Patent US5376909A successfully refreshed from Google Patents.
US5376909A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Device packaging
Assignee: Texas Instruments Inc
•
Filing: 1993-05-21
•
Granted: 1994-12-27
•
Expires: 2013-05-21
Abstract
Abstract This is a package [10] for an rf device [11] operable with a characteristic impedance providing a plurality of terminals [12-19] and [101] for effecting circuit connections to the device, the connection between at least one of the terminals and the device being matched in relation to the characteristic impedance. Other devices and methods are also disclosed.
Inventors
- 👤 Stephen R. Nelson
- 👤 Buford H. Carter, Jr.
- 👤 Tammy J. Lahutsky
- 👤 Glen R. Haas
- 👤 Dennis D. Davis
- 👤 Charles W. Suckling
- 👤 Glenn Collinson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 10:56
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/40; H10W70/421; H10W44/226; H10W72/00; H10W72/50; H10W72/541; H10W72/5445; H10W72/5449; H10W72/547; H10W72/5475; H10W72/551; H10W72/552; H10W72/5522; H10W90/00; H10W90/701; H10W90/751; H10W90/753; H10W90/756
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
147 words
A package for an rf device, said rf device having a characteristic impedance, said package comprising: a metal base which is at least partially exposed on a bottom side of said package prior to mounting said package; a leadframe attached to said metal base, said leadframe comprising rf leads for effecting circuit connections to said device wherein at least one of said connections is matched to said characteristic impedance by maintaining, along the length of said lead, the ratio between the spacing of said lead to said metal base and the width of said lead such that said lead and said metal base operate as a transmission line having said characteristic impedance; a plastic encapsulant over a portion of said metal base, said device, and a portion of said leadframe such that a portion of said metal base is exposed and said rf leads are partially exposed.
Claim 2
Dependent Claim
147 words
A package for an rf device, said rf device having a characteristic impedance, said package comprising: a metal base which is at least partially exposed on a bottom side of said package prior to mounting said package; a leadframe attached to said metal base, said leadframe comprising rf leads for effecting circuit connections to said device wherein at least one of said connections is matched to said characteristic impedance by maintaining, along the length of said lead, the ratio between the spacing of said lead to said metal base and the width of said lead such that said lead and said metal base operate as a transmission line having said characteristic impedance; a plastic encapsulant over a portion of said metal base, said device, and a portion of said leadframe such that a portion of said metal base is exposed and said rf leads are partially exposed.
Claim 3
Dependent Claim
14 words
The package of claim 1, wherein said encapsulant is used to maintain said ratio.
Claim 4
Dependent Claim
21 words
The package of claim 2, wherein at least a portion of at least one of said connections runs in encapsulant void.
Claim 5
Dependent Claim
23 words
The package of claim 2, wherein the di-electric constant of said encapsulant varies along the length of at least one of said connections.
Claim 6
Dependent Claim
13 words
The package of claim 4, wherein said ratio varies with said dielectric constant.
Claim 7
Dependent Claim
27 words
The package of claim 1, wherein said metal base extends towards package extremity in the region where at least one of said rf leads exits said package.
Claim 8
Dependent Claim
19 words
The package of claim 6, wherein said at least one of said connections varies in width in said region.
Claim 9
Dependent Claim
15 words
The package of claim 1, wherein said metal base is a heatsink for said device.
Claim 10
Dependent Claim
16 words
The package of claim 1, wherein said metal base is a ground plane to said device.
Claim 11
Dependent Claim
22 words
The package of claim 9, wherein said ground plane and at least one of said connections combine to form overall package ground.
Claim 12
Dependent Claim
13 words
The package of claim 1, wherein said leads are adapted for surface mounting.
Claim 13
Dependent Claim
18 words
The package of claim 1, wherein at least one of said connections is terminated adjacent to said device.
Claim 14
Dependent Claim
20 words
The package of claim 1, wherein at least one of said connections includes a portion of multiple plate transmission line.
Claim 15
Dependent Claim
21 words
The package of claim 1, wherein at least a portion of at least one of said connections is pre-fabricated transmission line.
Claim 16
Dependent Claim
21 words
The package of claim 1, wherein at least one of said connections bends along its length to enhance mechanical strength thereof.
Claim 17
Dependent Claim
149 words
A packaged rf device, having a characteristic impedance, said packaged rf device comprising: an rf device; a metal base which is at least partially exposed on a bottom side of said package prior to mounting said packaged rf device; a leadframe attached to said metal base, said leadframe comprising rf leads for effecting circuit connections to said device wherein at least one of said connections is matched to said characteristic impedance by maintaining, along the length of said lead, the ratio between the spacing of said lead to said metal base and the width of said lead such that said lead and said metal base operate as a transmission line having said characteristic impedance; a plastic encapsulant over a portion of said metal base, said device, and a portion of said leadframe such that a portion of said metal base is exposed and said rf leads are partially exposed.
Claim 18
Dependent Claim
149 words
A packaged rf device, having a characteristic impedance, said packaged rf device comprising: an rf device; a metal base which is at least partially exposed on a bottom side of said package prior to mounting said packaged rf device; a leadframe attached to said metal base, said leadframe comprising rf leads for effecting circuit connections to said device wherein at least one of said connections is matched to said characteristic impedance by maintaining, along the length of said lead, the ratio between the spacing of said lead to said metal base and the width of said lead such that said lead and said metal base operate as a transmission line having said characteristic impedance; a plastic encapsulant over a portion of said metal base, said device, and a portion of said leadframe such that a portion of said metal base is exposed and said rf leads are partially exposed.
Claim 19
Dependent Claim
12 words
The packaged device of claim 16, wherein said device is an amplifier.
Claim 20
Dependent Claim
14 words
The packaged device of claim 17, wherein said amplifier includes GaAs heterojunction bipolar transistors.
Claim 21
Dependent Claim
16 words
The packaged device of claim 16, wherein said device is a portion of a communication system.
Claim 22
Dependent Claim
16 words
The packaged device of claim 16, wherein said device is a portion of a cordless phone.
References Cited (Backward Citations)
US3936778A
Cited
US3958195A
Cited
US4713634A
Cited
US4725878A
Cited
US4875087A
Cited
US4791473A
Cited
US4839717A
Cited
US4982268A
Cited
US4991001A
Cited
US5087530A
Cited
US5057805A
Cited
US5028741A
Cited
US5245216A
Cited
US5218230A
Cited
US5193053A
Cited
US5319242A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-12-26 | 1998-06-27 | 1998-12-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-12-26 | 2002-06-27 | 2002-12-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-12-26 | 2006-06-27 | 2006-12-27 | $7700.00 | Window Closed / Lapsed |