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Press-contact type semiconductor device

Assignee: Toshiba Corp
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Filing: 1993-06-01
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Granted: 1994-11-01
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Expires: 2013-06-01
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Abstract

Abstract In a semiconductor device, a pellet electrode, which is formed on a mesa-shaped pellet, and an external electrode, with which a package is provided, are in pressure-contact with each other. A soft-metal plate which has projections along its surface is arranged between the external electrode and the pellet electrode.

Inventors

  • 👤 Michiaki Hiyoshi
  • 👤 Takashi Fujiwara
  • 👤 Hisashi Suzuki
  • 👤 Hideo Matsuda

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 13:40
CPC Classifications
H; H10; H10W; H10W72/00; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/138; H10W72/30; H10W72/381

Claims Analysis

Total Claims: 15
Claim 1
Independent Claim 204 words
A press-contact type semiconductor device comprising: a pellet having first and second major surfaces, said pellet having a mesa portion provided on said first major surface, said second major surface being flat; a package enclosing said pellet; a first pellet electrode provided on said mesa portion of said pellet; a second pellet electrode provided on said second major surface of said pellet; a semiconductor element provided in said pellet and having a current path, said first pellet electrode being connected to one end of said current path, said second pellet electrode being connected to another end of said current path; a first electrode post which is provided in said package so as to be located above said first pellet electrode, and to which pressure is applied; a second electrode post which is provided in said package so as to be located above said second pellet electrode, and to which pressure is applied; an electrode plate arranged between said first pellet electrode and said first electrode post; a soft-metal plate arranged between said first pellet electrode and said electrode plate, and having a ragged surface; and a protecting layer provided on said ragged surface of said soft-metal plate, for protecting said ragged surface from oxidization.
Claim 2
Dependent Claim 204 words
A press-contact type semiconductor device comprising: a pellet having first and second major surfaces, said pellet having a mesa portion provided on said first major surface, said second major surface being flat; a package enclosing said pellet; a first pellet electrode provided on said mesa portion of said pellet; a second pellet electrode provided on said second major surface of said pellet; a semiconductor element provided in said pellet and having a current path, said first pellet electrode being connected to one end of said current path, said second pellet electrode being connected to another end of said current path; a first electrode post which is provided in said package so as to be located above said first pellet electrode, and to which pressure is applied; a second electrode post which is provided in said package so as to be located above said second pellet electrode, and to which pressure is applied; an electrode plate arranged between said first pellet electrode and said first electrode post; a soft-metal plate arranged between said first pellet electrode and said electrode plate, and having a ragged surface; and a protecting layer provided on said ragged surface of said soft-metal plate, for protecting said ragged surface from oxidization.
Claim 3
Dependent Claim 38 words
The press-contact type semiconductor device according to claim 1, wherein said soft-metal plate has projections provided on said ragged surface and having a maximum height of 0.5 μm to 1.0 μm when a reference length is 0.25 mm.
Claim 4
Dependent Claim 17 words
The press-contact type semiconductor device according to claim 1, wherein said soft-metal plate is made of copper.
Claim 5
Dependent Claim 22 words
The press-contact type semiconductor device according to claim 1, wherein said first pellet electrode on said mesa portion is made of aluminum.
Claim 6
Dependent Claim 16 words
The press-contact type semiconductor device according to claim 1, wherein said semiconductor element comprises a thyristor.
Claim 7
Dependent Claim 17 words
The press-contact type semiconductor device according to claim 1, wherein said semiconductor element comprises a bipolar transistor.
Claim 8
Dependent Claim 18 words
The press-contact type semiconductor device according to claim 1, wherein said semiconductor element comprises an insulated-gate bipolar transistor.
Claim 9
Dependent Claim 26 words
The press-contact type semiconductor device according to claim 1, further comprising: a further electrode plate arranged between said second pellet electrode and said second electrode post.
Claim 10
Dependent Claim 38 words
The press-contact type semiconductor device according to claim 8, wherein said soft-metal plate has projections provided on said ragged surface and having a maximum height of 0.5 μm to 1.0 μm when a reference length is 0.25 mm.
Claim 11
Dependent Claim 17 words
The press-contact type semiconductor device according to claim 8, wherein said soft-metal plate is made of copper.
Claim 12
Dependent Claim 22 words
The press-contact type semiconductor device according to claim 8, wherein said first pellet electrode on said mesa portion is made of aluminum.
Claim 13
Dependent Claim 26 words
The press-contact type semiconductor device according to claim 8, wherein said electrode plate is made of molybdenum, and said further electrode plate is made of molybdenum.
Claim 14
Dependent Claim 17 words
The press-contact type semiconductor device according to claim 1, wherein said protecting layer is made of gold.
Claim 15
Dependent Claim 17 words
The press-contact type semiconductor device according to claim 1, wherein said electrode plate is made of molybdenum.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-10-31 1998-05-02 1998-11-01 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-10-31 2002-05-02 2002-11-01 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-10-31 2006-05-02 2006-11-01 $7700.00 Window Closed / Lapsed

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