Semiconductor device and method of manufacturing thereof

Claim 2

A semiconductor device, comprising: a semiconductor substrate of a first conductivity type; an epitaxial layer of a second conductivity type formed on the main surface of the semiconductor substrate; an isolation oxide film formed surrounding an active region in the surface of the epitaxial layer; a well of a first conductivity type formed having a predetermined depth from the surface of said epitaxial layer of said active region; a channel stop layer of a first conductivity type formed having the peripheral top portion contacting the bottom face of said isolation oxide film, surrounding the bottom face of said well of a first conductivity type, and having the bottom face of said channel stop layer of a first conductivity type positioned higher than the main surface of said semiconductor substrate; and a buried layer of a first conductivity type buried having the top face contacting the bottom face of said channel stop layer of a first conductivity type and the bottom face of said buried layer of a first conductivity type positioned lower than the main surface of said semiconductor substrate, wherein the well has a peak impurity concentration located at a depth below its top face and above its bottom face, the channel stop layer has a peak impurity concentration located at a depth below its top face and above its bottom face, and the buried layer has a peak impurity concentration located at a depth below its top face and above its bottom face, and further wherein the bottom face of the well and the top face of the channel stop layer are located where a decrease in the impurity concentration from the maximum in the well ends and an increase in the impurity concentration toward the maximum in the channel stop layer begins, and the bottom face of the channel stop layer and the top face of the buried layer are located where a decrease in the impurity concentration from the maximum in the channel stop layer ends and an increase in the impurity concentration toward the maximum in the buried layer begins.

Claim 3

The semiconductor device according to claim 1, wherein said first conductivity type channel stop layer comprises an impurity concentration of a first maximum value in the proximity of the bottom of said isolation oxide film, wherein said first conductivity type buried layer comprises an impurity concentration of a second maximum value in the proximity of the bottom of said first conductivity type channel stop layer.

Claim 4

The semiconductor device according to claim 1, further comprising: a pair of impurity diffusion regions of a second conductivity type formed at a predetermined space having a predetermined depth from the surface of said well of a first conductivity type; and a conductive layer formed on a position sandwiched by said pair of impurity diffusion regions of a second conductivity type on the surface of said well of a first conductivity type with an oxide film interposed therebetween.

Claim 5

The semiconductor device according to claim 3, wherein said pair of impurity diffusion regions of a second conductivity type and said conductive layer constitute a source/drain region and a gate electrode of a MOS type field effect transistor, respectively.

Claim 6

The semiconductor device according to claim 1, wherein said well of a first conductivity type includes an impurity concentration of 1×10 15 cm -3 -1×10 18 cm -3 , said channel stop layer of a first conductivity type includes an impurity concentration of 1×10 16 cm -3 -1×19 cm -3 , and said buried layer of a first conductivity type includes an impurity concentration of 1×10 16 cm -3 -1×19 cm -3 .

Claim 7

A semiconductor device comprising: a semiconductor substrate of a first conductivity type; an epitaxial layer of a second conductivity type formed on the main surface of the semiconductor substrate; an isolation oxide film formed surrounding a first active region in the surface of the epitaxial layer; a first MOS type field effect transistor having a channel region of a first conductivity type and formed on said first active region; a second MOS type field effect transistor having a channel region of a second conductivity type, and a bipolar transistor both formed on a second active region sandwiching the first MOS type field effect transistor and said isolation oxide film so as to be adjacent to one another, wherein said first active region includes a well of a first conductivity type formed having a predetermined depth from the surface of said epitaxial layer, a channel stop layer of a first conductivity type formed having the peripheral top portion contacting the bottom face of said isolation oxide film, surrounding the bottom face of said well of a first conductivity type, and having the bottom face of said channel stop layer of a first conductivity type positioned higher than the main surface of said semiconductor substrate, and a buried layer of a first conductivity type buried having the top face contacting the bottom face of said channel stop layer of a first conductivity type and the bottom face of said buried layer of a first conductivity type positioned lower than the main surface of said semiconductor substrate, wherein the well has a peak impurity concentration located at a depth below its top face and above its bottom face, the channel stop layer has a peak impurity concentration located at a depth below its top face and above its bottom face, and the buried layer has a peak impurity concentration located at a depth below its top face and above its bottom face, and further wherein the bottom face of the well and the top face of the channel stop layer are located where a decrease in the impurity concentration from the maximum in the well ends and an increase in the impurity concentration toward the maximum in the channel stop layer begins, and the bottom face of the channel stop layer and the top face of the buried layer are located where a decrease in the impurity concentration from the maximum in the channel stop layer ends and an increase in the impurity concentration toward the maximum in the buried layer begins.

Claim 8

A semiconductor device comprising: a semiconductor substrate of a first conductivity type; an epitaxial layer of a second conductivity type formed on the main surface of the semiconductor substrate; an isolation oxide film formed surrounding a first active region in the surface of the epitaxial layer; a first MOS type field effect transistor having a channel region of a first conductivity type and formed on said first active region; a second MOS type field effect transistor having a channel region of a second conductivity type, and a bipolar transistor both formed on a second active region sandwiching the first MOS type field effect transistor and said isolation oxide film so as to be adjacent to one another, wherein said first active region includes a well of a first conductivity type formed having a predetermined depth from the surface of said epitaxial layer, a channel stop layer of a first conductivity type formed having the peripheral top portion contacting the bottom face of said isolation oxide film, surrounding the bottom face of said well of a first conductivity type, and having the bottom face of said channel stop layer of a first conductivity type positioned higher than the main surface of said semiconductor substrate, and a buried layer of a first conductivity type buried having the top face contacting the bottom face of said channel stop layer of a first conductivity type and the bottom face of said buried layer of a first conductivity type positioned lower than the main surface of said semiconductor substrate, wherein the well has a peak impurity concentration located at a depth below its top face and above its bottom face, the channel stop layer has a peak impurity concentration located at a depth below its top face and above its bottom face, and the buried layer has a peak impurity concentration located at a depth below its top face and above its bottom face, and further wherein the bottom face of the well and the top face of the channel stop layer are located where a decrease in the impurity concentration from the maximum in the well ends and an increase in the impurity concentration toward the maximum in the channel stop layer begins, and the bottom face of the channel stop layer and the top face of the buried layer are located where a decrease in the impurity concentration from the maximum in the channel stop layer ends and an increase in the impurity concentration toward the maximum in the buried layer begins.

Claim 9

The semiconductor device according to claim 6, wherein said bipolar transistor includes an emitter region of a second conductivity type formed in the surface of said epitaxial layer, a base region of a first conductivity type formed surrounding the emitter region, and a collector region formed of said epitaxial layer of a second conductivity type positioned lower than the base region.

Claim 10

The semiconductor device according to claim 6, wherein said second MOS type field effect transistor having the channel region of a second conductivity type includes a well of a second conductivity type formed having a predetermined depth from the surface of said epitaxial layer, a pair of impurity diffusion regions of a first conductivity type formed at a predetermined space having a predetermined depth from the surface of the well of a second conductivity type, and a conductive layer formed on a position sandwiched by said pair of impurity diffusion regions of a first conductivity type on the surface of said well of a second conductivity type with an oxide film interposed therebetween.

Claim 11

The semiconductor device according to claim 6, wherein said well of a first conductivity type includes an impurity concentration of 1×10 15 cm -3 -1×10 18 cm -3 , said channel stop layer of a first conductivity type includes an impurity concentration of 1×10 16 cm -3 -1×10 19 cm -3 , and said buried layer of a first conductivity type includes an impurity concentration of 1×10 16 cm -3 -1×10 19 cm -3 .