not more than 1 ppb of a total content of U and Th.
Claim 7
Dependent Claim
20 words
An encapsulant according to claim 1, further comprising a mold lubricant, a fire retardant, a colorant, and a coupling agent.
Claim 8
Dependent Claim
33 words
A rubber-modified phenolic resin comprising: a phenolic resin; and a graft copolymer of methylmethacrylate and styrene onto a butadiene polymer or styrene-butadiene copolymer and a thermosetting silicone rubber dispersed in the phenolic resin.
Claim 9
Dependent Claim
33 words
A rubber-modified phenolic resin comprising: a phenolic resin; and a graft copolymer of methylmethacrylate and styrene onto a butadiene polymer or styrene-butadiene copolymer and a thermosetting silicone rubber dispersed in the phenolic resin.
Claim 10
Dependent Claim
45 words
A resin according to claim 7, containing 1 to 100 wt % of the methylmethacrylate-butadiene-styrene copolymer and 1 to 80 wt % of the thermosetting silicone rubber, a total content of these modifiers being 2 to 160 wt % with respect to the phenolic resin.
Claim 11
Dependent Claim
45 words
A resin according to claim 8, containing 2 to 60 wt % of the graft copolymer and 2 to 50 wt % of the thermosetting silicone rubber, the total content of these modifiers being 4 to 100 wt % with respect to the phenolic resin.
Claim 12
Dependent Claim
22 words
A resin according to claim 7, further comprising 0.1 to 10 wt % of a surfactant with respect to the phenolic resin.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-11-25 | 1995-05-27 | 1995-11-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-11-25 | 1999-05-27 | 1999-11-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-11-25 | 2003-05-27 | 2003-11-26 | $7700.00 | Window Closed / Lapsed |