US4970365A
Expired / Lapsed
US
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Method and apparatus for bonding components leads to pads located on a non-rigid substrate
Assignee: International Business Machines Corp
•
Filing: 1990-03-02
•
Granted: 1990-11-13
•
Expires: 2010-03-02
Abstract
Abstract Component leads are bonded to pads disposed on a non-rigid substrate by the application of a combination of laser energy and ultrasonic energy. The pads preferably are bare copper pads, without a noble metal coating or a chemical pretreatment, and the non-rigid substrate is preferably an epoxy printed circuit board.
Inventors
- 👤 Pedro A. Chalco
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 06:38
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/005; B23K1/0056; B23K20/00; B23K20/10; B23K26/00; B23K26/0093; B23K26/02; B23K26/06; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/328; H10; H10W; H10W72/00; H10W72/071; H10W72/077; H10W72/701; H10W99/00; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10628; H05K2201/10681; H05K2203/00; H05K2203/02; H05K2203/0285; H05K2203/10; H05K2203/107; H10W72/0711; H10W72/07141; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07535; H10W72/50; H10W72/521; H10W72/522; H10W72/551; H10W72/552; H10W72/5522; H10W72/5525; H10W72/555; H10W72/59; H10W72/90; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 76
Claim 1
Independent Claim
142 words
A method of bonding a metallic lead to a metallic pad disposed on a non-rigid substrate comprising the steps of: disposing the lead in contact with the pad disposed on a non-rigid substrate along a bond surface; contacting the lead with a bonding tip; applying laser energy to the tip sufficient to heat the tip; applying a predetermined static force to the tip in a direction substantially normal to the bond surface for causing the lead and the pad to be in forced intimate contact; applying ultrasonic energy to the tip for causing the tip to undergo reciprocating vibratory motion along an axis substantially parallel to the bond surface while in contact with the lead; and ceasing applying laser energy and ultrasonic energy and the predetermined static force after a predetermined period of time when the lead is bonded to the pad.
Claim 2
Independent Claim
142 words
A method of bonding a metallic lead to a metallic pad disposed on a non-rigid substrate comprising the steps of: disposing the lead in contact with the pad disposed on a non-rigid substrate along a bond surface; contacting the lead with a bonding tip; applying laser energy to the tip sufficient to heat the tip; applying a predetermined static force to the tip in a direction substantially normal to the bond surface for causing the lead and the pad to be in forced intimate contact; applying ultrasonic energy to the tip for causing the tip to undergo reciprocating vibratory motion along an axis substantially parallel to the bond surface while in contact with the lead; and ceasing applying laser energy and ultrasonic energy and the predetermined static force after a predetermined period of time when the lead is bonded to the pad.
Claim 3
Dependent Claim
16 words
A method as set forth in claim 1 wherein said pad is a bare copper pad.
Claim 4
Dependent Claim
17 words
A method as set forth in claim 1 wherein said non-rigid substrate is an organic material substrate.
Claim 5
Dependent Claim
25 words
A method as set forth in claim 1 wherein said pad is a bare copper pad and said non-rigid substrate is an organic material substrate.
Claim 6
Dependent Claim
14 words
A method as set forth in claim 1 wherein said lead is gold coated.
Claim 7
Independent Claim
152 words
A method of bonding a metallic lead to a metallic pad disposed on a non-rigid substrate comprising the steps of: disposing the lead in contact with the pad disposed on a non-rigid substrate along a bond surface; contacting the lead with a bonding tip; applying laser energy to the tip sufficient to heat the tip; applying a predetermined static force to the tip in a direction substantially normal to the bond surface for causing the lead and the pad to be in forced intimate contact and for impressing a footprint in the lead; applying ultrasonic energy in the tip for causing the tip to undergo reciprocating vibratory motion along an axis substantially parallel to the bond surface while in contact with the lead; ceasing applying laser energy and ultrasonic energy and the predetermined static force after a predetermined period of time, and analyzing the footprint in the lead for determining bond quality.
Claim 8
Independent Claim
152 words
A method of bonding a metallic lead to a metallic pad disposed on a non-rigid substrate comprising the steps of: disposing the lead in contact with the pad disposed on a non-rigid substrate along a bond surface; contacting the lead with a bonding tip; applying laser energy to the tip sufficient to heat the tip; applying a predetermined static force to the tip in a direction substantially normal to the bond surface for causing the lead and the pad to be in forced intimate contact and for impressing a footprint in the lead; applying ultrasonic energy in the tip for causing the tip to undergo reciprocating vibratory motion along an axis substantially parallel to the bond surface while in contact with the lead; ceasing applying laser energy and ultrasonic energy and the predetermined static force after a predetermined period of time, and analyzing the footprint in the lead for determining bond quality.
Claim 9
Dependent Claim
26 words
A method as set forth in claim 6, further comprising the step of providing an accent/reject indication responsive to said analyzing the footprint in the lead.
Claim 10
Independent Claim
156 words
A method of joining a component having at least one metallic lead to a non-rigid substrate having at least one metallic pad thereon comprising the steps of: (a) disposing a lead in contact with a respective pad disposed on a non-rigid substrate along a bond surface; (b) contacting the lead with a bonding tip; (c) applying laser energy to the tip sufficient to heat the tip; (d) applying a predetermined static force to the tip in a direction substantially normal to the bond surface for causing the lead and the pad to be in forced intimate contact; (e) applying ultrasonic energy to the tip for causing the tip to undergo reciprocating vibratory motion along an axis substantially parallel to the bond surface while in contact with the lead; and (f) ceasing applying laser energy and ultrasonic energy and the predetermined static force after a predetermined period of time when the lead is bonded to the pad.
Claim 11
Independent Claim
156 words
A method of joining a component having at least one metallic lead to a non-rigid substrate having at least one metallic pad thereon comprising the steps of: (a) disposing a lead in contact with a respective pad disposed on a non-rigid substrate along a bond surface; (b) contacting the lead with a bonding tip; (c) applying laser energy to the tip sufficient to heat the tip; (d) applying a predetermined static force to the tip in a direction substantially normal to the bond surface for causing the lead and the pad to be in forced intimate contact; (e) applying ultrasonic energy to the tip for causing the tip to undergo reciprocating vibratory motion along an axis substantially parallel to the bond surface while in contact with the lead; and (f) ceasing applying laser energy and ultrasonic energy and the predetermined static force after a predetermined period of time when the lead is bonded to the pad.
Claim 12
Dependent Claim
29 words
A method as set forth in claim 8 further comprising repeating steps (a) to (f) for each lead of the component and respective pad disposed on a non-rigid substrate.
Claim 13
Dependent Claim
17 words
A method as set forth in claim 8 wherein said non-rigid substrate is an organic material substrate.
Claim 14
Dependent Claim
16 words
A method as set forth in claim 8 wherein said pad is a bare copper pad.
Claim 15
Dependent Claim
24 words
A method as set forth in claim 8 wherein said non-rigid substrate is an epoxy substrate and said pad is a bare copper pad.
Claim 16
Dependent Claim
14 words
A method as set forth in claim 8 wherein said lead is gold coated.
Claim 17
Dependent Claim
17 words
A method as set forth in claim 9 wherein said non-rigid substrate is an organic material substrate.
Claim 18
Dependent Claim
16 words
A method as set forth in claim 9 wherein said pad is a bare copper pad.
Claim 19
Dependent Claim
24 words
A method as set forth in claim 9 wherein said non-rigid substrate is an epoxy substrate and said pad is a base copper pad.
Claim 20
Dependent Claim
14 words
A method as set forth in claim 9 wherein said lead is gold coated.
Claim 21
Dependent Claim
18 words
A component joined to a non-rigid substrate assembled in accordance with the method set forth in claim 8.
Claim 22
Dependent Claim
18 words
A component joined to a non-rigid substrate assembled in accordance with the method set forth in claim 9.
Claim 23
Dependent Claim
18 words
A component joined to a non-rigid substrate assembled in accordance with the method set forth in claim 10.
Claim 24
Dependent Claim
18 words
A component joined to a non-rigid substrate assembled in accordance with the method set forth in claim 12.
Claim 25
Dependent Claim
18 words
A component joined to a non-rigid substrate assembled in accordance with the method set forth in claim 14.
Claim 26
Dependent Claim
18 words
A component joined to a non-rigid substrate assembled in accordance with the method set forth in claim 16.
Claim 27
Independent Claim
167 words
A method of joining a component having at least one metallic lead to a non-rigid substrate having at least one metallic pad thereon comprising the steps of: (a) disposing a lead in contact with a respective pad disposed on a non-rigid substrate along a bond surface; (b) contacting the lead with a bonding tip; (c) applying laser energy to the tip sufficient to heat the tip; (d) applying a predetermined static force to the tip in a direction substantially normal to the bond surface for causing the lead and the pad to be in forced intimate contact and for impressing a footprint in the lead; (e) applying ultrasonic energy to the tip for causing the tip to undergo reciprocating vibratory motion along an axis substantially parallel to the bond surface while in contact with the lead; (f) ceasing applying laser energy and ultrasonic energy and the predetermined static force after a predetermined period of time, and (g) analyzing the footprint in the lead for determining bond quality.
Claim 28
Independent Claim
167 words
A method of joining a component having at least one metallic lead to a non-rigid substrate having at least one metallic pad thereon comprising the steps of: (a) disposing a lead in contact with a respective pad disposed on a non-rigid substrate along a bond surface; (b) contacting the lead with a bonding tip; (c) applying laser energy to the tip sufficient to heat the tip; (d) applying a predetermined static force to the tip in a direction substantially normal to the bond surface for causing the lead and the pad to be in forced intimate contact and for impressing a footprint in the lead; (e) applying ultrasonic energy to the tip for causing the tip to undergo reciprocating vibratory motion along an axis substantially parallel to the bond surface while in contact with the lead; (f) ceasing applying laser energy and ultrasonic energy and the predetermined static force after a predetermined period of time, and (g) analyzing the footprint in the lead for determining bond quality.
Claim 29
Dependent Claim
27 words
A method as set forth in claim 24, further comprising the steps of providing an accept/reject indication responsive to said analyzing the foot print in the lead.
Claim 30
Dependent Claim
29 words
A method as set forth in claim 24, further comprising repeating steps (a) to (g) for each lead of the component and respective pad disposed on a non-rigid substrate.
Claim 31
Dependent Claim
40 words
A method as set forth in claim 25, further comprising repeating steps (a) to (g) for a subsequent lead of the component and a subsequent respective pad disposed on a non-rigid substrate responsive to the providing of an accept indication.
Claim 32
Dependent Claim
18 words
A component joined to a non-rigid substrate assembled in accordance with the method set forth in claim 26.
Claim 33
Dependent Claim
18 words
A component joined to a non-rigid substrate assembled in accordance with the method set forth in claim 27.
Claim 34
Dependent Claim
35 words
A component joined to a non-rigid substrate assembled in accordance with the method set forth in claim 26 wherein said non-rigid substrate is an organic material substrate and said pad is a bare copper pad.
Claim 35
Dependent Claim
35 words
A component joined to a non-rigid substrate assembled in accordance with the method set forth in claim 27 wherein said non-rigid substrate is an organic material substrate and said pad is a bare copper pad.
Claim 36
Dependent Claim
27 words
A component joined to a non-rigid substrate assembled in accordance with the method set forth in claim 26 wherein said non-rigid substrate is an organic material substrate.
Claim 37
Independent Claim
135 words
An apparatus for bonding a metallic lead to a metallic pad disposed on a non-rigid substrate comprising: support means for supporting a lead superimposed on a pad disposed on a non-rigid substrate; an ultrasonic bonder including a tip, the tip having a frontal surface for engaging a lead to be bonded to a pad, said tip having a cavity centrally disposed and extending from said frontal surface, said frontal surface having two crossed grooves intersecting in the region of said cavity; laser energy source means coupled to said tip for providing laser energy pulses to said cavity for heating said frontal surface; and synchronizer means coupled to said support means, said ultrasonic bonder and said laser energy source means for controlling operation of said support means, said ultrasonic bonder and said laser energy source means.
Claim 38
Independent Claim
135 words
An apparatus for bonding a metallic lead to a metallic pad disposed on a non-rigid substrate comprising: support means for supporting a lead superimposed on a pad disposed on a non-rigid substrate; an ultrasonic bonder including a tip, the tip having a frontal surface for engaging a lead to be bonded to a pad, said tip having a cavity centrally disposed and extending from said frontal surface, said frontal surface having two crossed grooves intersecting in the region of said cavity; laser energy source means coupled to said tip for providing laser energy pulses to said cavity for heating said frontal surface; and synchronizer means coupled to said support means, said ultrasonic bonder and said laser energy source means for controlling operation of said support means, said ultrasonic bonder and said laser energy source means.
Claim 39
Dependent Claim
16 words
An apparatus as set forth in claim 33 wherein said support means comprises an x-y stepper.
Claim 40
Dependent Claim
23 words
An apparatus as set forth in claim 33 wherein said laser energy source means is coupled to said tip by optical fiber means.
Claim 41
Dependent Claim
21 words
An apparatus as set forth in claim 35 wherein said cavity having a diameter smaller than said optical fiber means diameter.
Claim 42
Dependent Claim
19 words
An apparatus as set forth in claim 33 wherein said cavity has a diameter substantially equal to 1 mil.
Claim 43
Dependent Claim
31 words
An apparatus as set forth in claim 33 further comprising means for analyzing a footprint in the lead, which footprint is impressed by said frontal surface into the lead during bonding.
Claim 44
Dependent Claim
24 words
An apparatus as set forth in claim 38 wherein said means for analyzing provides an output signal indicative of the quality of a bond.
Claim 45
Dependent Claim
17 words
An apparatus as set forth in claim 33 wherein said non-rigid substrate comprises an organic material substrate.
Claim 46
Dependent Claim
17 words
An apparatus as set forth in claim 33 wherein said laser energy source means comprises a shutter.
Claim 47
Independent Claim
164 words
An apparatus for bonding a component having at least one metallic lead to a non-rigid substrate having at least one pad thereon comprising: support means for supporting a lead superposed on a respective pad on a non-rigid substrate; ultrasonic bonder means including a tip, the tip having a frontal surface for engaging a lead to bonded to a respective pad, said tip having a cavity centrally disposed and extending from said frontal surface, said frontal surface having two crossed grooves intersecting in the region of said cavity; laser energy source means coupled to said tip for providing laser energy pulses to said cavity for heating said frontal surface, and synchronizer means coupled to said support means, said ultrasonic bonder and said laser energy source means for controlling operation of said support means, said ultrasonic bonder and laser energy source means whereby each lead of a component is bonded to a respective pad on a non-rigid substrate for bonding the component to the non-rigid substrate.
Claim 48
Independent Claim
164 words
An apparatus for bonding a component having at least one metallic lead to a non-rigid substrate having at least one pad thereon comprising: support means for supporting a lead superposed on a respective pad on a non-rigid substrate; ultrasonic bonder means including a tip, the tip having a frontal surface for engaging a lead to bonded to a respective pad, said tip having a cavity centrally disposed and extending from said frontal surface, said frontal surface having two crossed grooves intersecting in the region of said cavity; laser energy source means coupled to said tip for providing laser energy pulses to said cavity for heating said frontal surface, and synchronizer means coupled to said support means, said ultrasonic bonder and said laser energy source means for controlling operation of said support means, said ultrasonic bonder and laser energy source means whereby each lead of a component is bonded to a respective pad on a non-rigid substrate for bonding the component to the non-rigid substrate.
Claim 49
Dependent Claim
16 words
An apparatus as set forth in claim 42, wherein said support means comprises an x-y stepper.
Claim 50
Dependent Claim
23 words
An apparatus as set forth in claim 42, wherein said laser energy source means is coupled to said tip by optical fiber means.
Claim 51
Dependent Claim
21 words
An apparatus as set forth in claim 44, wherein said cavity has a diameter smaller than said optical fiber means diameter.
Claim 52
Dependent Claim
19 words
An apparatus as set forth in claim 42, wherein said cavity has a diameter substantially equal to 1 mil.
Claim 53
Dependent Claim
31 words
An apparatus as set forth in claim 42 further comprising means for analyzing a footprint in the lead, which footprint is impressed by said frontal surface into the lead during bonding.
Claim 54
Dependent Claim
24 words
An apparatus as set forth in claim 47 wherein said means for analyzing provides an output signal indicative of the quality of a bond.
Claim 55
Dependent Claim
17 words
An apparatus as set forth in claim 42, wherein said non-rigid substrate comprises an organic material substrate.
Claim 56
Dependent Claim
16 words
An apparatus as set forth in claim 42, wherein said laser energy source comprises a shutter.
Claim 57
Dependent Claim
18 words
An apparatus as set forth in claim 33 wherein said crossed grooves intersect at a substantially 90° angle.
Claim 58
Dependent Claim
18 words
An apparatus as set forth in claim 42 wherein said crossed grooves intersect at a substantially 90° angle.
Claim 59
Independent Claim
125 words
An apparatus for bonding a metallic lead to a metallic pad disposed on a non-rigid substrate comprising: support means for supporting a lead superimposed on a pad disposed on a non-rigid substrate; an ultrasonic bonder including a tip, the tip having a frontal surface for engaging a lead to be bonded to a pad, said tip having a cavity centrally disposed and extending from said frontal surface; laser energy source means coupled to said tip by optical fiber means for providing laser energy pulses to said cavity for heating said frontal surface; and synchronizer means coupled to said support means, said ultrasonic bonder and said laser energy source means for controlling operation of said support means, said ultrasonic bonder and said laser energy source means.
Claim 60
Independent Claim
125 words
An apparatus for bonding a metallic lead to a metallic pad disposed on a non-rigid substrate comprising: support means for supporting a lead superimposed on a pad disposed on a non-rigid substrate; an ultrasonic bonder including a tip, the tip having a frontal surface for engaging a lead to be bonded to a pad, said tip having a cavity centrally disposed and extending from said frontal surface; laser energy source means coupled to said tip by optical fiber means for providing laser energy pulses to said cavity for heating said frontal surface; and synchronizer means coupled to said support means, said ultrasonic bonder and said laser energy source means for controlling operation of said support means, said ultrasonic bonder and said laser energy source means.
Claim 61
Dependent Claim
16 words
An apparatus as set forth in claim 53 wherein said support means comprises an x-y stepper.
Claim 62
Dependent Claim
21 words
An apparatus as set forth in claim 53 wherein said cavity has a diameter smaller than said optical fiber means diameter.
Claim 63
Dependent Claim
19 words
An apparatus as set forth in claim 53 wherein said cavity has a diameter substantially equal to 1 mil.
Claim 64
Dependent Claim
31 words
An apparatus as set forth in claim 53 further comprising means for analyzing a footprint in the lead, which footprint is impressed by said frontal surface into the lead during bonding.
Claim 65
Dependent Claim
24 words
An apparatus as set forth in claim 57 wherein said means for analyzing provides an output signal indicative of the quality of a bond.
Claim 66
Dependent Claim
17 words
An apparatus as set forth in claim 53 wherein said non-rigid substrate comprises an organic material substrate.
Claim 67
Dependent Claim
17 words
An apparatus as set forth in claim 53 wherein said laser energy source means comprises a shutter.
Claim 68
Independent Claim
154 words
An apparatus for bonding a component having at least one metallic lead to a non-rigid substrate having at least one pad thereon comprising: support means for supporting a lead superposed on a respective pad on a non-rigid substrate; ultrasonic bonder means including a tip, the tip having a frontal surface for engaging a lead to be bonded to a respective pad, said tip having a cavity centrally disposed and extending from said frontal surface; laser energy source means coupled to said tip by optical fiber means providing laser energy pulses to said cavity for heating said frontal surface, and synchronizer means coupled to said support means, said ultrasonic bonder and said laser energy source means for controlling operation of said support means, said ultrasonic bonder and laser energy source means whereby each lead of a component is bonded to a respective pad on a non-rigid substrate for bonding the component to the non-rigid substrate.
Claim 69
Independent Claim
154 words
An apparatus for bonding a component having at least one metallic lead to a non-rigid substrate having at least one pad thereon comprising: support means for supporting a lead superposed on a respective pad on a non-rigid substrate; ultrasonic bonder means including a tip, the tip having a frontal surface for engaging a lead to be bonded to a respective pad, said tip having a cavity centrally disposed and extending from said frontal surface; laser energy source means coupled to said tip by optical fiber means providing laser energy pulses to said cavity for heating said frontal surface, and synchronizer means coupled to said support means, said ultrasonic bonder and said laser energy source means for controlling operation of said support means, said ultrasonic bonder and laser energy source means whereby each lead of a component is bonded to a respective pad on a non-rigid substrate for bonding the component to the non-rigid substrate.
Claim 70
Dependent Claim
16 words
An apparatus as set forth in claim 61, wherein said support means comprises an x-y stepper.
Claim 71
Dependent Claim
21 words
An apparatus as set forth in claim 61, wherein said cavity has a diameter smaller than said optical fiber means diameter.
Claim 72
Dependent Claim
19 words
An apparatus as set forth in claim 61, wherein said cavity has a diameter substantially equal to 1 mil.
Claim 73
Dependent Claim
31 words
An apparatus as set forth in claim 61 further comprising means for analyzing a footprint in the lead, which footprint is impressed by said frontal surface into the lead during bonding.
Claim 74
Dependent Claim
24 words
An apparatus as set forth in claim 65 wherein said means for analyzing provides an output signal indicative of the quality of a bond.
Claim 75
Dependent Claim
17 words
An apparatus as set forth in claim 61, wherein said non-rigid substrate comprises an organic material substrate.
Claim 76
Dependent Claim
16 words
An apparatus as set forth in claim 61, wherein said laser energy source comprises a shutter.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-11-12 | 1994-05-14 | 1994-11-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-11-12 | 1998-05-14 | 1998-11-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-11-12 | 2002-05-14 | 2002-11-13 | $7700.00 | Window Closed / Lapsed |