Method for manufacturing a component with porous silicon

Claim 3

A method according to claim 1, wherein the step of conducting said anodic etching is further defined by conducting said anodic etching in a HF solution having a concentration of 5-50 weight percent HF, a current density of 1-1000 mA/cm 2 , a voltage of 2-10 volts, and illuminating from a backside of the silicon wafer during said anodic etching.

Claim 4

A method according to claim 1, wherein steps (a), (b) and (c) are respectively further defined by generating said first layer with a thickness in a range between 400 nm and 10 μm; generating said second layer with a thickness in a range between 100 nm and 600 nm; and generating said third layer with a thickness in a range between 100 nm and 600 nm.

Claim 5

A method according to claim 1, further comprising a step of doping said silicon substrate with said second conductivity type.

Claim 6

A method according to claim 1, further comprising a step of forming a terminal contact to said first layer through said third layer and said second layer.

Claim 7

A method according to claim 1, further characterized by the following steps: (a) forming said third layer by implanting first and second highly doped regions into said doped silicon layer and annularly surrounding said second highly doped region of said second conductivity type with said first highly doped region, regulating the relative thicknesses of said first and second highly doped regions so that a thickness of said first highly doped region is less than a thickness of said doped silicon layer and a thickness of said second highly doped region is approximately equal to said thickness of said doped silicon layer, wherein a part of said doped silicon layer displaced between said first highly doped region and said second highly doped region forming a lightly doped region; (b) generating a structured protective layer at the surface of said highly doped region such that said lightly doped region remains uncovered; (c) conducting said anodic etching with said surface of said lightly doped region and said surface of said protective layer contacting said electrolyte such that said protective layer prevents etching attack at said surface of said highly doped regions; and (d) removing said protective layer before applying said contacts.

Claim 8

A method according to claim 6, wherein the step of generating said protective layer is further defined by generating a protective layer consisting of photoresist.

Claim 9

A method according to claim 6, wherein the step of implanting said first highly doped region is further defined by generating a first highly doped region of said first conductivity type and the step of epitaxially applying said silicon layer is further defined by generating a silicon layer of said second conductivity type.

Claim 10

A method according to claim 6, further comprising a step of forming an electrical contact to said lightly doped region in addition to said electrical contacts to said highly doped regions, wherein the step of implanting said first highly doped region is further defined by generating a first highly doped region of said second conductivity type and the step of epitaxially applying said silicon layer is further defined by generating a silicon layer of said first conductivity type.