US5371653A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit board, electronic circuit chip-mounted circuit board and circuit board apparatus
Assignee: Hitachi Ltd
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Filing: 1993-03-11
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Granted: 1994-12-06
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Expires: 2013-03-11
Abstract
Abstract A circuit board includes a circuit-conductor layer, a ground layer and a power source layer superposed in a multilayer form through dielectric layers therebetween, A heat conduction through inside of the circuit board is enhanced so that circuit chips mounted on the circuit board can be cooled down to a level capable of operating normally, The circuit board can be formed to be compact, In order to enhance the heat transfer in the circuit board, at least one of the ground layer and power source layer is formed in a multilayer manner, It is preferable to form these layers at a thickness larger than that of the circuit-conductor layer, Further, preferably, the pin of the chip mounted on the board and at least one of the ground layer and power supply layer are connected to each other in such a manner as to enhance the heat conduction.
Inventors
- 👤 Masatsugu Kametani
- 👤 Kazuhiro Umekita
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 20:24
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0207; H05K3/00; H05K3/40; H05K3/42; H05K3/429; H05K3/46; H05K3/4611; H05K3/4641; H10; H10W; H10W40/00; H10W40/40; H10W40/43; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/68; H10W70/685; H05K1/0204; H05K1/0206; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0352; H05K2201/06; H05K2201/062; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09327; H05K2201/095; H05K2201/09581; H05K2201/09654; H05K2201/0969; H05K2201/09718; H05K2201/09818; H05K2201/09881; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K3/30; H05K3/32; H05K3/34; H05K3/3447
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
355 words
A circuit board apparatus, comprising: a mother board having a ground layer and a power supply layer; a circuit board having a multilayer structure composed of at least one circuit-conductor layer situated at an intermediate position of the circuit board in a thickness direction of the board, at least one ground layer and at least one power supply layer spaced through dielectric layers interposed therebetween, said circuit-conductor layer being arranged such that the ground or power supply layer is disposed on either side thereof and adjacent thereto through one of said dielectric layers, each of the ground layer or the power supply layer being thick enough to allow heat to conduct therethrough effectively, said circuit board further having at least two throughholes, the circuit board being mounted on the mother board in such a manner that the ground and power supply layers of the circuit board are connected respectively to the ground and power supply layers of the mother board; a plurality of electronic circuit chips mounted on the power supply pins, respectively connected in said through-holes to said ground and the power supply layers of the circuit board, for conducting therethrough heat generated from the chip; a ground plate connected to the ground layer of the mother board through one conductive member; and a power supply plate connected to the power supply layer of the mother board through another conductive member, whereby the heat generated from the at least one chip mounted on the circuit board is conducted through said pins thereof to said power supply and ground layers of the circuit board to which they are connected, so that a part of the heat can be spread over the circuit board and removed therefrom by fluid which flows along a surface of the circuit board, and so that a part of the heat can be further conducted through a connector between the circuit board and the mother board to the associated power supply and ground layers of the mother board and spread over the mother board so as to be removed therefrom by fluid which flows along a surface of the mother board.
Claim 2
Dependent Claim
355 words
A circuit board apparatus, comprising: a mother board having a ground layer and a power supply layer; a circuit board having a multilayer structure composed of at least one circuit-conductor layer situated at an intermediate position of the circuit board in a thickness direction of the board, at least one ground layer and at least one power supply layer spaced through dielectric layers interposed therebetween, said circuit-conductor layer being arranged such that the ground or power supply layer is disposed on either side thereof and adjacent thereto through one of said dielectric layers, each of the ground layer or the power supply layer being thick enough to allow heat to conduct therethrough effectively, said circuit board further having at least two throughholes, the circuit board being mounted on the mother board in such a manner that the ground and power supply layers of the circuit board are connected respectively to the ground and power supply layers of the mother board; a plurality of electronic circuit chips mounted on the power supply pins, respectively connected in said through-holes to said ground and the power supply layers of the circuit board, for conducting therethrough heat generated from the chip; a ground plate connected to the ground layer of the mother board through one conductive member; and a power supply plate connected to the power supply layer of the mother board through another conductive member, whereby the heat generated from the at least one chip mounted on the circuit board is conducted through said pins thereof to said power supply and ground layers of the circuit board to which they are connected, so that a part of the heat can be spread over the circuit board and removed therefrom by fluid which flows along a surface of the circuit board, and so that a part of the heat can be further conducted through a connector between the circuit board and the mother board to the associated power supply and ground layers of the mother board and spread over the mother board so as to be removed therefrom by fluid which flows along a surface of the mother board.
Claim 3
Dependent Claim
25 words
The circuit board apparatus according to claim 1, wherein one of said pins is electrically insulated from an inner circuit of the electronic circuit chip.
Claim 4
Dependent Claim
47 words
A circuit board apparatus according to claim 1, wherein a part of the heat can be further conducted to the connected power supply and ground plates and spread thereover to be removed therefrom by fluid which flows along a surface of the power supply and ground plates.
Claim 5
Dependent Claim
332 words
A circuit board apparatus, comprising: a mother board having a ground layer and a power supply layer; a circuit board having a multilayer structure composed of at least one circuit-conductor layer situated at an intermediate position of the circuit board in a thickness direction of the board, at least one ground layer and at least one power supply layer spaced through dielectric layers interposed therebetween, said circuit-conductor layer being arranged such that the ground or power supply layer is disposed on either side thereof and adjacent thereto through one of said dielectric layers, each of the ground layer or the power supply layer being thick enough to allow heat to conduct therethrough effectively, said circuit board further having at least two through-holes, the circuit board being mounted on the mother board in such a manner that the ground and power supply layers of the circuit board are connected respectively to the ground and power supply layers of the mother board; and a plurality of electronic circuit chips mounted on the circuit board, and at least one of said chips having ground and power supply pins, respectively connected in said through-holes to said ground and power supply layers of the circuit board, for conducting therethrough heat generated from the at least one chip, whereby the heat generated from the at least one chip mounted on the circuit board is conducted through the ground and power supply pins thereof to the power supply and ground layers of the circuit board to which it is connected, so that a part of the heat can be spread over the circuit board and be removed therefrom by fluid which flows along a surface of the circuit board, and so that a part of the heat can be further conducted through the circuit board to the power supply and ground layers of the mother board and spread over the mother board so as to be removed therefrom by fluid which flows along a surface of the mother board.
Claim 6
Dependent Claim
332 words
A circuit board apparatus, comprising: a mother board having a ground layer and a power supply layer; a circuit board having a multilayer structure composed of at least one circuit-conductor layer situated at an intermediate position of the circuit board in a thickness direction of the board, at least one ground layer and at least one power supply layer spaced through dielectric layers interposed therebetween, said circuit-conductor layer being arranged such that the ground or power supply layer is disposed on either side thereof and adjacent thereto through one of said dielectric layers, each of the ground layer or the power supply layer being thick enough to allow heat to conduct therethrough effectively, said circuit board further having at least two through-holes, the circuit board being mounted on the mother board in such a manner that the ground and power supply layers of the circuit board are connected respectively to the ground and power supply layers of the mother board; and a plurality of electronic circuit chips mounted on the circuit board, and at least one of said chips having ground and power supply pins, respectively connected in said through-holes to said ground and power supply layers of the circuit board, for conducting therethrough heat generated from the at least one chip, whereby the heat generated from the at least one chip mounted on the circuit board is conducted through the ground and power supply pins thereof to the power supply and ground layers of the circuit board to which it is connected, so that a part of the heat can be spread over the circuit board and be removed therefrom by fluid which flows along a surface of the circuit board, and so that a part of the heat can be further conducted through the circuit board to the power supply and ground layers of the mother board and spread over the mother board so as to be removed therefrom by fluid which flows along a surface of the mother board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-12-05 | 1998-06-06 | 1998-12-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-12-05 | 2002-06-06 | 2002-12-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-12-05 | 2006-06-06 | 2006-12-06 | $7700.00 | Window Closed / Lapsed |