Multilayer printed circuit board and method of manufacturing same

Claim 1

A multilayer printed circuit board comprising: a metal base, said base having a plurality of through holes in a pattern for accommodating leads of radio components, an insulating layer applied to at least one side of said base and to walls of said holes, said insulating layer and said base having substantially the same thickness, a first layer of electrically conductive material arranged in a pattern on said insulating layer and comprising a group of electrically conductive sections insulated from each other by insulating sections, said electrically conductive sections and said insulating section being of the same thickness, said electrically conductive sections comprising a group of tracks and a group of connecting pads, each pad of said group surrounding a corresponding through hole, some of said connecting pads being electrically coupled to other said connecting pads by tracks of said group, an insulating layer located on said pattern of said first layer of said conductive material and comprising a group of insulating sections and a group of electrically conductive sections in the form of a plurality of switching posts and connecting pads surrounding corresponding through holes of said group, said electrically conductive sections and said insulating sections being of identical thickness, said plurality of switching posts providing electrical connection of said tracks and said connecting pads in said pattern in said first layer of conductive material, an outer layer of conductive material arranged in a pattern on said insulating layer and including electrically conductive sections insulated from each other by insulating sections, said insulating sections and said electrically conductive sections being of the same thickness, said electrically conductive sections of the outer layer of the conductive pattern comprising a plurality of tracks and first and second groups of connecting pads, said first group of connecting pads surrounding corresponding through holes, said second group of connecting pads being connectable to surface-mounted radio components, the connecting pads surrounding the through holes having a thickness equal to the sum of the thicknesses of said layers of the conductive material and said insulating layers, and end faces of the superimposed connecting pads surrounding said through holes having projections, and end faces of corresponding insulating sections having indentations located opposite said projections and contacting the projections over the entire surface thereof.