US5364742A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Micro-miniature structures and method of fabrication thereof
Assignee: International Business Machines Corp
•
Filing: 1992-09-21
•
Granted: 1994-11-15
•
Expires: 2012-09-21
Abstract
Abstract In the fabrication of a free-standing miniaturized structure in a range of about 10 to 20 μm thick, a method based on a sacrificial system includes the steps of selecting a substrate material, depositing on the substrate material a sacrificial layer of material and patterning the sacrificial layer to define a shape. A photoresist layer of material is deposited on the sacrificial layer and patterned by contrast-enhanced photolithography to form a photoresist mold. Upon the mold there is plated a metallic layer of material. The electroplated structure conforms to the resist profile and can have a thickness many times that of conventional polysilicon microstructures. The photoresist mold and the sacrificial layer are thereafter dissolved using etchants to form a free standing metallic structure in a range of about 10 to 20 μm thick, with vertical to lateral aspect ratios of 9:1 to 10:1 or more.
Inventors
- 👤 Long-Shen Fan
- 👤 Hans H. Zappe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 22:24
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/09; G03F7/11; B; B81; B81C; B81C99/00; B81C99/0075; B81C99/0085; H; H02; H02N; H02N1/00; H02N1/002; H02N1/006; H02N1/008; B81B; B81B2201/00; B81B2201/03; B81B2201/035; B81B2201/037
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
102 words
A method for fabricating a method, comprising the steps of: selecting a substrate material; depositing on the substrate material a sacrificial layer of material; patterning the sacrificial layer to define a shape; depositing on the sacrificial layer a photoresist layer of material; patterning the photoresist layer by contrast-enhanced photolithography to form a photoresist mold; plating a metallic layer of material on the photoresist mold, said photoresist layer being patterned to provide a free standing metallic structure having an aspect ratio of at least 9:1; and dissolving the photoresist mold and the sacrificial layer using etchants to form a free standing metallic structure.
Claim 2
Independent Claim
102 words
A method for fabricating a method, comprising the steps of: selecting a substrate material; depositing on the substrate material a sacrificial layer of material; patterning the sacrificial layer to define a shape; depositing on the sacrificial layer a photoresist layer of material; patterning the photoresist layer by contrast-enhanced photolithography to form a photoresist mold; plating a metallic layer of material on the photoresist mold, said photoresist layer being patterned to provide a free standing metallic structure having an aspect ratio of at least 9:1; and dissolving the photoresist mold and the sacrificial layer using etchants to form a free standing metallic structure.
Claim 3
Dependent Claim
38 words
The method of claim 1 wherein the sacrificial layer, the metallic layer and the etchants are chosen to provide high etching selectivity so as to etch the sacrificial layer at a substantially higher rate than the metallic layer.
Claim 4
Dependent Claim
34 words
The method of claim 1 wherein the sacrificial layer is formed from a glass material, the metallic layer is formed from a transition element and the etchant is made from an HF-based acid material.
Claim 5
Dependent Claim
27 words
The method of claim 1 wherein the sacrificial layer is phosphosilicate glass (PSG), the metallic layer is copper or chromium and the etchant is hydrofluoric acid (HF).
Claim 6
Dependent Claim
20 words
The method of claim 4 wherein the contrast enhancement layer is formed from a composition having a bleachable dye therein.
Claim 7
Dependent Claim
27 words
The method of claim 1 wherein the step of depositing a photoresist layer further includes the step of depositing a contrast enhancement layer on the photoresist layer.
Claim 8
Dependent Claim
35 words
The method of claim 1 wherein the step of depositing a photoresist layer further includes the step of depositing a barrier layer on the photoresist layer and a contrast enhancement layer on the barrier layer.
Claim 9
Dependent Claim
46 words
The method of claim 1 wherein the step of patterning the photoresist layer includes masking the photoresist layer and exposing unmasked portions of the photoresist layer using a low numerical aperture projection system providing a source of collimated radiation having a wavelength of about 0.365 μm.
Claim 10
Dependent Claim
21 words
The method of claim 1 wherein the photoresist layer is formed at a thickness of not less than about 2 μm.
Claim 11
Dependent Claim
27 words
The method of claim 1 wherein the photoresist layer is patterned to provide a free standing structure having a vertical thickness of up to about 20 micrometers.
Claim 12
Independent Claim
167 words
A method for fabricating methods having a substrate material and a free standing metallic structure positioned above the substrate, said structure being formed by the steps of: selecting a substrate material; depositing on the substrate material a sacrificial layer of material; patterning the sacrificial layer to define a shape; depositing on the sacrificial layer a photoresist layer of material; patterning the photoresist layer by contrast-enhanced photolithography to form a photoresist mold having one or more substantially vertical sidewalls, including masking the photoresist layer and exposing unmasked portions of the photoresist layer using a source of collimated radiation having a wavelength of about 365 nanometer, and thereafter photodeveloping the photoresist layer to remove the unmasked portions of the photoresist layer; electro-plating a metallic layer of material on the photoresist mold, said photoresist layer being patterned to provide a free standing metallic structure having an aspect ratio of at least 9:1; and dissolving the photoresist mold and the sacrificial layer using etchants to form a free standing metallic structure.
Claim 13
Independent Claim
167 words
A method for fabricating methods having a substrate material and a free standing metallic structure positioned above the substrate, said structure being formed by the steps of: selecting a substrate material; depositing on the substrate material a sacrificial layer of material; patterning the sacrificial layer to define a shape; depositing on the sacrificial layer a photoresist layer of material; patterning the photoresist layer by contrast-enhanced photolithography to form a photoresist mold having one or more substantially vertical sidewalls, including masking the photoresist layer and exposing unmasked portions of the photoresist layer using a source of collimated radiation having a wavelength of about 365 nanometer, and thereafter photodeveloping the photoresist layer to remove the unmasked portions of the photoresist layer; electro-plating a metallic layer of material on the photoresist mold, said photoresist layer being patterned to provide a free standing metallic structure having an aspect ratio of at least 9:1; and dissolving the photoresist mold and the sacrificial layer using etchants to form a free standing metallic structure.
Claim 14
Dependent Claim
38 words
The method of claim 11 wherein the sacrificial layer, the metallic layer and the etchant are chosen to provide high etching selectivity so as to etch the sacrificial layer at a substantially higher rate than the metallic layer.
Claim 15
Dependent Claim
33 words
The method of claim 11 wherein the sacrificial layer is formed from a glass material, the metallic layer is formed from a transition element and the etchant is made from an acid material.
Claim 16
Dependent Claim
27 words
The method of claim 11 wherein the sacrificial layer is phosphosilicate glass (PSG), the metallic layer is copper or chromium and the etchant is hydrofluoric acid (HF).
Claim 17
Dependent Claim
20 words
The method of claim 14 wherein the contrast enhancement layer is formed from a composition having a bleachable dye therein.
Claim 18
Dependent Claim
27 words
The method of claim 11 wherein the step of depositing a photoresist layer further includes the step of depositing a contrast enhancement layer on the photoresist layer.
Claim 19
Dependent Claim
35 words
The method of claim 11 wherein the step of depositing a photoresist layer further includes the step of depositing a barrier layer on the photoresist layer and a contrast enhancement layer on the barrier layer.
Claim 20
Dependent Claim
21 words
The method of claim 11 wherein the photoresist layer is formed at a thickness of not less than about 2 μm.
Claim 21
Independent Claim
127 words
A method for fabricating miniaturized structures having a substrate material and a free standing metallic structure positioned above the substrate, said structure being formed by the steps of: selecting a substrate material; depositing on the substrate material a sacrificial layer of material; patterning the sacrificial layer to define a shape; depositing on the sacrificial layer a photoresist layer of material; patterning the photoresist layer by contrast-enhanced photolithography to form a photoresist mold; plating a metallic layer of material on the photoresist mold, said photoresist layer being patterned to provide a free standing structure having an aspect ratio of at least 9:1 and a vertical thickness between about 2-20 micrometers; and dissolving the photoresist mold and the sacrificial layer using etchants to form a free standing metallic structure.
Claim 22
Independent Claim
127 words
A method for fabricating miniaturized structures having a substrate material and a free standing metallic structure positioned above the substrate, said structure being formed by the steps of: selecting a substrate material; depositing on the substrate material a sacrificial layer of material; patterning the sacrificial layer to define a shape; depositing on the sacrificial layer a photoresist layer of material; patterning the photoresist layer by contrast-enhanced photolithography to form a photoresist mold; plating a metallic layer of material on the photoresist mold, said photoresist layer being patterned to provide a free standing structure having an aspect ratio of at least 9:1 and a vertical thickness between about 2-20 micrometers; and dissolving the photoresist mold and the sacrificial layer using etchants to form a free standing metallic structure.
References Cited (Backward Citations)
US5108874A
Cited
US4677049A
Cited
US4663275A
Cited
JPS6179226A
Cited
US4614119A
Cited
US4764244A
Cited
US4942113A
Cited
US4925770A
Cited
US4889795A
Cited
US4740410A
Cited
US5196295A
Cited
US5106723A
Cited
US5180655A
Cited
US5025346A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-11-14 | 1998-05-16 | 1998-11-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-11-14 | 2002-05-16 | 2002-11-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-11-14 | 2006-05-16 | 2006-11-15 | $7700.00 | Window Closed / Lapsed |