Method of preparing a negative pattern utilizing photosensitive polymer composition containing quinonediazide compound and a poly(amido)imide precursor

Abstract

Abstract A method of preparing a negative type pattern of a polyimide film is provided which includes applying to a substrate a sufficient amount of a photosensitive polymer composition to form a negative type pattern, the photosensitive polymer composition comprising a mixture of a poly(amido)imide precursor containing a repeating unit represented by the following formula (I), at least one kind of quinonediazide compound and an organic solvent: ##STR1## R 1 is a trivalent or a tetravalent carbocyclic aromatic group or heterocyclic group; R 2 is an aliphatic group having at least two carbon atoms, an alicyclic group, an aromatic aliphatic group, a carbocyclic aromatic group, a heterocyclic group or a polysiloxane group; X is --O-- or NR 5 --, where R 5 is a hydrogen atom or a monovalent organic group having 10 or less carbon atoms; R 3 is a divalent organic group; R 4 is a hydrogen atom or a monovalent organic group having 20 or less carbon atoms; Ar is a hexavalent or decavalent organic group represented by the formula ##STR2## k is an integer of 1≦k≦5, and j+k+1 is equal to the valence of Ar; m is independently 1 or 2; n is independently 0 or 1 and the values of m and n are in the range of 1≦m+n≦2; prebaking the composition at 50°-130° C.; irradiating the composition through a mask with actinic radiation to form an irradiated composition; developing the irradiated composition with a developing solution comprising a basic solution of a basic substance in a solvent comprising 0 to 10 parts by weight of water and 100 to 90 parts by weight of a water-soluble organic solvent to remove unexposed portions of the composition and form a negative type pattern; rinsing and drying the pattern; and post-baking the pattern at 200°-500° C.

Inventors

• 👤 Kouichi Katou
• 👤 Hirotoshi Maeda
• 👤 Kouichi Kunimune

Bibliographic Details