Semiconductor device and method of manufacturing thereof

Claim 2

A semiconductor device comprising a wiring substrate in which wiring patterns having a plurality of leads electrically connected with a plurality of electrical pads of an IC chip and wirings for electrically connecting said leads with external electrodes are formed at the surface of an insulation medium and an IC chip contained within a hole of said wiring substrate which is formed for inserting said IC chip in said wiring substrate, the plurality of electrode pads of said IC chip and the plurality of leads of said wiring substrate being respectively electrically connected with each other, and the entire surface of said IC chip and the corresponding periphery thereof, extending partly unto said wiring substrate, being coated with a surface protecting layer made of resin, wherein there is further included barrier portions which are formed along the surface of said wiring substrate adjacent to the circumferential edge of said hole for controlling and limiting the outwardly flowing range of said protecting layer at the surface of said wiring substrate before coagulation of the surface protecting resin material, and wherein said barrier portions are made of the same material as that used for the wiring patterns at the surface of said wiring substrate.

Claim 3

A semiconductor device according to claim 1, including a plurality of barrier portions disposed so as to surround the circumferential edge of said hole and being separated from said hole by a predetermined gap, wherein said barrier portions are constituted as a same level forming layer as that of said wiring patterns and which are formed on the surface of said insulation medium.

Claim 4

A semiconductor device comprising a wiring substrate in which wiring patterns having a plurality of leads electrically connected with a plurality of electrical pads of an IC chip and wirings for electrically connecting said leads with external electrodes are formed at the surface of an insulation medium and an IC chip contained within a hole of said wiring substrate which is formed for inserting said IC chip in said wiring substrate, the plurality of electrode pads of said IC chip and the plurality of leads of said wiring substrate being respectively electrically connected with each other, and the entire surface of said IC chip and the corresponding periphery thereof, extending partly unto said wiring substrate, being coated with a surface protecting layer made of resin, wherein there is further included first barrier portions and second barrier portions for controlling and limiting the outwardly flowing range of said protecting layer at the surface of said wiring substrate before coagulation of the surface protecting resin material, said first barrier portions being formed along the surface of said wiring substrate adjacent to the circumferential edge of said hole, said second barrier portions being separated from said first barrier portions and being disposed at a position between said hole and said first barrier portions and being formed along the surface of said wiring substrate adjacent to the circumferential edge of said hole, the gap between each of said second barrier portions being disposed at the position between said hole and one of said first barrier portions, and wherein said barrier portions are made of the same material as that used for the wiring patterns at the surface of said wiring substrate.

Claim 5

A semiconductor device comprising a wiring substrate in which wiring patterns having a plurality of leads electrically connected with a plurality of electrical pads of an IC chip and wirings for electrically connecting said leads with external electrodes are formed at the surface of an insulation medium and an IC chip contained within a hole of said wiring substrate which is formed for inserting said IC chip in said wiring substrate, the plurality of electrode pads of said IC chip and the plurality of leads of said wiring substrate being respectively electrically connected with each other, and the entire surface of said IC chip and the corresponding periphery thereof, extending partly unto said wiring substrate, being coated with a surface protecting layer made of resin, wherein there is further included first barrier portions and second barrier portions for controlling and limiting the outwardly flowing range of said protecting layer at the surface of said wiring substrate before coagulation of the surface protecting resin material, said first barrier portions being formed along the surface of said wiring substrate adjacent to the circumferential edge of said hole, said second barrier portions being separated from said first barrier portions and being disposed at a position between said hole and said first barrier portions and being formed along the surface of said wiring substrate adjacent to the circumferential edge of said hole, the gap between each of said second barrier portions being disposed at the position between said hole and one of said first barrier portions, and wherein said barrier portions are made of the same material as that used for the wiring patterns at the surface of said wiring substrate.

Claim 6

A semiconductor device according to claim 3, wherein said first and said second barrier portions are disposed so as to surround the circumferential edge of said hole, and wherein said first and said second barrier portions are constituted as a same level forming layer as that of said wiring patterns and which are formed on the surface of said insulation medium.

Claim 7

A IC card having a semiconductor device comprising a wiring substrate in which wiring patterns having a plurality of leads electrically connected with a plurality of electrical pads of an IC chip and wirings for electrically connecting said leads with external electrodes are formed at the surface of an insulation medium and an IC chip contained within a hole of said wiring substrate which is formed for inserting said IC chip in said wiring substrate, the plurality of electrode pads of said IC chip and the plurality of leads of said wiring substrate being respectively electrically connected with each other, and the entire surface of said IC chip and the corresponding periphery thereof, extending partly unto said wiring substrate, being coated with a surface protecting layer made of resin, wherein there is further included barrier portions which are formed along the surface of said wiring substrate adjacent to the circumferential edge of said hole for controlling and limiting the outwardly flowing range of said protecting layer at the surface of said wiring substrate before coagulation of the surface protecting resin material, and wherein said barrier portions are made of the same material as that used for the wiring patterns at the surface of said wiring substrate.

Claim 8

A IC card having a semiconductor device comprising a wiring substrate in which wiring patterns having a plurality of leads electrically connected with a plurality of electrical pads of an IC chip and wirings for electrically connecting said leads with external electrodes are formed at the surface of an insulation medium and an IC chip contained within a hole of said wiring substrate which is formed for inserting said IC chip in said wiring substrate, the plurality of electrode pads of said IC chip and the plurality of leads of said wiring substrate being respectively electrically connected with each other, and the entire surface of said IC chip and the corresponding periphery thereof, extending partly unto said wiring substrate, being coated with a surface protecting layer made of resin, wherein there is further included barrier portions which are formed along the surface of said wiring substrate adjacent to the circumferential edge of said hole for controlling and limiting the outwardly flowing range of said protecting layer at the surface of said wiring substrate before coagulation of the surface protecting resin material, and wherein said barrier portions are made of the same material as that used for the wiring patterns at the surface of said wiring substrate.

Claim 9

A semiconductor device comprising a wiring substrate in which wiring patterns having a plurality of leads are electrically connected with a plurality of electrical pads of an IC chip and wirings for electrically connecting said leads with external electrodes are formed at the surface of an insulation medium and an IC chip contained within a hole of said wiring substrate which is formed for inserting said IC chip in said wiring substrate, the plurality of electrode pads of said IC chip and the plurality of leads of said wiring substrate being respectively electrically connected with each other, and the entire surface of said IC chip and the corresponding periphery thereof, extending partly unto said wiring substrate, being coated with a surface protecting layer made of resin, wherein each one of said plurality of leads has a first lead portion and a second lead portion, the width of said first lead portion of each one of said leads formed being broad and being such that the gap between each of said first lead portions at the periphery of said hole is made smaller that the width of each of said first lead portions, said second lead portion having a smaller width than that of said first lead portion and extending from said first lead portion with respect to each one of said leads to the inside of said hole so as to effect in electrical contact with said IC chip, said first lead portions being disposed so as to surround the circumferential edge of said hole for controlling and limiting the outwardly flowing range of said protecting layer at the surface of said wiring substrate before coagulation of the surface protecting resin material.

Claim 10

A semiconductor device comprising a wiring substrate in which wiring patterns having a plurality of leads are electrically connected with a plurality of electrical pads of an IC chip and wirings for electrically connecting said leads with external electrodes are formed at the surface of an insulation medium and an IC chip contained within a hole of said wiring substrate which is formed for inserting said IC chip in said wiring substrate, the plurality of electrode pads of said IC chip and the plurality of leads of said wiring substrate being respectively electrically connected with each other, and the entire surface of said IC chip and the corresponding periphery thereof, extending partly unto said wiring substrate, being coated with a surface protecting layer made of resin, wherein each one of said plurality of leads has a first lead portion and a second lead portion, the width of said first lead portion of each one of said leads formed being broad and being such that the gap between each of said first lead portions at the periphery of said hole is made smaller that the width of each of said first lead portions, said second lead portion having a smaller width than that of said first lead portion and extending from said first lead portion with respect to each one of said leads to the inside of said hole so as to effect in electrical contact with said IC chip, said first lead portions being disposed so as to surround the circumferential edge of said hole for controlling and limiting the outwardly flowing range of said protecting layer at the surface of said wiring substrate before coagulation of the surface protecting resin material.

Claim 11

A semiconductor device according to claim 5, including a plurality of barrier portions disposed so as to surround the circumferential edge of said hole and being separated from said hole by a predetermined gap, wherein said barrier portions are constituted as a same level forming layer as that of said wiring patterns and which are formed on the surface of said insulation medium.

Claim 12

A semiconductor device according to claim 2, wherein the wiring substrate is a tape carrier type.

Claim 13

A semiconductor device according to claim 2, wherein the device is comprised in a module structure of an IC card.

Claim 14

A semiconductor device according to claim 2, wherein the device is comprised in a module structure of an IC card.

Claim 15

A semiconductor device according to claim 2, wherein the device is comprised in a module structure of a memory card.

Claim 16

A semiconductor device according to claim 1, wherein the device is comprised in a module structure of a memory card.

Claim 17

A semiconductor device according to claim 3, wherein the device is comprised in a module structure of an IC card.

Claim 18

A semiconductor device according to claim 3, wherein the device is comprised in a module structure of an IC card.

Claim 19

A semiconductor device according to claim 3, wherein the device is comprised in a module structure of a memory card.

Claim 20

A semiconductor device according to claim 6, wherein the device is comprised in a module structure of an IC card.

Claim 21

A semiconductor device according to claim 6, wherein the device is comprised in a module structure of an IC card.

Claim 22

A semiconductor device according to claim 6, wherein device is comprised in a module structure of a memory card.