Epoxy resin composition for encapsulating semiconductor

Claim 2

An epoxy resin composition for encapsulating semiconductors, comprising: (a) 100 parts by weight of at least one glycidyl ether epoxy resin selected from the group consisting of phenolic novolak epoxy resin and cresol novolak epoxy resin; (b) 2-20 parts by weight of at least one styrene block copolymer selected from the group consisting of block copolymers formed from styrene polymer and aliphatic polymer block; (c) 2-30 parts by weight of at least one liquid rubber selected from the group consisting of low molecular weight butadiene polymer, low molecular weight isoprene polymer, liquid chloroprene rubber, liquid silicone rubber and liquid polysulfide rubber; (d) an amount of at least one hardener selected from the group consisting of phenolic resins, polyhydric phenolic compounds, acid anhydrides and polysulfide resins sufficient to make the ratio of the number of active groups of the at least one hardener to the number of epoxy groups of the at least one glycidyl ether epoxy resin be in the range of 0.5-1.5; and (e) 60-80% by weight, based on the total weight of the composition, of at least one inorganic filler.

Claim 3

The epoxy resin composition according to claim 1, wherein the at least one glycidyl ether epoxy resin has at least two epoxy groups in each molecule.

Claim 4

The epoxy resin composition according to claim 1, wherein the at least one glycidyl ether epoxy resin has a chlorine ion content of not more than 10 ppm.

Claim 5

The epoxy resin composition according to claim 1, wherein the at least one glycidyl ether epoxy resin has a hydrolyzable chlorine content of not more than 0.1% by weight.

Claim 6

The epoxy resin composition according to claim 1, wherein the styrene polymer comprises a polymer selected from the group consisting of styrene polymer, α-methylstyrene polymer, vinyl toluene polymer, divinylbenzene polymer and t-butylstyrene polymer.

Claim 7

The epoxy resin composition according to claim 1, wherein the aliphatic polymer block comprises a polymer block selected from the group consisting of butadiene, isoprene and ethylene-butylene.

Claim 8

The epoxy resin composition according to claim 1, wherein the at least one styrene block copolymer has a taper structure.

Claim 9

The epoxy resin composition according to claim 1, wherein the at least one styrene block copolymer is selected from the group consisting of linear block copolymers, star block copolymers, and double star block copolymers.

Claim 10

The epoxy resin composition according to claim 1, wherein the at least one styrene block copolymer is selected from the group consisting of styrene-butadiene block copolymer, styrene-ethylene butylene block copolymer and styrene-isoprene block copolymer.

Claim 11

The epoxy resin composition according to claim 1, wherein the at least one styrene block copolymer has an aliphatic polymer block content of from 10-90% by weight.

Claim 12

The epoxy resin composition according to claim 1, wherein the at least one styrene block copolymer has an aliphatic polymer block content of from 50-90% by weight.

Claim 13

The epoxy resin composition according to claim 1, wherein the at least one hardener comprises a novolak phenolic resin.

Claim 14

The epoxy resin composition according to claim 12, wherein the novolak phenolic resin is selected from the group consisting of phenolic novolak resin, cresol novolak resin and tert-butyl phenolic novolak resin.

Claim 15

The epoxy resin composition according to claim 12, wherein the novolak phenolic resin has a softening point of 60°-100° C. and a water-soluble component content of not more than 3% by weight.

Claim 16

The epoxy resin composition according to claim 1, wherein the at least one hardener comprises a polyhydric phenolic compound selected from the group consisting of resol phenolic resin and bisphenol A.

Claim 17

The epoxy resin composition according to claim 1, wherein the at least one hardener comprises an acid anhydride selected from the group consisting of phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, pyromellitic anhydride and dodecylsuccinic anhydride.

Claim 18

The epoxy resin composition according to claim 1, wherein the at least one inorganic filler is selected from the group consisting of zirconium oxide, alpha quartz, molten silica, clay, alumina, aluminum hydroxide, calcium carbonate, glass, asbestos, whisker, gypsum, magnesite, mica, kaoline, talc, graphite, cement, iron carbonyl, ferrite, molybdenum disulfide, zinc white, titanium white, carbon black, quartz sand and wallastonite.

Claim 19

The epoxy resin composition according to claim 17, wherein the at least one inorganic filler comprises a molten silica.

Claim 20

The epoxy resin composition according to claim 1, wherein 5-15 parts by weight of the at least one styrene block copolymer per 100 parts by weight of the at least one glycidyl ether epoxy resin is contained in the composition.

Claim 21

The epoxy resin composition according to claim 1, wherein the at least one hardener is contained in the composition in an amount sufficient to make the ratio of the number of active groups of the at least one hardener to the number of epoxy groups of the at least one glycidyl ether epoxy resin be in the range of 0.8-1.2.

Claim 22

An epoxy resin composition for encapsulating semiconductors, consisting essentially of: (a) 100 parts by weight of at least one glycidyl ether epoxy resin selected from the group consisting of phenolic novolak epoxy resin and cresol novolak epoxy resin; (b) 2-20 parts by weight of at least one styrene block copolymer selected from the group consisting of block copolymers formed from styrene polymer and aliphatic polymer block; (c) 2-30 parts by weight of at least one liquid rubber selected from the group consisting of low molecular weight butadiene polymer, low molecular weight isoprene polymer, liquid chloroprene rubber, liquid silicone rubber and liquid polysulfide rubber; (d) an amount of at least one hardener selected from the group consisting of phenolic resins, polyhydric phenolic compounds, acid anhydrides and polysulfide resins sufficient to make the ratio of the number of active groups of the at least one hardener to the number of epoxy groups of the at least one glycidyl ether epoxy resin be in the range of 0.5-1.5; and (e) 60-80% by weight, based on the total weight of the composition, of at least one inorganic filler.

Claim 23

An epoxy resin composition for encapsulating semiconductors, consisting essentially of: (a) 100 parts by weight of at least one glycidyl ether epoxy resin selected from the group consisting of phenolic novolak epoxy resin and cresol novolak epoxy resin; (b) 2-20 parts by weight of at least one styrene block copolymer selected from the group consisting of block copolymers formed from styrene polymer and aliphatic polymer block; (c) 2-30 parts by weight of at least one liquid rubber selected from the group consisting of low molecular weight butadiene polymer, low molecular weight isoprene polymer, liquid chloroprene rubber, liquid silicone rubber and liquid polysulfide rubber; (d) an amount of at least one hardener selected from the group consisting of phenolic resins, polyhydric phenolic compounds, acid anhydrides and polysulfide resins sufficient to make the ratio of the number of active groups of the at least one hardener to the number of epoxy groups of the at least one glycidyl ether epoxy resin be in the range of 0.5-1.5; and (e) 60-80% by weight, based on the total weight of the composition, of at least one inorganic filler.

Claim 24

The epoxy resin composition according to claim 21, wherein the at least one glycidyl ether epoxy resin has at least two epoxy groups in each molecule.

Claim 25

The epoxy resin composition according to claim 21, wherein the at least one glycidyl ether epoxy resin has a chlorine ion content of not more than 10 ppm.

Claim 26

The epoxy resin composition according to claim 21, wherein the at least one glycidyl ether epoxy resin has a hydrolyzable chlorine content of not more than 0.1% by weight.

Claim 27

The epoxy resin composition according to claim 21, wherein the styrene polymer comprises a polymer selected from the group consisting of styrene polymer, -methylstyrene polymer, vinyl toluene polymer, divinylbenzene polymer and t-butylstyrene polymer.

Claim 28

The epoxy resin composition according to claim 21, wherein the aliphatic polymer block comprises a polymer block selected from the group consisting of butadiene, isoprene and ethylene-butylene.

Claim 29

The epoxy resin composition according to claim 21, wherein the at least one block copolymer has a taper structure.

Claim 30

The epoxy resin composition according to claim 21, wherein the at least one styrene block copolymer is selected from the group consisting of linear block copolymers, star block copolymers, and double star block copolymers.

Claim 31

The epoxy resin composition according to claim 21, wherein the at least one styrene block copolymer is selected from the group consisting of styrene-butadiene block copolymer, styrene-ethylene butylene block copolymer and styrene-isoprene block copolymer.

Claim 32

The epoxy resin composition according to claim 21, wherein the at least one styrene block copolymer has an aliphatic polymer block content of from 10-90% by weight.

Claim 33

The epoxy resin composition according to claim 21, wherein the at least one styrene block copolymer has an aliphatic polymer block content of from 50-90% by weight.

Claim 34

The epoxy resin composition according to claim 21, wherein the low molecular weight butadiene polymer is selected from the group consisting of low molecular weight 1,2-polybutadiene, 1,3-polybutadiene, 1,4-polybutadiene, butadiene-styrene copolymer and butadiene-acrylonitrile copolymer.

Claim 35

The epoxy resin composition according to claim 21, wherein the low molecular weight isoprene polymer is selected from the group consisting of low molecular weight polyisoprene and low molecular weight depolymerized rubber of natural rubber.

Claim 36

The epoxy resin composition according to claim 21, wherein the at least one liquid rubber has on its ends at least one reactive group selected from the group consisting of epoxy, hydroxyl, amino, thiol, carboxyl and vinyl.

Claim 37

The epoxy resin composition according to claim 21, wherein the at least one liquid rubber is selected from the group consisting of end carboxyl butadiene-acrylonitrile copolymer, end epoxidized 1,4-polybutadiene and end carboxyl 1,2-polybutadiene.

Claim 38

The epoxy resin composition according to claim 21, wherein the at least one hardener comprises a novolak phenolic resin.

Claim 39

The epoxy resin composition according to claim 36, wherein the novolak phenolic resin is selected from the group consisting of phenolic novolak resin, cresol novolak resin and tert-butyl phenolic novolak resin.

Claim 40

The epoxy resin composition according to claim 36, wherein the novolak phenolic resin has a softening point of 60°-100° C. and a water-soluble component content of not more than 3% by weight.

Claim 41

The epoxy resin composition according to claim 21, wherein the at least one hardener comprises a polyhydric phenolic compound selected from the group consisting of resol phenolic resin and bisphenol A.

Claim 42

The epoxy resin composition according to claim 21, wherein the at least one hardener comprises an acid anhydride selected from the group consisting of phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, pyromellitic anhydride and dodecylsuccinic anhydride.

Claim 43

The epoxy resin composition according to claim 21, wherein the at least one inorganic filler is selected from the group consisting of zirconium oxide, alpha quartz, molten silica, clay, alumina, aluminum hydroxide, calcium carbonate, glass, asbestos, whisker, gypsum, magnesite, mica, kaoline, talc, graphite, cement, iron carbonyl, ferrite, molybdenum disulfide, zinc white, titanium white, carbon black, quartz sand and wallastonite.

Claim 44

The epoxy resin composition according to claim 41, wherein the at least one inorganic filler comprises a molten silica.

Claim 45

The epoxy resin composition according to claim 21, wherein the total amount of the at least one styrene block copolymer and the at least one liquid rubber contained in the composition is from 5-40 parts by weight per 100 parts by weight of the at least one glycidyl ether epoxy resin.

Claim 46

The epoxy resin composition according to claim 21, wherein the at least one liquid rubber is contained in the composition in an amount of 5-20 parts by weight per 100 parts by weight of the at least one glycidyl ether epoxy resin.

Claim 47

The epoxy resin composition according to claim 21, wherein the at least one styrene block copolymer is contained in the composition in an amount of 5-15 parts by weight per 100 parts by weight of the at least one glycidyl ether epoxy resin.

Claim 48

The epoxy resin composition according to claim 21, wherein the at least one styrene block copolymer and the at least one liquid rubber are contained in the composition in amounts of 5-15 parts by weight and 5-20 parts by weight per 100 parts by weight of the at least one glycidyl ether epoxy resin, respectively.

Claim 49

The epoxy resin composition according to claim 21, wherein the at least one hardener is contained in the composition in an amount sufficient to make the ratio of the number of active groups of the at least one hardener to the number of epoxy groups of the at least one glycidyl ether epoxy resin to be in the range of 0.8-1.2.