EP0365007A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Crimp-type semiconductor device having non-alloy structure
Assignee: Toshiba Corp
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Filing: 1989-10-19
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Granted: —
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Expires: 2009-10-19
Abstract
Abstract A crimp-type semiconductor device having a non-alloy structure according to this invention has a silicon pellet (60) including a plurality of cathode electrodes (70) and a plurality of gate electrodes (72) arranged to be alternately staggered with the cathode electrodes (70) at the cathode side, and an anode electrode (82) at the anode side. The cathode electrodes (70) are crimped by a cathode electrode post (80) via an electrode member (78) constituted by a thin soft-metal plate (76) and a hard metal plate (74). The anode electrode (82) is crimped by an anode electrode post (86) via an electrode member (84). Opposing surfaces of the electrodes (70, 72, 82), the electrode members (78, 84), and the electrode posts (80, 86) are not bonded to but crimped in contact with each other. The electrode members (78, 84) are formed to cover the entire surfaces of the cathode electrode (70) and the anode electrode (82), respectively, and the entire surfaces of the cathode electrode post (80) and the anode electrode post (82), respectively. The electrode members (78, 84) and the electrode posts (80, 86) are positioned with respect to each other by positioning guides (96, 88), respectively.
Inventors
- 👤 Hideo C/O Intellectual Property Division Matsuda
- 👤 Yoshio C/O Intellectual Property Division Yokota
- 👤 Masami C/O Intellectual Property Division Iwasaki
- 👤 Takashi Intellectual Property Division Fujiwara
- 👤 Mitsuhiko Intellectual Property Division Kitagawa
- 👤 Kazuo C/O Intellectual Property Division Watanuki
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 17:59
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/138; H10D; H10D62/00; H10D62/10; H10D62/117; H10W20/00; H10W20/40; H10W20/482; H10W20/484; H10W72/00
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
311 words
A crimp-type semiconductor device comprising: a semiconductor pellet having first and second major surfaces and having main electrodes formed on said first and second major surfaces, and a control electrode formed on at least one of said first and second major surfaces, said main electrode and said control electrode being arranged on one of said major surfaces so as to be alternately staggered with each other; first and second electrode members each having first and second opposing surfaces, said first opposing surfaces being arranged to oppose said first and second major surfaces, respectively; and first and second electrode post means, arranged to oppose said second opposing surfaces of said first and second electrode members, respectively, for crimping said main electrodes formed on said first and second major surfaces via said first and second electrode members, respectively, characterized in that said first and second electrode members (78, 84) are arranged such that said first opposing surfaces thereof are not bonded to but crimped in contact with said first and second major surfaces, respectively, and said second opposing surfaces thereof are not bonded to but crimped in contact with said first and second electrode post means (80, 86), respectively, said first opposing surfaces being formed to cover the entire surfaces of said main electrodes (70, 82), respectively, and said second opposing surfaces being formed to cover the entire surfaces of said first and second electrode post means (80, 86), characterized by further comprising positioning guide means (96, 88), arranged close to at least one of said first and second electrode members (78, 84) and at least one of said first and second electrode posts (80, 84), for positioning at least one of said first and second electrode members (78, 84) with respect to at least one of said first and second electrode post means (80, 86) to be crimped against said electrode member.
Claim 2
Dependent Claim
311 words
A crimp-type semiconductor device comprising: a semiconductor pellet having first and second major surfaces and having main electrodes formed on said first and second major surfaces, and a control electrode formed on at least one of said first and second major surfaces, said main electrode and said control electrode being arranged on one of said major surfaces so as to be alternately staggered with each other; first and second electrode members each having first and second opposing surfaces, said first opposing surfaces being arranged to oppose said first and second major surfaces, respectively; and first and second electrode post means, arranged to oppose said second opposing surfaces of said first and second electrode members, respectively, for crimping said main electrodes formed on said first and second major surfaces via said first and second electrode members, respectively, characterized in that said first and second electrode members (78, 84) are arranged such that said first opposing surfaces thereof are not bonded to but crimped in contact with said first and second major surfaces, respectively, and said second opposing surfaces thereof are not bonded to but crimped in contact with said first and second electrode post means (80, 86), respectively, said first opposing surfaces being formed to cover the entire surfaces of said main electrodes (70, 82), respectively, and said second opposing surfaces being formed to cover the entire surfaces of said first and second electrode post means (80, 86), characterized by further comprising positioning guide means (96, 88), arranged close to at least one of said first and second electrode members (78, 84) and at least one of said first and second electrode posts (80, 84), for positioning at least one of said first and second electrode members (78, 84) with respect to at least one of said first and second electrode post means (80, 86) to be crimped against said electrode member.
Claim 3
Dependent Claim
30 words
A device according to claim 1, characterized in that said first and second opposing surfaces of each of said first and second electrode members (78, 84) have the same size.
Claim 4
Dependent Claim
54 words
A device according to claim 1, characterized in that at least one of said first and second electrode members (78, 84) is constituted by a first metal member (76) opposing one of said first and second major surfaces, and a second metal member (74) opposing one of said first and second electrode post means.
Claim 5
Dependent Claim
34 words
A device according to claim 3, characterized in that said first metal member (76) is constituted by a soft metal member, and said second metal member (74) is constituted by a hard metal member.
Claim 6
Dependent Claim
86 words
A device according to claim 1, characterized in that outer diameters of said main electrode (70) formed on said first major surface of said semiconductor pellet (60) and said main electrode (82) formed on said second major surface thereof, outer diameters of said first opposing surface of said first electrode member (78) and said first opposing surface of said second electrode member (84), and outer diameters of said first electrode post means (80) and said second electrode post means (86) are equal to each other, respectively.
Claim 7
Dependent Claim
67 words
A device according to claim 1, characterized in that said positioning means (96, 88) have first proximity portions located close to at least one of said first and second electrode members (78, 84) and second proximity portions located close to at least one of said first and second electrode post means (80, 86), said first and second proximity portions having different diameters to form a step therebetween.
Claim 8
Dependent Claim
17 words
A device according to claim 1, characterized in that said positioning means (96, 88) comprise a metal.
Claim 9
Dependent Claim
18 words
A device according to claim 1, characterized in that said positioning means (96, 88) comprise an insulating material.
Claim 10
Dependent Claim
48 words
A device according to claim 1, characterized in that said positioning means (96, 88) are located close to outer circumferential surfaces of at least one of said first and second electrode members (78, 84) and a corresponding one of said first and second electrode post means (80, 86).
Claim 11
Dependent Claim
48 words
A device according to claim 1, characterized in that said positioning means (96, 88) are located close to inner circumferential surfaces of at least one of said first and second electrode members (78, 84) and a corresponding one of said first and second electrode post means (80, 86).
Claim 12
Dependent Claim
54 words
A device according to claim 1, characterized in that said positioning means (96, 88) are located close to inner circumferential surfaces of said first electrode member (78) and said first electrode post means (80), and close to outer circumferential surfaces of said second electrode member (84) and said second electrode post means (86), respectively.
Claim 13
Dependent Claim
54 words
A device according to claim 1, characterized in that said positioning means (96, 88) are located close to outer circumferential surfaces of said first electrode member (78) and said first electrode post means (80), and close to inner circumferential surfaces of said second electrode member (84) and said second electrode post means (86), respectively.
Claim 14
Dependent Claim
38 words
A device according to claim 1, characterized in that said semiconductor pellet (60) has said main electrode (70) and said control electrode (72), formed on at least one of said first and second major surfaces, on different planes.
Claim 15
Dependent Claim
39 words
A device according to claim 1, characterized in that said semiconductor pellet (60) has said main electrode (70) and said control electrode (72), formed on at least one of said first and second major surfaces, on the same plane.
References Cited (Backward Citations)
No citation records indexed.
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