US5336650A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making tape carrier semiconductor device
Assignee: Sharp Corp
•
Filing: 1993-08-27
•
Granted: 1994-08-09
•
Expires: 2013-08-27
Abstract
Abstract A tape carrier semiconductor device has a resin sealed area not so larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.
Inventors
- 👤 Yasunori Chikawa
- 👤 Yoshiaki Honda
- 👤 Katsunobu Mori
- 👤 Naoyuki Tajima
- 👤 Takaaki Tsuda
- 👤 Takamichi Maeda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 12:32
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/10; H10W74/111; H10W74/114; H10W74/40; H10W74/47; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
86 words
A method of making a tape carrier semiconductor device, said method comprising the steps of: connecting a semiconductor chip to conductive leads within a mounting hole in a tape carrier that provides a gap between the chip and hole edges that is no more than about 0.3 mm; thereafter applying to said chip and said gap an epoxy resin having a viscosity in the range of 500 to 1200 ps which resin is limited by its viscosity and by said gap size to extend when cured.
Claim 2
Independent Claim
86 words
A method of making a tape carrier semiconductor device, said method comprising the steps of: connecting a semiconductor chip to conductive leads within a mounting hole in a tape carrier that provides a gap between the chip and hole edges that is no more than about 0.3 mm; thereafter applying to said chip and said gap an epoxy resin having a viscosity in the range of 500 to 1200 ps which resin is limited by its viscosity and by said gap size to extend when cured.
Claim 3
Dependent Claim
31 words
A method as in claim 1 wherein said gap size along the edges of said chip varies as a function of the density of conductive leads connected to said chip thereat.
References Cited (Backward Citations)
US4143456A
Cited
US4300153A
Cited
US4926239A
Cited
US4819041A
Cited
JPS6175549A
Cited
JPS61115342A
Cited
US4910582A
Cited
US4903118A
Cited
US5264730A
Cited
US5206188A
Cited
US5202288A
Cited
US5194695A
Cited
US5281852A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-08-08 | 1998-02-07 | 1998-08-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-08-08 | 2002-02-07 | 2002-08-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-08-08 | 2006-02-07 | 2006-08-09 | $7700.00 | Window Closed / Lapsed |