EP0151068A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Cooling system for electronic circuit device
Assignee: Fujitsu Ltd
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Filing: 1985-01-22
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Granted: —
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Expires: 2005-01-22
Abstract
Abstract A cooling module for an electronic circuit comonet(7) on a printed circuit board (9) includes a passage (1) in which a coolant flows, a first heat transfer plate (3) exposed to the flow of the coolant, a second heat transfer plate (33) secured to the circuit component, a compliant member (31) between the first and second heat transfer plates for establishing a compliant contact therebetween, and a bellows (5) connected to the first heat transfer plate (3) to elastically press the same against the circuit component (7) through the compliant member (31) and the second heat transfer plate (33).
Inventors
- 👤 Haruhico Yamamoto
- 👤 Masaaki Sakai
- 👤 Yoshiaki Udagawa
- 👤 Kouji Katsuyama
- 👤 Mitsuhiko Nakata
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-25 13:28
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/20218; H05K7/20254; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/772; H05K7/20009; H05K7/20136; H05K7/20272; H10W40/776; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W74/00; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
107 words
In an electronic circuit device having a printed circuit board having thereon at least one solid state electronic circuit component, a cooling system comprising a cooling module which comprises a passage means in which a coolant flows, a first heat transfer means exposed to the flow of the coolant, for transferring the heat dissipated from the circuit component to the coolant, a compliance means between the first heat transfer means and the circuit component, for establishing a compliance contact therebetween, and an elastic means connected to the first heat transfer means for elastically pressing the first heat transfer means against the circuit component through the compliance means.
Claim 2
Dependent Claim
107 words
In an electronic circuit device having a printed circuit board having thereon at least one solid state electronic circuit component, a cooling system comprising a cooling module which comprises a passage means in which a coolant flows, a first heat transfer means exposed to the flow of the coolant, for transferring the heat dissipated from the circuit component to the coolant, a compliance means between the first heat transfer means and the circuit component, for establishing a compliance contact therebetween, and an elastic means connected to the first heat transfer means for elastically pressing the first heat transfer means against the circuit component through the compliance means.
Claim 3
Dependent Claim
61 words
A cooling system according to claim 1, wherein said cooling module comprises a second heat transfer means secured to the circuit component in such a manner that the compliance means is located between the first and second heat tranfer means, for transferring the heat from the circuit component to the coolant through the compliance means and the first heat transfer means.
Claim 4
Dependent Claim
19 words
A cooling system according to claim 1, wherein said compliance means is provided on the first heat transfer means.
Claim 5
Dependent Claim
19 words
A cooling system according to claim 2, wherein said compliance means is provided on the second heat transfer means.
Claim 6
Dependent Claim
25 words
A cooling system according to claim 1, wherein said first heat transfer means comprises a first heat transfer plate having a high heat transfer property.
Claim 7
Dependent Claim
25 words
A cooling system according to claim 2, wherein said second heat transfer means comprises a second heat transfer plate having a high heat transfer property.
Claim 8
Dependent Claim
22 words
A cooling system according to claim 6, wherein said second heat transfer plate has a plate surface larger than the circuit component.
Claim 9
Dependent Claim
24 words
A cooling system according to claim 1, wherein said compliance means comprises a sheet-like member made of a thermodeformable material which deforms when heated.
Claim 10
Dependent Claim
20 words
A cooling system according to claim 1, wherein said compliance means comprises a sheet-like member made of a compressible material.
Claim 11
Dependent Claim
25 words
A cooling system according to claim 1, wherein said compliance means comprises a sheet-like member made of a thermocompressible material which is compressed when heated.
Claim 12
Dependent Claim
20 words
A cooling system according to claim 1, further comprising means for supporting the circuit component on the printed circuit board.
Claim 13
Dependent Claim
21 words
A cooling system according to claim 1, wherein said compliance means comprises a sheet-like member made of an electrical insulation material.
Claim 14
Dependent Claim
17 words
A cooling system according to claim 1, further comprising an electrical insulating layer on the compliance means.
Claim 15
Dependent Claim
24 words
A cooling system according to claim 1, wherein said elastic means comprises a bellows connecting the first heat transfer means to the passage means.
Claim 16
Dependent Claim
41 words
A cooling system according to claim 13, wherein said cooling module comprises a nozzle provided in the passage means and having a nozzle opening located in the bellows to eject the coolant into the bellows toward the first heat tranfer means.
Claim 17
Dependent Claim
34 words
A cooling system according to claim 15, wherein said nozzle opening is spaced from the first heat transfer means at a distance within 2 to 4 times the inner diameter of the nozzle opening.
Claim 18
Dependent Claim
44 words
A cooling system according to claim 15, wherein said first heat transfer means comprises a first heat transfer plate having a planar heat transfer surface having an effective heat transfer diameter which is within 3 to 6 times the inner diameter of the nozzle.
Claim 19
Dependent Claim
26 words
A cooling system according to claim 1, wherein said elastic means comprises a diaphragm which elastically connects the first heat transfer means and the passage means.
Claim 20
Dependent Claim
31 words
A cooling system according to claim 1, wherein said cooling module comprises a heat transfer stud provided on the first heat transfer means and located in the flow of the coolant.
Claim 21
Dependent Claim
18 words
A cooling system according to claim 19, wherein said stud comprises heat cooling fins on the periphery thereof.
Claim 22
Dependent Claim
26 words
A cooling system according to claim 6, wherein said second heat transfer plate forms a part of a hermetic seal package having therein said circuit component.
Claim 23
Dependent Claim
22 words
A cooling system according to claim 1, wherein said circuit component is a bare chip directly bonded to the printed circuit board.
Claim 24
Dependent Claim
31 words
A cooling system according to claim 14, wherein said elastic means further comprises a spring in the bellows for applying pressure to the first heat transfer means together with the bellows.
Claim 25
Dependent Claim
40 words
A cooling system according to claim 5, wherein said first heat transfer plate has a heat transfer surface which is exposed to the coolant and which has a concave-convex profile for increasing the surface area of the heat transfer surface.
Claim 26
Dependent Claim
22 words
A cooling system according to claim 1, wherein said compliance means is made of an elastic sheet having a high heat conductivity.
Claim 27
Dependent Claim
30 words
A cooling system according to claim 14, wherein said elastic means further comprises a hydraulic pressure means for applying pressure to the first heat transfer means together with the bellows.
Claim 28
Dependent Claim
26 words
A cooling system according to claim 18, wherein said elastic means further comprises a hydraulic pressure means for applying pressure to the first heat transfer means.
Claim 29
Dependent Claim
35 words
A cooling system according to claim 2, wherein said first heat transfer means and said second heat transfer means are continuously brought into contact with each other through the compliance means by the elastic means.
Claim 30
Dependent Claim
13 words
A cooling system according to claim 1, wherein said coolant is a liquid.
Claim 31
Dependent Claim
13 words
A cooling system according to claim 1, wherein said coolant is a gas.
Claim 32
Dependent Claim
115 words
In an electronic circuit device having a printed circuit board having thereon electronic circuit components, a cooling system comprising a series of cooling modules for corresponding circuit components and a common passage means in which a coolant flows, each cooling module comprising a first heat transfer means exposed to the flow of the coolant, for transferring the heat dissipated from the corresponding circuit component to the coolant, a compliance means between the first heat transfer means and the corresponding circuit component, for establishing a compliance contact therebetween, and an elastic means connected to the first heat transfer means for elastically pressing the first heat transfer means against the corresponding circuit component through the compliance means.
Claim 33
Dependent Claim
115 words
In an electronic circuit device having a printed circuit board having thereon electronic circuit components, a cooling system comprising a series of cooling modules for corresponding circuit components and a common passage means in which a coolant flows, each cooling module comprising a first heat transfer means exposed to the flow of the coolant, for transferring the heat dissipated from the corresponding circuit component to the coolant, a compliance means between the first heat transfer means and the corresponding circuit component, for establishing a compliance contact therebetween, and an elastic means connected to the first heat transfer means for elastically pressing the first heat transfer means against the corresponding circuit component through the compliance means.
Claim 34
Dependent Claim
60 words
A cooling system according to claim 31, wherein said each cooling module comprises a second heat transfer means secured to the corresponding circuit component so that the compliance means is located between the first and second heat transfer means, for transferring the heat from the circuit component to the coolant through the compliance means and the first heat transfer means.
Claim 35
Dependent Claim
20 words
A cooling system according to claim 29, further comprising means for enclosing a heat transfer gas around the cooling modules.
References Cited (Backward Citations)
No citation records indexed.
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