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Patent US5384473A successfully refreshed from Google Patents.
US5384473A
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Semiconductor body having element formation surfaces with different orientations
Assignee: Toshiba Corp
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Filing: 1992-09-30
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Granted: 1995-01-24
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Expires: 2012-09-30
Abstract
Abstract A semiconductor body has a first and a second element formation surface. The semiconductor body is constructed in such a manner that a first semiconductor substrate, which has a first main surface at which the plane appears, is laminated to a second semiconductor substrate, which has a second main surface at which the plane appears. Made in the first semiconductor substrate is at least one opening at which the second main surface of the second semiconductor substrate. The first main surface of the first semiconductor substrate becomes the first element formation surface of the semiconductor body, and the second main surface of the second semiconductor substrate becomes the second element formation surface of the body.
Inventors
- 👤 Susumu Yoshikawa
- 👤 Akira Sudo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 13:44
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/63; H10P14/6302; H10P14/6304; H10P14/6306; H10P14/6308; H10P14/6309; H10B; H10B10/00; H10D; H10D84/00; H10D84/01; H10D84/0123; H10D84/0126; H10D84/0165; H10D84/0191; H10D84/02; H10D84/03; H10D84/038; H10D84/80; H10D84/82; H10D84/83; H10D84/85; H10D84/859; H10P10/00; H10P10/12; H10P10/128; H10P14/6322; H10W; H10W10/00; H10W10/01; H10W10/011; H10W10/012; H10W10/0121; H10W10/018; H10W10/10; H10W10/13
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
92 words
A semiconductor body comprising: a first semiconductor substrate having a first and a second main surface, a first surface orientation appearing at said first main surface; a second semiconductor substrate having a third main surface, a second surface orientation different from said first surface orientation appearing at the third main surface, and the third main surface being in contact with the second main surface of said first semiconductor substrate; and at least one opening made in said first semiconductor substrate, at which the third main surface of said second semiconductor substrate appears.
Claim 2
Dependent Claim
92 words
A semiconductor body comprising: a first semiconductor substrate having a first and a second main surface, a first surface orientation appearing at said first main surface; a second semiconductor substrate having a third main surface, a second surface orientation different from said first surface orientation appearing at the third main surface, and the third main surface being in contact with the second main surface of said first semiconductor substrate; and at least one opening made in said first semiconductor substrate, at which the third main surface of said second semiconductor substrate appears.
Claim 3
Dependent Claim
36 words
A semiconductor body according to claim 1, further comprising: a first element formation surface formed at said first main surface; and a second element formation surface formed at said third main surface appearing in said opening.
Claim 4
Dependent Claim
29 words
A semiconductor body according to claim 2, wherein said first semiconductor substrate is a first-conductivity type semiconductor substrate, and said second semiconductor substrate is a second-conductivity type semiconductor substrate.
Claim 5
Dependent Claim
25 words
A semiconductor body according to claim 2, wherein said first semiconductor substrate and said second semiconductor substrate are semiconductor substrates of the same conductivity type.
Claim 6
Dependent Claim
46 words
A semiconductor body according to claim 1, further comprising: a semiconductor layer formed in said opening, said second surface orientation appearing at its surface; a first element formation surface formed at said first main surface; and a second element formation surface formed at said semiconductor layer.
Claim 7
Dependent Claim
29 words
A semiconductor body according to claim 5, wherein said first semiconductor substrate is a first-conductivity type semiconductor substrate, and said second semiconductor substrate is a second-conductivity type semiconductor substrate.
Claim 8
Dependent Claim
25 words
A semiconductor body according to claim 5, wherein said first semiconductor substrate and said second semiconductor substrate are semiconductor substrates of the same conductivity type.
Claim 9
Dependent Claim
140 words
A semiconductor device comprising: a first semiconductor substrate having a first and a second main surface, a first surface orientation appearing at said first main surface; a second semiconductor substrate having a third main surface, a second surface orientation different from said first surface orientation appearing at the third main surface, and the third main surface being in contact with the second main surface of said first semiconductor substrate; at least one opening made in said first semiconductor substrate, at which the third main surface of said second semiconductor substrate appears; a first element formation surface formed at said first main surface; a second element formation surface formed at said third main surface appearing in said opening; a first semiconductor element formed at said first element formation surface; and a second semiconductor element formed at said second element formation surface.
Claim 10
Dependent Claim
140 words
A semiconductor device comprising: a first semiconductor substrate having a first and a second main surface, a first surface orientation appearing at said first main surface; a second semiconductor substrate having a third main surface, a second surface orientation different from said first surface orientation appearing at the third main surface, and the third main surface being in contact with the second main surface of said first semiconductor substrate; at least one opening made in said first semiconductor substrate, at which the third main surface of said second semiconductor substrate appears; a first element formation surface formed at said first main surface; a second element formation surface formed at said third main surface appearing in said opening; a first semiconductor element formed at said first element formation surface; and a second semiconductor element formed at said second element formation surface.
Claim 11
Dependent Claim
29 words
A semiconductor device according to claim 8, wherein said first semiconductor element is a first-conductivity type semiconductor element, and said second semiconductor element is a second-conductivity type semiconductor element.
Claim 12
Dependent Claim
41 words
A semiconductor device according to claim 8, wherein said first semiconductor element contains a first-conductivity type semiconductor element and a second-conductivity type semiconductor element, and said second semiconductor element contains a first-conductivity type semiconductor element and a second-conductivity type semiconductor element.
Claim 13
Dependent Claim
154 words
A semiconductor device comprising: a first semiconductor substrate having a first and a second main surface, a first surface orientation appearing at said first main surface; a second semiconductor substrate having a third main surface, a second surface orientation different from said first surface orientation appearing at the third main surface, and the third main surface being in contact with the second main surface of said first semiconductor substrate; at least one opening made in said first semiconductor substrate, at which the third main surface of said second semiconductor substrate appears; a semiconductor layer formed in said opening, whose surface has said second surface orientation; a first element formation surface formed at said first main surface; a second element formation surface formed at said third main surface appearing in said opening; a first semiconductor element formed at said first element formation surface; and a second semiconductor element formed at said second element formation surface.
Claim 14
Dependent Claim
154 words
A semiconductor device comprising: a first semiconductor substrate having a first and a second main surface, a first surface orientation appearing at said first main surface; a second semiconductor substrate having a third main surface, a second surface orientation different from said first surface orientation appearing at the third main surface, and the third main surface being in contact with the second main surface of said first semiconductor substrate; at least one opening made in said first semiconductor substrate, at which the third main surface of said second semiconductor substrate appears; a semiconductor layer formed in said opening, whose surface has said second surface orientation; a first element formation surface formed at said first main surface; a second element formation surface formed at said third main surface appearing in said opening; a first semiconductor element formed at said first element formation surface; and a second semiconductor element formed at said second element formation surface.
Claim 15
Dependent Claim
29 words
A semiconductor device according to claim 11, wherein said first semiconductor element is a first-conductivity type semiconductor element, and said second semiconductor element is a second-conductivity type semiconductor element.
Claim 16
Dependent Claim
41 words
A semiconductor device according to claim 11, wherein said first semiconductor element contains a first-conductivity type semiconductor element and a second-conductivity type semiconductor element, and said second semiconductor element contains a first-conductivity type semiconductor element and a second-conductivity type semiconductor element.
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