Patent US5345107A successfully refreshed from Google Patents.
US5345107A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Cooling apparatus for electronic device
Assignee: Hitachi Ltd
•
Filing: 1992-02-20
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Granted: 1994-09-06
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Expires: 2012-02-20
Abstract
Abstract The present invention relates to a cooling apparatus for an electronic device, in which a cooling solid body in close contact through thermal conductive fluid with a heat transfer portion of the electronic device is provided, on its one surface in contact with the electronic device, with a number of grooves communicating with the outside of the heat transfer portion, and a spring member for elastically pressing this cooling solid body on the electronic device is provided for forcing the cooling solid body into close contact with the electronic device by means of the thermal conductive fluid in a third layer.
Inventors
- 👤 Takahiro Daikoku
- 👤 Nobuo Kawasaki
- 👤 Noriyuki Ashiwake
- 👤 Keizou Kawamura
- 👤 Shizuo Zushi
- 👤 Mitsuo Miyamoto
- 👤 Atsushi Morihara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 15:08
CPC Classifications
F; F28; F28F; F28F13/00; H; H10; H10W; H10W40/00; H10W40/40; H10W40/47; H10W40/70; H10W40/77; H10W40/774; H10W90/00; F28F2013/005; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/073; H10W72/07351; H10W72/07353; H10W72/20; H10W72/30; H10W72/331; H10W72/334; H10W72/851; H10W72/874; H10W72/877; H10W72/879; H10W72/90; H10W72/931
Claims Analysis
Total Claims: 53
Claim 1
Independent Claim
156 words
A cooling apparatus for an electronic device, comprising: an electronic device; a cooling solid body for eliminating heat produced by said electronic device; a highly viscous fluid layer containing thermal conductive powder having a high thermal conductivity sandwiched between a heat transfer surface of said electronic device and a heat transfer surface of said cooling solid body; pressurizing means for forcing said cooling solid body into close contact with said electronic device; and multiple grooves which are formed on one of the heat transfer surface of said electronic device and the heat transfer surface of said cooling solid body and which are communicated with space surrounding one of said electronic device and said cooling solid body having the heat transfer surface, said pressurizing means comprising an elastic member for pressing said cooling solid body on said electronic device and for pressing the highly viscous fluid layer constantly to keep the fluid layer as a thin layer.
Claim 2
Dependent Claim
156 words
A cooling apparatus for an electronic device, comprising: an electronic device; a cooling solid body for eliminating heat produced by said electronic device; a highly viscous fluid layer containing thermal conductive powder having a high thermal conductivity sandwiched between a heat transfer surface of said electronic device and a heat transfer surface of said cooling solid body; pressurizing means for forcing said cooling solid body into close contact with said electronic device; and multiple grooves which are formed on one of the heat transfer surface of said electronic device and the heat transfer surface of said cooling solid body and which are communicated with space surrounding one of said electronic device and said cooling solid body having the heat transfer surface, said pressurizing means comprising an elastic member for pressing said cooling solid body on said electronic device and for pressing the highly viscous fluid layer constantly to keep the fluid layer as a thin layer.
Claim 3
Dependent Claim
34 words
A cooling apparatus for an electronic device as recited in claim 1, wherein the highly viscous fluid layer comprises a fluid which is hard to wet and spread over the surface of a solid.
Claim 4
Dependent Claim
25 words
A cooling apparatus for an electronic device as recited in claim 2, wherein the highly viscous fluid layer comprises grease or a thermal conductive adhesive.
Claim 5
Dependent Claim
23 words
A cooling apparatus for an electronic device as recited in claim 3, wherein the highly viscous fluid layer comprises a high viscous grease.
Claim 6
Dependent Claim
77 words
A cooling apparatus for an electronic device as recited in claim 1, wherein the capacity of the grooves is larger than the volume of the highly viscous fluid layer sandwiched between said electronic device and said cooling solid body between adjacent ones of the grooves so that space is left in each of the grooves when some of the highly viscous fluid layer between the adjacent ones of the grooves enters the adjacent ones of the grooves.
Claim 7
Dependent Claim
185 words
A cooling apparatus for an electronic device with a heat transfer surface, comprising a cooling solid body, a spring which forces the cooling solid body into close contact with the heat transfer surface of the electronic device to which surface is applied a highly viscous fluid layer containing thermal conductive powder with high thermal conductivity hardly wetting body, and said spring presses the highly viscous fluid layer constantly to keep the fluid layer as a thin layer, wherein one of a heat transfer surface of the electronic device and the heat transfer surface of the cooling solid body is flat, the other heat transfer surface is a grooved surface including flat heat transfer surface portions and multiple grooves defined between the flat heat transfer surface portions and communicates with an outside of one of said electronic device and said cooling solid body having the grooved heat transfer surface, and the capacity of each of the grooves is larger than the volume of a portion of the highly viscous fluid layer applied to a corresponding flat heat transfer surface portion between adjacent ones of the grooves.
Claim 8
Dependent Claim
185 words
A cooling apparatus for an electronic device with a heat transfer surface, comprising a cooling solid body, a spring which forces the cooling solid body into close contact with the heat transfer surface of the electronic device to which surface is applied a highly viscous fluid layer containing thermal conductive powder with high thermal conductivity hardly wetting body, and said spring presses the highly viscous fluid layer constantly to keep the fluid layer as a thin layer, wherein one of a heat transfer surface of the electronic device and the heat transfer surface of the cooling solid body is flat, the other heat transfer surface is a grooved surface including flat heat transfer surface portions and multiple grooves defined between the flat heat transfer surface portions and communicates with an outside of one of said electronic device and said cooling solid body having the grooved heat transfer surface, and the capacity of each of the grooves is larger than the volume of a portion of the highly viscous fluid layer applied to a corresponding flat heat transfer surface portion between adjacent ones of the grooves.
Claim 9
Dependent Claim
48 words
A cooling apparatus for an electronic device as recited in claim 6, wherein the section of each of the grooves tapers from the open end of the groove provided at a corresponding heat transfer surface portion of the cooling solid body to the narrow bottom of the groove.
Claim 10
Dependent Claim
20 words
A cooling apparatus for an electronic device as recited in claim 6, wherein all the grooves communicate with one another.
Claim 11
Dependent Claim
64 words
A cooling apparatus for an electronic device as recited in claim 8, wherein the cooling solid body includes a through-hole extending from the heat transfer surface to the opposite surface of the cooling solid body, each of the grooves communicates with the through-hole so as to open to the outside of the cooling solid body and communicates with space surrounding said cooling solid body.
Claim 12
Dependent Claim
26 words
A cooling apparatus for an electronic device as recited in claim 6, the electronic device comprises a multichip module with a high thermal conductive ceramic package.
Claim 13
Dependent Claim
168 words
A cooling apparatus for an electronic device, comprising a cooling solid body in close contact through a highly viscous fluid layer containing thermal conductive powder and having a high thermal conductivity with a heat transfer surface of the electronic device, and multiple grooves which are formed on one of the heat transfer surface of said electronic device and the heat transfer surface of said cooling solid body and which are communicated with the outside of the heat transfer surface, the capacity of said grooves is greater than the volume of the highly viscous fluid layer sandwiched between said heat transfer surfaces, and each of the grooves leaves therein space communicating with an outside of the heat transfer surface when the highly viscous fluid layer is received within said grooves, and an elastic member is provided for pressing to force said cooling solid body into close contact with the electronic device and for pressing the highly viscous fluid layer constantly to keep the fluid layer as a thin layer.
Claim 14
Dependent Claim
168 words
A cooling apparatus for an electronic device, comprising a cooling solid body in close contact through a highly viscous fluid layer containing thermal conductive powder and having a high thermal conductivity with a heat transfer surface of the electronic device, and multiple grooves which are formed on one of the heat transfer surface of said electronic device and the heat transfer surface of said cooling solid body and which are communicated with the outside of the heat transfer surface, the capacity of said grooves is greater than the volume of the highly viscous fluid layer sandwiched between said heat transfer surfaces, and each of the grooves leaves therein space communicating with an outside of the heat transfer surface when the highly viscous fluid layer is received within said grooves, and an elastic member is provided for pressing to force said cooling solid body into close contact with the electronic device and for pressing the highly viscous fluid layer constantly to keep the fluid layer as a thin layer.
Claim 15
Dependent Claim
36 words
A cooling apparatus for an electronic device as recited in claim 11, wherein said elastic member is a leaf spring, by which said cooling solid body is pressed onto the electronic device at the center thereof.
Claim 16
Dependent Claim
107 words
A cooling apparatus for an electronic device, comprising: an electronic device to be cooled; highly viscous fluid layer containing thermal conductive powder provided on a heat transfer portion of said electronic device; a cooling solid body in close contact through said highly viscous fluid layer with the heat transfer portion of said electronic device, the close contact portion of said cooling solid body having multiple grooves open to the outside of said cooling solid body; and a spring member for pressing said cooling solid body on said electronic device and for pressing the highly viscous fluid layer constantly to keep the fluid layer as a thin layer.
Claim 17
Dependent Claim
107 words
A cooling apparatus for an electronic device, comprising: an electronic device to be cooled; highly viscous fluid layer containing thermal conductive powder provided on a heat transfer portion of said electronic device; a cooling solid body in close contact through said highly viscous fluid layer with the heat transfer portion of said electronic device, the close contact portion of said cooling solid body having multiple grooves open to the outside of said cooling solid body; and a spring member for pressing said cooling solid body on said electronic device and for pressing the highly viscous fluid layer constantly to keep the fluid layer as a thin layer.
Claim 18
Dependent Claim
45 words
A cooling apparatus for an electronic device as recited in claim 13, wherein said spring member is a leaf spring and the apparatus includes a load support means for transmitting an elastic load of the leaf spring to the center of said cooling solid body.
Claim 19
Dependent Claim
105 words
A cooling apparatus for an electronic device, comprising: an electronic device of which a package contains at least one semiconductor chip; a cooling solid body for eliminating heat produced by said electronic device; highly viscous fluid layer containing thermal conductive powder with high thermal conductivity sandwiched between an overall heat transfer surface of said electronic device and a heat transfer surface of said cooling solid body; and spring means for providing an elastically pressing to force said cooling solid body into close contact with said electronic device and for pressing the fluid layer constantly so as to keep the fluid layer as a thin layer.
Claim 20
Dependent Claim
105 words
A cooling apparatus for an electronic device, comprising: an electronic device of which a package contains at least one semiconductor chip; a cooling solid body for eliminating heat produced by said electronic device; highly viscous fluid layer containing thermal conductive powder with high thermal conductivity sandwiched between an overall heat transfer surface of said electronic device and a heat transfer surface of said cooling solid body; and spring means for providing an elastically pressing to force said cooling solid body into close contact with said electronic device and for pressing the fluid layer constantly so as to keep the fluid layer as a thin layer.
Claim 21
Dependent Claim
135 words
A cooling apparatus for an electronic device, comprising: a multichip module in which a ceramic package hermetically seals a ceramic multilayer interconnection substrate with multiple LSI chips packaged thereon and flexible thermal conductive contactors transmit heat produced by said LSI chips to the ceramic package; a water-cooled jacket in close contact through highly viscous fluid layer containing thermal conductive powder and having high thermal conductivity and viscosity with the overall surface of a heat transfer portion of the multichip module, water passing through the interior of the water-cooled jacket; and means for providing an elastically pressing to force the water-cooled jacket into close contact with the multichip module in order to press said highly viscous fluid layer between the water-cooled jacket and the multichip module constantly to keep the fluid layer as a thin layer.
Claim 22
Dependent Claim
135 words
A cooling apparatus for an electronic device, comprising: a multichip module in which a ceramic package hermetically seals a ceramic multilayer interconnection substrate with multiple LSI chips packaged thereon and flexible thermal conductive contactors transmit heat produced by said LSI chips to the ceramic package; a water-cooled jacket in close contact through highly viscous fluid layer containing thermal conductive powder and having high thermal conductivity and viscosity with the overall surface of a heat transfer portion of the multichip module, water passing through the interior of the water-cooled jacket; and means for providing an elastically pressing to force the water-cooled jacket into close contact with the multichip module in order to press said highly viscous fluid layer between the water-cooled jacket and the multichip module constantly to keep the fluid layer as a thin layer.
Claim 23
Dependent Claim
50 words
A cooling apparatus for an electronic device as recited in claim 16, wherein said elastically pressing means is a leaf spring, and the apparatus has an arrangement in which an elastic load of said leaf spring is transmitted to the center of said water-cooled jacket through a load support means.
Claim 24
Dependent Claim
133 words
A cooling apparatus for an electronic device, comprising a multichip module package made of a high thermal conductive material to seal a ceramic multilayer interconnection substrate with multiple LSI chips packaged thereon and flexible thermal conductive contactors to transmit heat produced by said LSI chips to said package; multiple grooves provided on at least one of contact surfaces between heat transfer surfaces of said LSI chips and heat transfer surfaces of said flexible thermal conductive contactors; a highly viscous fluid layer containing thermal conductive powder sandwiched between said contact surfaces; and an elastic member operatively arranged for forcing said flexible thermal conductive contactors into close contact with the heat transfer surfaces of said LSI chips and for pressing said highly viscous fluid layer constantly to keep the fluid layer as a thin layer.
Claim 25
Dependent Claim
133 words
A cooling apparatus for an electronic device, comprising a multichip module package made of a high thermal conductive material to seal a ceramic multilayer interconnection substrate with multiple LSI chips packaged thereon and flexible thermal conductive contactors to transmit heat produced by said LSI chips to said package; multiple grooves provided on at least one of contact surfaces between heat transfer surfaces of said LSI chips and heat transfer surfaces of said flexible thermal conductive contactors; a highly viscous fluid layer containing thermal conductive powder sandwiched between said contact surfaces; and an elastic member operatively arranged for forcing said flexible thermal conductive contactors into close contact with the heat transfer surfaces of said LSI chips and for pressing said highly viscous fluid layer constantly to keep the fluid layer as a thin layer.
Claim 26
Dependent Claim
50 words
A cooling apparatus for an electronic device, as recited in claim 18, wherein said flexible conductive contactors include fins fitting with a number of flat fins extending from an inner surface of said package with microgaps, and said highly viscous mixture is also sandwiched between adjacent ones of said fins.
Claim 27
Dependent Claim
36 words
A cooling apparatus for an electronic device, as recited in claim 19, wherein each of said thermal conductors including the fins is formed with said multiple grooves on its surface in contact with said LSI chips.
Claim 28
Dependent Claim
87 words
A cooling apparatus for an electronic device, as recited in claim 18, wherein each of said flexible thermal conductive contactors is a triangular thermal conductor having a circular surface in contact with a corresponding V-shaped groove formed in an inner surface of said package and a flat surface in contact with the LSI chips, a number of grooves communicating with the outside are provided on said circular and flat surfaces of said thermal conductor, and highly viscous mixture is sandwiched between said circular surface and the package.
Claim 29
Dependent Claim
131 words
A cooling apparatus for an electronic device, comprising a multichip module package made of a high thermal conductive material to seal a ceramic multilayer interconnection substrate with multiple microchip carriers containing LSI chips packaged thereon and flexible thermal conductive contactors to transmit heat produced by said LSI chips to said package; multiple grooves provided on one of contact surfaces between heat transfer surface of said microchip carriers and said flexible thermal conductive contactors; a highly viscous fluid layer containing thermal conductive powder sandwiched between the two contact surfaces; and an elastic member operatively arranged for forcing said flexible thermal conductive contactors into close contact with the heat transfer surface of said microchip carriers and for pressing said highly viscous fluid layer constantly to keep the fluid layer as a thin layer.
Claim 30
Dependent Claim
131 words
A cooling apparatus for an electronic device, comprising a multichip module package made of a high thermal conductive material to seal a ceramic multilayer interconnection substrate with multiple microchip carriers containing LSI chips packaged thereon and flexible thermal conductive contactors to transmit heat produced by said LSI chips to said package; multiple grooves provided on one of contact surfaces between heat transfer surface of said microchip carriers and said flexible thermal conductive contactors; a highly viscous fluid layer containing thermal conductive powder sandwiched between the two contact surfaces; and an elastic member operatively arranged for forcing said flexible thermal conductive contactors into close contact with the heat transfer surface of said microchip carriers and for pressing said highly viscous fluid layer constantly to keep the fluid layer as a thin layer.
Claim 31
Dependent Claim
60 words
A cooling apparatus for an electronic device, as recited in claim 22, wherein said flexible thermal conductive contactors are thermal conductors including flat fins fitting with a number of flat fins extending from an inner surface of said package with microgaps, and said thermal conductors are provided with said multiple grooves on its surface in contact with the microchip carriers.
Claim 32
Dependent Claim
29 words
A cooling apparatus for an electronic device as recited in claim 8, wherein said transfer surface defines grid-shaped grooves so as to make the grooves communicate with each other.
Claim 33
Dependent Claim
64 words
A cooling apparatus for an electronic device as recited in claim 24, wherein the cooling solid body includes a through-hole extending from the heat transfer surface to the opposite surface of the cooling solid body, each of the grooves communicates with the through-hole so as to open to the outside of the cooling solid body and communicate with space surrounding said cooling solid body.
Claim 34
Dependent Claim
38 words
A cooling apparatus for an electronic device as recited in claim 8, wherein said transfer surface defines radially extending grooves and annular concentric grooves crossing said radially extending grooves so to make the grooves communicate with each other.
Claim 35
Dependent Claim
64 words
A cooling apparatus for an electronic device as recited in claim 26, wherein the cooling solid body includes a through-hole extending from the heat transfer surface to the opposite surface of the cooling solid body, each of the grooves communicates with the through-hole so as to open to the outside of the cooling solid body and communicate with space surrounding said cooling solid body.
Claim 36
Dependent Claim
31 words
A cooling apparatus for an electronic device as recited in claim 8, wherein said transfer surface defines multiple radially extending grooves so as to make the grooves communicate with each other.
Claim 37
Dependent Claim
64 words
A cooling apparatus for an electronic device as recited in claim 28, wherein the cooling solid body includes a through-hole extending from the heat transfer surface to the opposite surface of the cooling solid body, each of the grooves communicates with the through-hole so as to open to the outside of the cooling solid body and communicate with space surrounding said cooling solid body.
Claim 38
Dependent Claim
18 words
The cooling apparatus according to claim 1, wherein the thermal conductive powder constitutes fine particles of zinc oxide.
Claim 39
Dependent Claim
17 words
The cooling apparatus according to claim 1, wherein the thermal conductive powder constitutes fine particles of ceramic.
Claim 40
Dependent Claim
18 words
The cooling apparatus according to claim 6, wherein the thermal conductive powder constitutes fine particles of zinc oxide.
Claim 41
Dependent Claim
17 words
The cooling apparatus according to claim 6, wherein the thermal conductive powder constitutes fine particles of ceramic.
Claim 42
Dependent Claim
18 words
The cooling apparatus according to claim 11, wherein the thermal conductive powder constitutes fine particles of zinc oxide.
Claim 43
Dependent Claim
17 words
The cooling apparatus according to claim 11, wherein the thermal conductive powder constitutes fine particles of ceramic.
Claim 44
Dependent Claim
18 words
The cooling apparatus according to claim 13, wherein the thermal conductive powder constitutes fine particles of zinc oxide.
Claim 45
Dependent Claim
17 words
The cooling apparatus according to claim 13, wherein the thermal conductive powder constitutes fine particles of ceramic.
Claim 46
Dependent Claim
18 words
The cooling apparatus according to claim 15, wherein the thermal conductive powder constitutes fine particles of zinc oxide.
Claim 47
Dependent Claim
17 words
The cooling apparatus according to claim 15, wherein the thermal conductive powder constitutes fine particles of ceramic.
Claim 48
Dependent Claim
18 words
The cooling apparatus according to claim 16, wherein the thermal conductive powder constitutes fine particles of zinc oxide.
Claim 49
Dependent Claim
17 words
The cooling apparatus according to claim 16, wherein the thermal conductive powder constitutes fine particles of ceramic.
Claim 50
Dependent Claim
18 words
The cooling apparatus according to claim 18, wherein the thermal conductive powder constitutes fine particles of zinc oxide.
Claim 51
Dependent Claim
17 words
The cooling apparatus according to claim 18, wherein the thermal conductive powder constitutes fine particles of ceramic.
Claim 52
Dependent Claim
18 words
The cooling apparatus according to claim 22, wherein the thermal conductive powder constitutes fine particles of zinc oxide.
Claim 53
Dependent Claim
17 words
The cooling apparatus according to claim 22, wherein the thermal conductive powder constitutes fine particles of ceramic.
References Cited (Backward Citations)
US4607277A
Cited
JPS58218148A
Cited
US4567505A
Cited
US4639829A
Cited
US4686606A
Cited
US4920574A
Cited
JPS62206867A
Cited
JPS63169053A
Cited
US4761518A
Cited
US4908695A
Cited
US4962416A
Cited
US5014777A
Cited
US5126829A
Cited
US4922376A
Cited
US5109317A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-09-05 | 1998-03-07 | 1998-09-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-09-05 | 2002-03-07 | 2002-09-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-09-05 | 2006-03-07 | 2006-09-06 | $7700.00 | Window Closed / Lapsed |