EP0384774A2
Expired / Lapsed
EP
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Semiconductor device encapsulant
Assignee: Toshiba Corp
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Filing: 1990-02-23
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Granted: —
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Expires: 2010-02-23
Abstract
Abstract A semiconductor device encapsulant contains (a) a thermosetting resin for providing a cured product having a glass transition temperature of not less than 190°C, (b) a filler consisting of a fused silica, (c) a modifier consisting of an MBS or ABS, (d) a modifier consisting of a silicone rubber or a silicone gel, and (e) a lubricant containing a metal chelate compound.
Inventors
- 👤 Ken C/O Intellectual Property Div. Uchida
- 👤 Shinetsu C/O Intellectual Property Div. Fujieda
- 👤 Michiya C/O Intellectual Property Div. Higashi
- 👤 Hiroshi C/O Intellectual Property Di Shimozawa
- 👤 Akira C/O Intellectual Property Di Yoshizumi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 15:32
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; C; C08; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/4007; C08G59/4014; C08G59/4042; C08L; C08L63/00; H10W74/473; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31511; Y10T428/31721
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
62 words
A semiconductor device encapsulant comprising: (a) a thermosetting resin for providing a cured product having a glass transition temperature of not less than 190°C; (b) a filler consisting of a fused silica; (c) a modifier consisting of an MBS or ABS; (d) a modifier consisting of a silicone rubber or a silicone gel; and (e) a lubricant containing a metal chelate compound.
Claim 2
Dependent Claim
62 words
A semiconductor device encapsulant comprising: (a) a thermosetting resin for providing a cured product having a glass transition temperature of not less than 190°C; (b) a filler consisting of a fused silica; (c) a modifier consisting of an MBS or ABS; (d) a modifier consisting of a silicone rubber or a silicone gel; and (e) a lubricant containing a metal chelate compound.
Claim 3
Dependent Claim
21 words
An encapsulant according to claim 1, characterized in that said thermosetting resin consists of an epoxy resin and a curing agent.
Claim 4
Dependent Claim
13 words
An encapsulant according to claim 2, characterized by further comprising a curing accelerator.
Claim 5
Dependent Claim
30 words
An encapsulant according to claim 2, characterized in that said curing agent is contained in an amount of 0.5 to 1.5 equivalent weight per equivalent weight of said epoxy resin.
Claim 6
Dependent Claim
36 words
An encapsulant according to claim 3, characterized in that said curing accelerator is contained in an amount of 0.1 to 5 wt% with respect to a total amount of said epoxy resin and said curing agent.
Claim 7
Dependent Claim
16 words
An encapsulant according to claim 1, characterized in that said thermosetting resin is a maleimide resin.
Claim 8
Dependent Claim
21 words
An encapsulant according to claim 6, characterized in that said maleimide resin is hot-melt-mixed to be prepolymerized together with an amine.
Claim 9
Dependent Claim
13 words
An encapsulant according to claim 7, characterized by further comprising a curing accelerator.
Claim 10
Dependent Claim
27 words
An encapsulant according to claim 7, characterized in that said amine is contained in an amount of 0.2 to 0.8 mol per mol of said maleimide resin.
Claim 11
Dependent Claim
34 words
An encapsulant according to claim 9, characterized by further comprising an epoxy resin in an amount of 5 to 50 wt% with respect to a total amount of said maleimide resin and said amine.
Claim 12
Dependent Claim
34 words
An encapsulant according to claim 9, characterized by further comprising an organic phosphine in an amount of 0.1 to 10 wt% with respect to a total amount of said maleimide resin and said amine.
Claim 13
Dependent Claim
22 words
An encapsulant according to claim 1, characterized in that said fused silica is contained in an amount of 65 to 90 wt%.
Claim 14
Dependent Claim
23 words
An encapsulant according to claim 1, characterized in that said MBS or ABS is contained in an amount of 0.1 to 10 wt%.
Claim 15
Dependent Claim
25 words
An encapsulant according to claim 1, characterized in that said silicone rubber or silicone gel is contained in an amount of 0.1 to 5 wt%.
Claim 16
Dependent Claim
30 words
An encapsulant according to claim 1, characterized in that said MBS or ABS and said silicone rubber or silicone gel is hot-melt-mixed beforehand together with components of said thermosetting resin.
Claim 17
Dependent Claim
26 words
An encapsulant according to claim 1, characterized in that said lubricant containing the metal chelate compound is contained in an amount of 0.01 to 3 wt%.
Claim 18
Dependent Claim
23 words
An encapsulant according to claim 1, characterized by further comprising 0.2 to 5 wt% of an antimony trioxide as a fire retardant assistant.
Claim 19
Dependent Claim
20 words
An encapsulant according to claim 1, characterized by further comprising a coupling agent, a fire retardant agent, and a pigment.
Claim 20
Dependent Claim
16 words
A resin-encapsulated semiconductor device comprising a semiconductor pellet resin-encapsulated by an encapsulant according to claim 1.
References Cited (Backward Citations)
No citation records indexed.
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