US4904761A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resin composition for sealing semiconductors
Assignee: Mitsui Toatsu Chemicals Inc
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Filing: 1988-11-22
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Granted: 1990-02-27
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Expires: 2008-11-22
Abstract
Abstract A semiconductor sealing resin composition which comprises (a) a modified epoxy resin which is a graft copolymer of a epoxy resin and a vinyl polymer having dispersed therein a silicone rubber with an average particle diameter less than 1.0μ; (b) a curing agent; and (c) an inorganic filler. The sealing composition has a low elastic modulus, a low heat expansion coefficient, a high resistance to heat and a high resistance to thermal expansion.
Inventors
- 👤 Yuji Okitsu
- 👤 Koichi Machida
- 👤 Motoyuki Torikai
- 👤 Junko Tsuji
- 👤 Kotaro Asahina
- 👤 Kazuya Shinkoda
- 👤 Takayuki Kubo
- 👤 Mikio Kitahara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:42
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W74/476; C; C09; C09J; C09J151/00; C09J151/08; C08; C08L; C08L2666/00; C08L2666/02; C08L2666/14
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
52 words
A semiconductor sealing resin composition which comprises; (a) a modified epoxy resin which is a graft copolymer of a epoxy resin and a vinyl polymer, said modified epoxy resin having dispersed therein a silicone rubber with an average particle diameter less than 1.0μ; (b) a curing agent; and (c) an inorganic filler.
Claim 2
Dependent Claim
52 words
A semiconductor sealing resin composition which comprises; (a) a modified epoxy resin which is a graft copolymer of a epoxy resin and a vinyl polymer, said modified epoxy resin having dispersed therein a silicone rubber with an average particle diameter less than 1.0μ; (b) a curing agent; and (c) an inorganic filler.
Claim 3
Dependent Claim
14 words
The composition of claim 1 wherein the composition further comprises a non-modified epoxy resin.
Claim 4
Dependent Claim
22 words
The composition of claim 1 wherein the epoxy resin in (a) is a phenol novolac epoxy resin or a novolac epoxy resin.
Claim 5
Dependent Claim
25 words
The composition of claim 1 wherein the graft copolymer in (a) is prepared by polymerizing a vinyl monomer in the presence of the epoxy resin.
Claim 6
Dependent Claim
29 words
The composition of claim 4 wherein the amount of the vinyl monomer is from about 1 to about 50 parts to 100 parts of the epoxy resin by weight.
Claim 7
Dependent Claim
26 words
The composition of claim 4 wherein the epoxy resin contains a polymerizable double bond or a graft polymerizable bond prior to reaction with the vinyl monomer.
Claim 8
Dependent Claim
48 words
The composition of claim 1 wherein the silicone rubber is prepared by addition reaction of a silation reaction between a vinyl-modified silicone polymer which has at least one vinyl group within the molecule and a hydrogen-modified silicone polymer which has at least two active hydrogens within the molecule.
Claim 9
Dependent Claim
26 words
The composition of claim 7 wherein the ratio by weight of the vinyl-modified silicone polymer to the hydrogen-modified silicone polymer is from about 0.1:10 to 10:0.1.
Claim 10
Dependent Claim
17 words
The composition of claim 1 wherein the particle diameter of the silicone polymer is less than 0.5μ.
Claim 11
Dependent Claim
17 words
The composition of claim 1 wherein the particle diameter of the silicone polymer is more than 0.01μ.
Claim 12
Dependent Claim
28 words
The composition of claim 1 wherein the amount of the silicone rubber is 5 to 50% by weight of the total amount of epoxy resin in the composition.
Claim 13
Dependent Claim
29 words
The composition of claim 1 wherein the amount of the silicone rubber is 10 to 20% by weight of the total amount of the epoxy resin in the composition.
Claim 14
Dependent Claim
14 words
The composition of claim 1 wherein the curing agent is a novolac phenolic resin.
Claim 15
Dependent Claim
15 words
The composition of claim 1 wherein the inorganic filler is crystalline silica or fused silica.
Claim 16
Dependent Claim
23 words
The composition of claim 1 wherein the amount of curing agent is about 0.1 to 10 the stoichiometric amount of the epoxy groups.
Claim 17
Dependent Claim
30 words
The composition of claim 1 wherein the amount of the inorganic filler is about 200 to 800 parts by weight to 100 parts by weight of the modified epoxy resin.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-02-26 | 1993-08-28 | 1994-02-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-02-26 | 1997-08-28 | 1998-02-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-02-26 | 2001-08-28 | 2002-02-27 | $7700.00 | Window Closed / Lapsed |