EP0247575A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Multilayer printed wiring board and method for producing the same
Assignee: Furukawa Electric Co Ltd
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Filing: 1987-05-26
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Granted: —
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Expires: 2007-05-26
Abstract
Abstract A multilayer printed wiring board produced by buildup process. A first layer printed wiring pattern (13) is formed on a metal core (11) through a first insulation laminate (12), and a second layer printed wiring pattern (16) is formed on the first layer printed wiring pattern through through-studs (15) and a second insulation laminate (14). The surface of the first layer printed wiring pattern (13) is roughened and the through studs (15) are formed by buildup process a conductive paste on the roughened surface.
Inventors
- 👤 Isao Shirahata
- 👤 Shoji Shiga
- 👤 Hisako Hori
- 👤 Takamasa Jinbo
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-30 03:25
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4664; H05K1/00; H05K1/02; H05K1/03; H05K1/05; H05K1/056; H05K3/4647; H05K1/0313; H05K1/0353; H05K1/0366; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0355; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/072; H05K3/22; H05K3/24; H05K3/245; H05K3/246; H05K3/38; H05K3/382; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 37
Claim 1
Independent Claim
160 words
A multilayer printed wiring board comprising: a metal core; a first insulation laminate disposed on said metal core; at least first and second layers of printed wiring patterns laminated to said first insulation laminate, said first layer of printed wiring pattern comprising a metal layer whose one surface on the side of said second layer printed wiring pattern is roughened in a manner that an average value of differences in height between peaks and valleys thereof is 1 µm or over, said second layer printed wiring pattern being made of a cured conductive paste; a second insulation laminate disposed to electrically insulate said first and second layers of printed wiring patterns from each oterh; and a plurality of through studs forming conducting paths between said first layer printed wiring pattern and said second layer printed wiring pattern, et seq., said through studs being made of a cured conductive paste, Whereby said multilayer printed wiring board has excellent heat dissipating properties.
Claim 2
Dependent Claim
160 words
A multilayer printed wiring board comprising: a metal core; a first insulation laminate disposed on said metal core; at least first and second layers of printed wiring patterns laminated to said first insulation laminate, said first layer of printed wiring pattern comprising a metal layer whose one surface on the side of said second layer printed wiring pattern is roughened in a manner that an average value of differences in height between peaks and valleys thereof is 1 µm or over, said second layer printed wiring pattern being made of a cured conductive paste; a second insulation laminate disposed to electrically insulate said first and second layers of printed wiring patterns from each oterh; and a plurality of through studs forming conducting paths between said first layer printed wiring pattern and said second layer printed wiring pattern, et seq., said through studs being made of a cured conductive paste, Whereby said multilayer printed wiring board has excellent heat dissipating properties.
Claim 3
Dependent Claim
17 words
A multilayer printed wiring board according to claim 1, wherein said metal core comprises an aluminum plate.
Claim 4
Dependent Claim
25 words
A multilayer printed wiring board according to claim 1, wherein said metal core comprises an aluminum plate having an oxide coating on a surface thereof.
Claim 5
Dependent Claim
30 words
A multilayer printed wiring board according to claim 1, wherein said insulation laminate disposed on said metal core is a composite material comprising mainly a resin and an inorganic material.
Claim 6
Dependent Claim
38 words
A multilayer printed wiring board according to claim 1, wherein said first insulation laminate disposed on said metal core is a laminate comprising a plurality of different composite material each comprising mainly a resin and an inorganic material.
Claim 7
Dependent Claim
42 words
A multilayer printed wiring board according to claim 4 or 5, wherein said resin is a material or mixture of two or more materials selected from the group consisting of epoxy, phenol, polyamide-imide, polyimide, nitrile-rubber modified phenol, and butyral modified phenol resins.
Claim 8
Dependent Claim
40 words
A multilayer printed wiring board according to claim 4 or 5, wherein said inorganic material is a material or mixture of two or more materials selected from the group consisting of glass cloth and powdered talc, quartz, alumina and titania.
Claim 9
Dependent Claim
48 words
A multilayer printed wiring board according to claim 1, wherein the second layer printed wiring pattern side metal surface of said first layer printed wiring pattern is a roughened surface whose average value of differences in height between peaks and valleys thereof is between 2 and 6 µm.
Claim 10
Dependent Claim
27 words
A Multilayer printed wiring board according to claim 1, wherein the roughened surface of said first layer printed wiring pattern is formed by an electrochemical deposition process.
Claim 11
Dependent Claim
30 words
A multilayer printed wiring board according to claim 1, wherein said first layer printed wiring pattern comprises a metal foil bonded to said metal core through said first insulation laminate.
Claim 12
Dependent Claim
17 words
A multilayer printed wiring board according to claim 10, wherein said metal foil is a copper foil.
Claim 13
Dependent Claim
36 words
A multilayer printed wiring board according to claim 1, wherein said second insulation laminate for electrically insulating said first-layer and second-layer printed wiring patterns is a composite material comprising mainly a resin and an inorganic material.
Claim 14
Dependent Claim
33 words
A multilayer printed wiring board according to claim 1, wherein said second insulation laminate is a laminate comprising a plurality of different composite material each comprising mainly a resin and an inorganic material.
Claim 15
Dependent Claim
42 words
A multilayer printed wiring board according to claim 12 or 13, wherein said resin is a material or mixture of two or more materials selected from the group consisting of epoxy, phenol,polyamide-imide, polyimide, nitrile-rubber modified phenol, butyral modified phenol and acrylic resins.
Claim 16
Dependent Claim
42 words
A multilayer printed wiring board accroding to claim 12 or 13, wherein said inorganic material is a material or mixture of two or materials selected from the group consisting of powdered talc, clay, barium sulfate, calcium carbonate, quartz, silica, alumina and titania.
Claim 17
Dependent Claim
26 words
A multilayer printed wiring board according to claim 1, wherein said conductive paste comprises a resin-type copper paste containing spherical copper powder as a conductive filler.
Claim 18
Dependent Claim
17 words
A multilayer printed wiring board according to claim 16, wherein said copper powder have a hole therein.
Claim 19
Dependent Claim
37 words
A multilayer printed wiring board according to claim 1, wherein a metal layer is formed by electroless plating on a part or whole of the surface of each of said second layer printed wiring pattern, et seq.
Claim 20
Dependent Claim
23 words
A multilayer printed wiring board according to claim 18, wherein said plated metal layer comprises nickel-boron alloy electroless plating and copper electroless plating.
Claim 21
Independent Claim
204 words
A method for producing a multilayer printed wiring board comprising the following sequence of steps: a) forming a first layer printed wiring pattern by a subtractive process on a metal foil layer of a metal foil-clad insulated metal core comprising a metal foil having at least one surface thereof roughened such that an average value of differences in height between peaks and valleys thereof is 1 µm or over and a metal core to which said metal foil is bonded through a first insulation laminate with said roughened surface being as a nonbonding surface; b) curing a resin-type conductive paste to form a plurality of conductive paths or through studs for current flow between said first layer printed wiring pattern and a second layer printed wiring pattern to be formed next and forming a second insulation laminate for providing insulation spaces of said first layer printed wiring pattern and between said first layer printed wiring pattern and said second layer printed wiring pattern; and c) forming said second layer printed wiring pattern by screen printing a resin-type conductive paste in a desired pattern on the surface of said through studs and said second insulation laminate, curing the same and applying an electroless plating thereonto.
Claim 22
Independent Claim
204 words
A method for producing a multilayer printed wiring board comprising the following sequence of steps: a) forming a first layer printed wiring pattern by a subtractive process on a metal foil layer of a metal foil-clad insulated metal core comprising a metal foil having at least one surface thereof roughened such that an average value of differences in height between peaks and valleys thereof is 1 µm or over and a metal core to which said metal foil is bonded through a first insulation laminate with said roughened surface being as a nonbonding surface; b) curing a resin-type conductive paste to form a plurality of conductive paths or through studs for current flow between said first layer printed wiring pattern and a second layer printed wiring pattern to be formed next and forming a second insulation laminate for providing insulation spaces of said first layer printed wiring pattern and between said first layer printed wiring pattern and said second layer printed wiring pattern; and c) forming said second layer printed wiring pattern by screen printing a resin-type conductive paste in a desired pattern on the surface of said through studs and said second insulation laminate, curing the same and applying an electroless plating thereonto.
Claim 23
Dependent Claim
76 words
A method according to claim 20, wherein in said step a), said metal foil-clad insulating metal core is formed by bonding together under the application of heat and pressure a metal foil having at least one surface thereof roughened such that an average value of differences in height between peaks and valleys thereof is 1 µm or over and a metal core through a first insulation lamination with said roughened surface being as a nonbonding surface.
Claim 24
Dependent Claim
69 words
A method according to claim 20, wherein in said step a), said metal foil-clad insulating metal core is formed by bonding together a metal foil and a metal core through a first insulation laminate under the application of heat and pressure and then roughening a surface of said metal foil such that an average value of differences in height between peaks and valleys thereof is 1 µm or over.
Claim 25
Dependent Claim
27 words
A method according to claim 20, wherein in said step a), said first insulation laminate is a composite material comprising mainly a resin and an inorganic material.
Claim 26
Dependent Claim
30 words
A method according to claim 20, wherein said first insulation lamination is a laminate comprising a plurality of different composite material each comprising mainly a resin and an inorganic material.
Claim 27
Dependent Claim
39 words
A method according to claim 23 or 24, wherein said resin is a material or mixture of two or more materials selected from the group consisting of epoxy, phenol, polyamide-imide, polyimide, nitrile-rubber modified phenol and butyral modified phenol resins.
Claim 28
Dependent Claim
34 words
A method according to claim 23 or 24, wherein said inorganic material is a material or mixture of two or more materials selected from the group consisting of powdered talc, quartz, alumina and titania
Claim 29
Dependent Claim
43 words
A method according to claim 20, wherein in said step b), said second insulation laminate for providing insulation spaces of said first printed wiring pattern and between said first and second printed wiring patterns is formed after the formation of said through studs.
Claim 30
Dependent Claim
60 words
A method according to claim 20, wherein in said step b), said through studs are formed after the formation of a part of said second insulation laminate for providing insulation spaces of said first layer printed wiring pattern, and then the remainder of said second insulation laminate for providing insulation between said first and second printing wiring patterns is formed.
Claim 31
Dependent Claim
45 words
A method according to claim 20, wherein in said step b), said second insulation laminate for providing insulation spaces of said first layer printed wiring pattern and between said first and second printed wiring patterns is formed first and then said through studs are formed.
Claim 32
Dependent Claim
27 words
A method according to claim 20, wherein in said step b), said second insulation laminate is a composite material comprising mainly a resin and an inorganic material.
Claim 33
Dependent Claim
30 words
A method according to claim 20, wherein said second insulation laminate is a laminate comprising a plurality of different composite material each comprising mainly a resin and an inorganic material.
Claim 34
Dependent Claim
40 words
A method according to claim 30 or 31, wherein said resin is a material or mixture of two or more materials selected from the group consisting of epoxy, phenol, polyamide-imide, polyimide, nitrile-rubber modified phenol, butyral modified phenol, and acrylic resins.
Claim 35
Dependent Claim
40 words
A method according to claim 30 or 31, wherein said inorganic material is a material or mixture of two or more material selected from the group consisting of powdered talc, clay, barium sulfate, calcium carbonate, quarz, silica, alumina and titania.
Claim 36
Dependent Claim
37 words
A method according to claim 20, Wherein said step c) is performed after the surface of said through studs and said second insulation laminate have been made flat by mechanical grinding immediately before performing said step c).
Claim 37
Dependent Claim
53 words
A method according to claim 20, wherein in said step c), said second layer printed wiring pattern is formed by forming a desired wiring pattern with a resin-type conductive paste, applying a nickel-boron alloy electroless plating to said desired wiring pattern and applying a copper electroless plating to said nickel-boron alloy electroless plating.
References Cited (Backward Citations)
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