Patent US5369880A successfully refreshed from Google Patents.
US5369880A
Expired / Lapsed
US
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Method for forming solder deposit on a substrate
Assignee: Motorola Solutions Inc
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Filing: 1993-05-06
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Granted: 1994-12-06
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Expires: 2013-05-06
Abstract
Abstract An electronic circuit assembly (100) includes a circuit carrying substrate (150) on which electrical components (130) are mounted using solder deposits (125) having an essentially planar surface. A solder deposit (125) is created by forming a recess (155) in the substrate (150), providing a metallic pad (110) about the recess (155), depositing solder paste (120) on the metallic pad (110), and reflowing the solder paste (120) on the metallic pad (110). The electronic circuit (100) is assembled by placing electrical components (130) on the substrate (150) having solder deposits (125), and by further reflowing the solder deposits (125) on the metallic pad (110).
Inventors
- 👤 Ved V. Gundotra
- 👤 Lonnie L. Bernardoni
- 👤 Edward J. Hall
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 17:30
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3485; H05K3/341; H05K3/3431; H05K3/3442; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/09209; H05K2201/09654; H05K2201/09663; H05K2201/0969; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2203/00; H05K2203/04; H05K2203/043; H05K2203/048; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/20; H10W72/241; H10W72/281; H10W72/287; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
48 words
A method for forming a solder deposit on a substrate, comprising the steps of: providing a solder pad on the substrate; forming a cavity through the solder pad and into the substrate; depositing solder paste on said solder pad; and reflowing said solder paste on said solder pad.
Claim 2
Independent Claim
48 words
A method for forming a solder deposit on a substrate, comprising the steps of: providing a solder pad on the substrate; forming a cavity through the solder pad and into the substrate; depositing solder paste on said solder pad; and reflowing said solder paste on said solder pad.
Claim 3
Dependent Claim
22 words
The method of claim 1, wherein said cavity forming step comprises the step of drilling through said solder pad into the substrate.
Claim 4
Dependent Claim
36 words
The method of claim 1, further comprising the steps of: forming a recess in the substrate before the step of providing a solder pad: and locating the solder pad over the cavity formed in the substrate.
Claim 5
Independent Claim
68 words
A method of assembling electrical components on a circuit carrying substrate, comprising the steps of: locating a solder pad on the substrate; forming a cavity through said solder pad and into the substrate; depositing solder paste on said solder pad; reflowing said solder paste on said solder pad to form reflowed solder; placing electrical components on said reflowed solder; and reflowing said reflowed solder on said solder pad.
Claim 6
Independent Claim
68 words
A method of assembling electrical components on a circuit carrying substrate, comprising the steps of: locating a solder pad on the substrate; forming a cavity through said solder pad and into the substrate; depositing solder paste on said solder pad; reflowing said solder paste on said solder pad to form reflowed solder; placing electrical components on said reflowed solder; and reflowing said reflowed solder on said solder pad.
Claim 7
Dependent Claim
22 words
The method of claim 4, further comprising the step of depositing flux on said reflowed solder before said electrical components placing step.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-12-05 | 1998-06-06 | 1998-12-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-12-05 | 2002-06-06 | 2002-12-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-12-05 | 2006-06-06 | 2006-12-06 | $7700.00 | Window Closed / Lapsed |