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US5310967A Expired / Lapsed US ⏱️ 0.0 years remaining

Applying conductive lines to integrated circuits

Assignee: International Business Machines Corp
•
Filing: 1993-05-28
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Granted: 1994-05-10
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Expires: 2013-05-28
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Abstract

Abstract A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.

Inventors

  • 👤 Pedro A. Chalco
  • 👤 Matthew F. Cali
  • 👤 Laertis Economikos
  • 👤 James L. Speidell

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 21:30
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/225; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/064; G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/1306; G02F1/1309; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0394; H05K2201/10; H05K2201/10227; H05K2201/1028; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0769; H05K2203/10; H05K2203/107; H05K2203/17; H05K2203/173; H05K3/0011; H05K3/0017; H05K3/02; H05K3/027; H05K3/10; H05K3/20; H05K3/28; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49718; Y10T29/49732; Y10T29/49742

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 105 words
A conductive line for applying to a substrate, comprising: a carrier having a carrier opening therethrough, said carrier opening defining a conductive line, and said carrier opening being defined by sidewalls; and conductive material detachably suspended by the sidewalls of the carrier opening, said conductive material having an exposed first surface for applying to a selected area of a substrate, and an exposed second surface, opposite the exposed first surface, for allowing bonding means to be contacted therewith for effectuating bonding of said conductive material to the selected area of the substrate, and said conductive material being detachable from said carrier subsequent to the bonding.
Claim 2
Dependent Claim 105 words
A conductive line for applying to a substrate, comprising: a carrier having a carrier opening therethrough, said carrier opening defining a conductive line, and said carrier opening being defined by sidewalls; and conductive material detachably suspended by the sidewalls of the carrier opening, said conductive material having an exposed first surface for applying to a selected area of a substrate, and an exposed second surface, opposite the exposed first surface, for allowing bonding means to be contacted therewith for effectuating bonding of said conductive material to the selected area of the substrate, and said conductive material being detachable from said carrier subsequent to the bonding.
Claim 3
Dependent Claim 33 words
A conductive line according to claim 1, wherein said carrier is transparent for allowing viewing of the substrate through said carrier for aligning said conductive material to the selected area of the substrate.
Claim 4
Dependent Claim 13 words
A conductive line according to claim 1, wherein said carrier comprises a polymer.
Claim 5
Dependent Claim 12 words
A conductive line according to claim 3, wherein said polymer comprises polyimide.
Claim 6
Dependent Claim 21 words
A conductive line according to claim 1, wherein said conductive material has a thickness of between 1 micron and 10 microns.
Claim 7
Dependent Claim 13 words
A conductive line according to claim 1, wherein said conductive material comprises gold.
Claim 8
Dependent Claim 53 words
A conductive line according to claim 1, wherein the force required to detach said conductive material from said carrier is minimal for minimizing damaging of said conductive material, and weakening of the bond between said conductive material and the substrate as the conductive material is detached from said carrier subsequent to the bonding.
Claim 9
Dependent Claim 16 words
A conductive line according to claim 1, wherein said conductive material is thicker than said carrier.
Claim 10
Dependent Claim 26 words
A conductive line according to claim 1, wherein said exposed second surface of said conductive material is substantially coplanar with a major surface of said carrier.
Claim 11
Dependent Claim 28 words
A conductive line according to claim 1, wherein said conductive material is suspended by the sidewalls of the carrier opening by at least being partially friction fit thereagainst.

References Cited (Backward Citations)

US3614832A Cited
US4704304A Cited
US4908938A Cited
US5089772A Cited
US4970365A Cited
US5245136A Cited
US5006673A Cited
US5079070A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-05-09 1997-11-08 1998-05-10 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-05-09 2001-11-08 2002-05-10 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-05-09 2005-11-08 2006-05-10 $7700.00 Window Closed / Lapsed

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