High capacitance multi-level storage node for high density TFT load SRAMs with low soft error rates

Claim 2

An SRAM cell, comprising: a substrate; a capacitor formed in the substrate; a first diffusion area in the substrate adjacent the capacitor; a first gate node contacting the capacitor; a second diffusion area in the substrate spaced from the first diffusion area; a second gate node disposed above and electrically isolated from the first and second diffusion areas; a third gate node disposed above and electrically isolated from the second diffusion area; a contact contacting the second diffusion area and electrically isolated from the first and second gate nodes; a first insulator layer on the first, second and third gate nodes, the contact and the exposed surface of the substrate; a polysilicon gate layer formed on the first insulator layer; a polysilicon body disposed above and electrically isolated from the polysilicon gate layer; a single contact electrically connecting the capacitor to each of the first diffusion area, the first gate node, the polysilicon gate layer and the polysilicon body, thereby forming a latch node of the cell.

Claim 3

The SRAM cell of claim 1, wherein the substrate has an upper surface and the single contact is vertically disposed with respect to the upper surface of the substrate.

Claim 4

The SRAM cell of claim 2, wherein the second trench is lined with a diffusion barrier layer.

Claim 5

The SRAM cell of claim 1, wherein the capacitor comprises: a trench formed in the substrate; a dielectric material lining the trench; a plate material in the trench.

Claim 6

The SRAM of claim 1, wherein the gate layer is a thin film transistor gate layer, and the body is a thin film body.

Claim 7

The SRAM cell of claim 1 further comprising a LOCOS isolation region in the substrate adjacent the capacitor but not contacting the first diffusion area.

Claim 8

An SRAM cell, comprising: a substrate; a first insulator layer on the surface of the substrate; a trench capacitor formed in the substrate; a first diffusion area in the substrate adjacent the trench capacitor; a first gate node on the first insulator layer and disposed above the trench capacitor; a second diffusion area in the substrate spaced from the first diffusion area; a second gate node on the first insulator layer and disposed above the surface of the substrate contacting the first and second diffusion areas; a third gate node on the first insulator layer and disposed above the surface of the substrate contacting the second diffusion area; a contact contacting the second diffusion area and electrically isolated from the first and second gate nodes; a second insulator layer on the first, second and third gate nodes, the contact and the exposed surface of the substrate; a polysilicon gate layer formed on the insulator layer; a third insulator layer on the gate layer; a polysilicon body formed on the third insulator layer and disposed above the gate layer; a contact electrically connecting the trench capacitor node to each of the first diffusion area, the first gate node, the gate layer and the body.

Claim 9

An SRAM cell, comprising: a substrate; a first insulator layer on the surface of the substrate; a trench capacitor formed in the substrate; a first diffusion area in the substrate adjacent the trench capacitor; a first gate node on the first insulator layer and disposed above the trench capacitor; a second diffusion area in the substrate spaced from the first diffusion area; a second gate node on the first insulator layer and disposed above the surface of the substrate contacting the first and second diffusion areas; a third gate node on the first insulator layer and disposed above the surface of the substrate contacting the second diffusion area; a contact contacting the second diffusion area and electrically isolated from the first and second gate nodes; a second insulator layer on the first, second and third gate nodes, the contact and the exposed surface of the substrate; a polysilicon gate layer formed on the insulator layer; a third insulator layer on the gate layer; a polysilicon body formed on the third insulator layer and disposed above the gate layer; a contact electrically connecting the trench capacitor node to each of the first diffusion area, the first gate node, the gate layer and the body.

Claim 10

The SRAM cell of claim 7, wherein the contact is vertically disposed.

Claim 11

The SRAM cell of claim 8, wherein the contact is disposed in a second trench, and wherein the second trench is lined with a diffusion barrier layer.

Claim 12

The SRAM cell of claim 8, further comprising a LOCOS isolation region in the substrate adjacent the capacitor but not contacting the first diffusion area.

Claim 13

An SRAM cell, comprising: a substrate; a first diffusion area in the substrate; a first gate node disposed above and electrically isolated from the first diffusion area; a second diffusion area in the substrate spaced from the first diffusion area; a second gate node disposed above and electrically isolated from the first and second diffusion areas; a third gate node disposed above and electrically isolated from the second diffusion area; a contact on the second diffusion area and electrically isolated from the first and second gate nodes; a gate layer above and electrically isolated from the first and second gate nodes; a body disposed above and electrically isolated from the gate layer; a single contact electrically connecting the first diffusion area, the first gate node, the gate layer and the body, the single contact substantially surrounded by means for preventing diffusion between elements in contact with the contact, and for preserving the polarity of the elements.

Claim 14

An SRAM cell, comprising: a substrate; a first diffusion area in the substrate; a first gate node disposed above and electrically isolated from the first diffusion area; a second diffusion area in the substrate spaced from the first diffusion area; a second gate node disposed above and electrically isolated from the first and second diffusion areas; a third gate node disposed above and electrically isolated from the second diffusion area; a contact on the second diffusion area and electrically isolated from the first and second gate nodes; a gate layer above and electrically isolated from the first and second gate nodes; a body disposed above and electrically isolated from the gate layer; a single contact electrically connecting the first diffusion area, the first gate node, the gate layer and the body, the single contact substantially surrounded by means for preventing diffusion between elements in contact with the contact, and for preserving the polarity of the elements.

Claim 15

The cell of claim 11, further comprising means for introducing a capacitance between the single contact and ground, whereby to improve the stability of the cell.

Claim 16

The cell of claim 11, wherein the single contact is vertically disposed.

Claim 17

The cell of claim 12, wherein the means for introducing a capacitance comprises a capacitor disposed between the single contact and ground.

Claim 18

The cell of claim 14, wherein the capacitor lies in a trench in the substrate between the single contact and ground.

Claim 19

The cell of claim 11, wherein the diffusion preventing means comprises a diffusion barrier layer surrounding the contact.