US4903118A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device including a resilient bonding resin
Assignee: National Institute of Advanced Industrial Science and Technology
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Filing: 1988-03-30
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Granted: 1990-02-20
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Expires: 2008-03-30
Abstract
Abstract A semiconductor device comprising a semiconductor chip attached to a substrate by two kinds of bonding agents, one of which is rigid and disposed at the central region of the semiconductor chip, the other of which is disposed around the rigid bonding agent and which is sufficiently resilient to accommodate thermal expansion differences between the semiconductor chip and the substrate.
Inventors
- 👤 Shuhei Iwade
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 07:01
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/321; H10W72/351; H10W72/353; H10W72/354
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
94 words
A semiconductor device comprising a semiconductor chip, a substrate for supporting said semiconductor chip, and bonding means disposed between said semiconductor chip and said substrate for bonding said semiconductor chip onto said substrate for bonding said semiconductor chip onto said substrate, said bonding means comprising a relatively rigid bonding resin disposed between and contacting said semiconductor chip and substrate and a relatively resilient bonding resin disposed between and contacting said semiconductor chip and substrate and enclosing said relatively rigid resin whereby differences in thermal expansion between said semiconductor chip and said substrate are accommodated.
Claim 2
Dependent Claim
94 words
A semiconductor device comprising a semiconductor chip, a substrate for supporting said semiconductor chip, and bonding means disposed between said semiconductor chip and said substrate for bonding said semiconductor chip onto said substrate for bonding said semiconductor chip onto said substrate, said bonding means comprising a relatively rigid bonding resin disposed between and contacting said semiconductor chip and substrate and a relatively resilient bonding resin disposed between and contacting said semiconductor chip and substrate and enclosing said relatively rigid resin whereby differences in thermal expansion between said semiconductor chip and said substrate are accommodated.
Claim 3
Dependent Claim
28 words
A semiconductor device as claimed in claim 1 wherein said relatively rigid bonding resin is an epoxy resin and said relatively resilient bonding resin is a urethane resin.
Claim 4
Dependent Claim
38 words
A semiconductor device as claimed in claim 1 wherein said relatively rigid bonding resin has a Young's modulus of about 920 kg/mm 2 and said relatively resilient bonding resin has a Young's modulus of 280 kg/mm 2 .
Claim 5
Dependent Claim
54 words
A semiconductor device as claimed in claim 1 wherein said bonding means comprises a third bonding resin disposed between and contacting said semiconductor chip, said substrate, said relatively rigid resin, and said relatively resilient resin, said third resin having a resilience intermediate the resiliencies of said relatively rigid resin and said relatively resilient resin.
Claim 6
Dependent Claim
19 words
A semiconductor device as claimed in claim 1 wherein said relatively rigid and relatively resilient resins are electrically insulating.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-02-19 | 1993-08-21 | 1994-02-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-02-19 | 1997-08-21 | 1998-02-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-02-19 | 2001-08-21 | 2002-02-20 | $7700.00 | Window Closed / Lapsed |