Structure for cooling an integrated circuit

Claim 2

A structure for cooling an integrated circuit (IC), comprising: a printed circuit board; an IC mounted on said printed circuit board; a cold plate provided on said printed circuit board; a hollow cylindrical member mounted on said cold plate; a heat conductor comprising a hollow cylindrical portion and a flat portion closing one end of said hollow cylindrical portion, said hollow cylindrical portion being inserted in said hollow cylindrical member while said flat portion connected to a top surface of said IC; an elastic material injected into a gap between said hollow cylindrical member and said heat conductor to movably hold said heat conductor on said hollow cylindrical member such that said elastic material will compensate for irregularities of the mounting of said IC on said printed circuit board, wherein said hollow cylindrical member, said heat conductor, and said elastic material form a receptacle, and said elastic material prevents a coolant from flowing outside said receptacle; and a passageway formed in said cold plate for feeding said coolant into said heat conductor.

Claim 3

A structure for cooling an IC, comprising: a printed circuit board; an IC mounted on said printed circuit board; a cold plate provided on said printed circuit board; a passageway formed in said cold plate for causing coolant to flow therethrough; a hole formed in said cold plate and communicating to said passageway; a cylindrical flange surrounding said hole; a heat conductor inserted into said cylindrical flange and connected to said IC; an elastic material injected into a gap between said cylindrical flange and said heat conductor to movably hold said heat conductor on said cold plate such that said elastic material will compensate for irregularities of the mounting of said IC on said printed circuit board, and said elastic material prevents said coolant from flowing outside said cold plate.

Claim 4

A structure for cooling an IC, comprising: a printed circuit board; an IC mounted on said printed circuit board; a cold plate provided on said printed circuit board; a passageway formed in said cold plate for causing coolant to flow therethrough; a hole formed in said cold plate and communicating to said passageway; a cylindrical flange surrounding said hole; a heat conductor inserted into said cylindrical flange and connected to said IC; an elastic material injected into a gap between said cylindrical flange and said heat conductor to movably hold said heat conductor on said cold plate such that said elastic material will compensate for irregularities of the mounting of said IC on said printed circuit board, and said elastic material prevents said coolant from flowing outside said cold plate.

Claim 5

A structure as claimed in claim 2, wherein said heat conductor is provided with fins.

Claim 6

A structure as claimed in claim 2, wherein said passageway comprises a first passageway in which said hole is formed, and a second passageway in which a nozzle is fitted for jetting said coolant toward said heat conductor.

Claim 7

A structure as claimed in claim 4, wherein said heat conductor comprises a recess facing said passageway.

Claim 8

A structure for cooling an IC, comprising: a printed circuit board; an IC mounted on said printed circuit board; a cold plate provided on said printed circuit board; a passageway formed in said cold plate for causing coolant to flow therethrough; a hole formed in said cold plate and communicating to said passageway; a heat conductor connected to said IC and having a flange extending out from its periphery; an injected elastic bonding material bonded in a gap between said cold plate and said flange of said heat conductor to movably hold said heat conductor on said cold plate such that said elastic material will compensate for irregularities of the mounting of said IC on said printed circuit board, and said elastic material prevents said coolant from flowing outside said cold plate.

Claim 9

A structure for cooling an IC, comprising: a printed circuit board; an IC mounted on said printed circuit board; a cold plate provided on said printed circuit board; a passageway formed in said cold plate for causing coolant to flow therethrough; a hole formed in said cold plate and communicating to said passageway; a heat conductor connected to said IC and having a flange extending out from its periphery; an injected elastic bonding material bonded in a gap between said cold plate and said flange of said heat conductor to movably hold said heat conductor on said cold plate such that said elastic material will compensate for irregularities of the mounting of said IC on said printed circuit board, and said elastic material prevents said coolant from flowing outside said cold plate.

Claim 10

A structure-as claimed in claim 6, wherein said heat conductor is provided with fins.

Claim 11

A structure as claimed in claim 6, wherein said passageway comprises a first passageway in which said hole is formed, and a second passageway in which a nozzle is fitted for jetting said coolant toward said heat conductor.

Claim 12

A structure for cooling an IC, comprising: a printed circuit board; an IC mounted on said printed circuit board; a cold plate provided on said printed circuit board; a first passageway formed in said cold plate for causing a coolant to flow therethrough; a second passageway formed in said cold plate for causing said coolant to flow therethrough; a hole formed in said cold plate and communicating to said second passageway; a hollow cylindrical member mounted on said cold plate so as to surround said hole; a heat conductor comprising a hollow cylindrical portion and a flat portion closing one end of said hollow cylindrical portion, said hollow cylindrical portion being inserted in said hollow cylindrical member while said flat portion is connected to a top surface of said IC; an elastic material injected into a gap between said hollow cylindrical member and said heat conductor to movably hold said heat conductor on said hollow cylindrical member such that said elastic material will compensate for irregularities of the mounting of said IC on said printed circuit board, wherein said hollow cylindrical member, said heat conductor, and said elastic material form a receptacle, and said elastic material prevents said coolant from flowing outside said receptacle; and a nozzle for jetting the said coolant flowing through said first passageway into said heat conductor.

Claim 13

A structure for cooling an IC, comprising: a printed circuit board; an IC mounted on said printed circuit board; a cold plate provided on said printed circuit board; a first passageway formed in said cold plate for causing a coolant to flow therethrough; a second passageway formed in said cold plate for causing said coolant to flow therethrough; a hole formed in said cold plate and communicating to said second passageway; a hollow cylindrical member mounted on said cold plate so as to surround said hole; a heat conductor comprising a hollow cylindrical portion and a flat portion closing one end of said hollow cylindrical portion, said hollow cylindrical portion being inserted in said hollow cylindrical member while said flat portion is connected to a top surface of said IC; an elastic material injected into a gap between said hollow cylindrical member and said heat conductor to movably hold said heat conductor on said hollow cylindrical member such that said elastic material will compensate for irregularities of the mounting of said IC on said printed circuit board, wherein said hollow cylindrical member, said heat conductor, and said elastic material form a receptacle, and said elastic material prevents said coolant from flowing outside said receptacle; and a nozzle for jetting the said coolant flowing through said first passageway into said heat conductor.

Claim 14

A structure for cooling an IC, comprising: a printed circuit board; an IC mounted on said printed circuit board; a cold plate provided on said printed circuit board; a first passageway formed in said cold plate for causing a coolant to flow therethrough; a second passageway formed in said cold plate for causing said coolant to flow therethrough; a hole formed in said cold plate and communicating to said second passageway; a hollow cylindrical member mounted on said cold plate so as to surround said hole; a heat conductor comprising a hollow cylindrical portion and a flat portion closing one end of said hollow cylindrical portion, said hollow cylindrical portion receiving said hollow cylindrical member therein while said flat portion is connected to a top surface of said IC; an elastic material injected into a gap between said hollow cylindrical member and said heat conductor to movably hold said heat conductor on said hollow cylindrical member such that said elastic material will compensate for irregularities of the mounting of said IC on said printed circuit board, wherein said hollow cylindrical member, said heat conductor, and said elastic material form a receptacle, and said elastic material prevents said coolant from flowing outside said receptacle; and a nozzle for jetting the said coolant flowing through said first passageway into said heat conductor.

Claim 15

A structure for cooling an IC, comprising: a printed circuit board; an IC mounted on said printed circuit board; a cold plate provided on said printed circuit board; a first passageway formed in said cold plate for causing a coolant to flow therethrough; a second passageway formed in said cold plate for causing said coolant to flow therethrough; a hole formed in said cold plate and communicating to said second passageway; a hollow cylindrical member mounted on said cold plate so as to surround said hole; a heat conductor comprising a hollow cylindrical portion and a flat portion closing one end of said hollow cylindrical portion, said hollow cylindrical portion receiving said hollow cylindrical member therein while said flat portion is connected to a top surface of said IC; an elastic material injected into a gap between said hollow cylindrical member and said heat conductor to movably hold said heat conductor on said hollow cylindrical member such that said elastic material will compensate for irregularities of the mounting of said IC on said printed circuit board, wherein said hollow cylindrical member, said heat conductor, and said elastic material form a receptacle, and said elastic material prevents said coolant from flowing outside said receptacle; and a nozzle for jetting the said coolant flowing through said first passageway into said heat conductor.

Claim 16

A structure as claimed in any one of claims 1, 10 or 10, wherein said heat conductor has a greater diameter at a closed end portion thereof than at the other portion.

Claim 17

A structure as claimed in any one of claims 1, 10 or 10, wherein said heat conductor has a diameter sequentially increasing as a distance from said cold plate increases, said hollow cylindrical member having a diameter sequentially increasing as said distance from said cold plate increases.

Claim 18

A structure for cooling an IC, comprising: a printed circuit board; an IC mounted on said printed circuit board; a cold plate provided on said printed circuit board; a passageway formed in said cold plate for causing a coolant to flow therethrough; a hole formed in said cold plate and communicating to said passageway; a hollow cylindrical member mounted on said cold plate so as to surround said hole and provided with a first flange around one end thereof; a heat conductor comprising a hollow cylindrical portion, a flat portion closing one end of said hollow cylindrical portion, and a second flange surrounding said one end of said hollow cylindrical portion, said flat portion is connected to a top surface of said IC; an elastic material injected into a gap between said first flange and said second flange to movably hold said heat conductor on said first flange of said hollow cylindrical member such that said elastic material will compensate for irregularities of the mounting of said IC on said printed circuit board, wherein said cylindrical member, said heat conductor, and said elastic material form a receptacle, and said elastic material prevents said coolant from flowing outside said receptacle; and a nozzle for jetting said coolant flowing through said first passageway into said heat conductor.

Claim 19

A structure for cooling an IC, comprising: a printed circuit board; an IC mounted on said printed circuit board; a cold plate provided on said printed circuit board; a passageway formed in said cold plate for causing a coolant to flow therethrough; a hole formed in said cold plate and communicating to said passageway; a hollow cylindrical member mounted on said cold plate so as to surround said hole and provided with a first flange around one end thereof; a heat conductor comprising a hollow cylindrical portion, a flat portion closing one end of said hollow cylindrical portion, and a second flange surrounding said one end of said hollow cylindrical portion, said flat portion is connected to a top surface of said IC; an elastic material injected into a gap between said first flange and said second flange to movably hold said heat conductor on said first flange of said hollow cylindrical member such that said elastic material will compensate for irregularities of the mounting of said IC on said printed circuit board, wherein said cylindrical member, said heat conductor, and said elastic material form a receptacle, and said elastic material prevents said coolant from flowing outside said receptacle; and a nozzle for jetting said coolant flowing through said first passageway into said heat conductor.

Claim 20

A structure as claimed in any one of claims 1,3-11 or 13, further comprising a compound interposed between said heat conductor and said IC.

Claim 21

A structure as claimed in any one of claims 1,3-11 or 14, wherein said elastic material comprises silicone gel.