US4920574A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Cooling system for an electronic circuit device
Assignee: Fujitsu Ltd
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Filing: 1987-07-30
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Granted: 1990-04-24
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Expires: 2007-07-30
Abstract
Abstract A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant. A series of projections are provided on the heat transfer plate for producing turbulence in the flow of coolant. Alternatively, a cylindrical tubular plate is mounted on the heat transfer plate for increasing the surface area in contact with the flow of coolant.
Inventors
- 👤 Haruhiko Yamamoto
- 👤 Masahiro Suzuki
- 👤 Yoshiaki Udagawa
- 👤 Mitsuhiko Nakata
- 👤 Koji Katsuyama
- 👤 Izumi Ono
- 👤 Shunichi Kikuchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 10:25
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/47; H10W40/475; H10W40/70; H10W40/77; H10W40/772
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
148 words
In an electronic circuit device comprising a printed circuit board supporting thereon at least one electronic circuit component, a cooling system for the component comprising a cooling module which includes nozzle means for ejecting a coolant therefrom, a first heat transfer plate having a surface directly exposed to the flow of ejected coolant for transferring heat dissipated from the circuit component to the coolant, means on said surface for producing turbulence in the flow of coolant ejected from the nozzle means, and elastic means connected between the cooling module and the first heat transfer plate for resiliently biasing the first heat transfer plate toward the circuit component, said means for producing turbulence comprising a plurality of annular projections which are coaxial to each other and to the center of the flow of the ejected coolant, said projections being arranged on said surface of the first heat transfer plate.
Claim 2
Dependent Claim
148 words
In an electronic circuit device comprising a printed circuit board supporting thereon at least one electronic circuit component, a cooling system for the component comprising a cooling module which includes nozzle means for ejecting a coolant therefrom, a first heat transfer plate having a surface directly exposed to the flow of ejected coolant for transferring heat dissipated from the circuit component to the coolant, means on said surface for producing turbulence in the flow of coolant ejected from the nozzle means, and elastic means connected between the cooling module and the first heat transfer plate for resiliently biasing the first heat transfer plate toward the circuit component, said means for producing turbulence comprising a plurality of annular projections which are coaxial to each other and to the center of the flow of the ejected coolant, said projections being arranged on said surface of the first heat transfer plate.
Claim 3
Dependent Claim
76 words
A cooling system according to claim 1, wherein the nozzle means comprises a nozzle having a diameter D and the annular projections have a height e and a width W and are spaced apart at a pitch P, said D, e, w and P having a relationship such that the ratio e/D ranges from about 1/20 to about 1/3, the ratio P/e ranges from about 3 to about 10 and the ratio W/e is about unity.
Claim 4
Dependent Claim
38 words
A cooling system according to claim 1, wherein said annular projections are arranged at different pitches P which increase from the annular projections close to the center of the flow of the ejected coolant toward those spaced therefrom.
Claim 5
Dependent Claim
34 words
A coolant according to claim 3, wherein said annular projections have heights e which increase from the annular projections close to the center of the flow of the ejected coolant toward those spaced therefrom.
Claim 6
Dependent Claim
29 words
A coolant according to claim 3, wherein the ratio e/D increases from the annular projections close to the center of the ejected coolant toward the annular projections spaced therefrom.
Claim 7
Dependent Claim
17 words
A cooling system according to claim 1, wherein each of said annular projectios is a discontinuous annulus.
Claim 8
Dependent Claim
28 words
A cooling system according to claim 1, wherein said first heat transfer plate is provided with semispherically recessed grooves disposed on said surface thereof between the annular projections.
Claim 9
Dependent Claim
126 words
In an electronic circuit device comprising a printed circuit board supporting thereon at least one electronic circuit component, a cooling system for the component comprising a cooling module which includes a conduit for coolant flow, first heat transfer plate means having a surface directly exposed to the flow of the coolant for transferring the heat dissipated from the circuit component to the coolant, said first heat transfer plate means including a substantially cylindrical tubular plate on said surface for increasing the surface area of the first heat transfer plate means in contact with the flow of the coolant, and elastic means connected between the cooling module and the first heat transfer plate means for resiliently biasing the first heat transfer plate means toward the circuit component.
Claim 10
Dependent Claim
126 words
In an electronic circuit device comprising a printed circuit board supporting thereon at least one electronic circuit component, a cooling system for the component comprising a cooling module which includes a conduit for coolant flow, first heat transfer plate means having a surface directly exposed to the flow of the coolant for transferring the heat dissipated from the circuit component to the coolant, said first heat transfer plate means including a substantially cylindrical tubular plate on said surface for increasing the surface area of the first heat transfer plate means in contact with the flow of the coolant, and elastic means connected between the cooling module and the first heat transfer plate means for resiliently biasing the first heat transfer plate means toward the circuit component.
Claim 11
Dependent Claim
17 words
A cooling system according to claim 8, wherein said cylindrical tubular plate has a corrugated cylindrical wall.
Claim 12
Dependent Claim
18 words
A cooling system according to claim 8, wherein said tubular cylindrical plate has a plurality of fins thereon.
Claim 13
Dependent Claim
133 words
In an electronic circuit device comprising a printed circuit board supporting thereon at least one electronic circuit component, a cooling system for the component comprising a cooling module which includes a conduit for coolant flow, first heat transfer plate means having a surface directly exposed to the flow of the coolant for transferring the heat dissipated from the circuit component to the coolant, said first heat transfer means including a plurality of circumferentially spaced fins said surface of the first heat transfer plate means for increasing the surface area of the first heat transfer plate means in contact with the flow of the coolant, and elastic means connected between the cooling module and to the first heat transfer plate means for resiliently biasing the first heat transfer plate means toward the circuit component.
Claim 14
Dependent Claim
133 words
In an electronic circuit device comprising a printed circuit board supporting thereon at least one electronic circuit component, a cooling system for the component comprising a cooling module which includes a conduit for coolant flow, first heat transfer plate means having a surface directly exposed to the flow of the coolant for transferring the heat dissipated from the circuit component to the coolant, said first heat transfer means including a plurality of circumferentially spaced fins said surface of the first heat transfer plate means for increasing the surface area of the first heat transfer plate means in contact with the flow of the coolant, and elastic means connected between the cooling module and to the first heat transfer plate means for resiliently biasing the first heat transfer plate means toward the circuit component.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-04-23 | 1993-10-23 | 1994-04-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-04-23 | 1997-10-23 | 1998-04-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-04-23 | 2001-10-23 | 2002-04-24 | $7700.00 | Window Closed / Lapsed |