Semiconductor device

Abstract

Abstract PURPOSE:To improve the moisture resistance and the thermal shock resistance, by applying particles of the rubber kind to nuclei whose outside is covered with the polymerized resin composed of unsaturated monomer, making the particles thus obtained dispersed phase and making epoxy resin continuous phase. CONSTITUTION:Particles of the rubber kind is applied to nuclei whose outside is covered with polymerized resin as the outer layer. This resin is composed of the unsaturated monomer having the unsaturated double bond whose glass transition temperature becomes higher than 70 deg.C. Sealing is performed with the resin composition composed of the above corpuscles of dispersed phase and epoxy resin of continuous phase. The diameter of particle of the rubber kind which is preferably employed is 0.05-10mum. The material for the particle, the following kinds of rubber are used; polybutadiene latex, stylene butadiene copolymer latex, acrylonitrile-butadiene copolymer latex, etc. and these kinds of rubber containing the components which constitute the crosslinking point in rubber. For epoxy resin, the usual ones such as cresol novolac type, phenol novolac type and bisphenol A-type are used. Thus, the excellent moisture resistance and the thermal shock resistance are obtained.

Inventors

• 👤 Yoshinobu Nakamura
• 👤 吉伸 中村
• 👤 Haruo Tabata
• 👤 田畑　晴夫

Bibliographic Details