Process for the manufacture of printed circuits using electrophoretically deposited organic resists

Claim 2

In a process for manufacturing a printed circuit, wherein an organic resin is electrophoretically deposited over a copper surface to serve as a resist in the process and is at least in part subsequently removed from said copper surface, the improvement comprising providing said copper surface with a layer of a phosphate conversion coating and thereafter electrophoretically depositing said organic resin over said layer of phosphate conversion coating.

Claim 3

A process according to claim 1 wherein said organic resin is photoactive, and wherein, after said organic resin is electrophoretically deposited over said layer of phosphate conversion coating, said resin is imagewise exposed and developed to provide a desired pattern of resist.

Claim 4

A process according to claim 2 wherein said resist serves as a plating resist.

Claim 5

A process according to claim 2 wherein said resist serves as an etch resist.

Claim 6

A process according to claim 1 wherein said organic resin is directly electrophoretically deposited in a pattern to serve as an etch resist.

Claim 7

A process according to claim 1 wherein said copper surface upon which is formed said layer of phosphate conversion coating over which said organic resist in electrophoretically deposited is a copper foil affixed to an insulating substrate surface.

Claim 8

A process according to claim 1 wherein said copper surface upon which is formed said layer of phosphate conversion coating over which said organic resin is electrophoretically deposited is the surface of a layer of electroless copper.

Claim 9

A process according to claim 1 wherein said copper surface upon which is formed said layer of phosphate conversion coating over which said organic resin is electrophoretically deposited is the surface of a layer of electrolytic copper.

Claim 10

In a process for manufacturing a patterned circuitry innerlayer for a multilayer printed circuit, wherein a copper-clad insulating substrate is provided with a layer of photoactive organic resin by electrophoretic deposition; followed by imagewise exposure of said layer of photoactive resin to activating radiation, and development of said image, to produce from said resin an etch resist in the pattern of the desired circuitry; followed by etching away of said copper, down to the insulating substrate surface, at areas not protected by said etch resist; followed by removal of said etch resist to reveal an underlying pattern of copper circuitry; the improvement comprising providing on said copper cladding, prior to the provision thereon of said layer of photoactive organic resin, a layer of a phosphate conversion coating, and thereafter electrophoretically depositing said layer of photoactive organic resin over said layer of phosphate conversion coating.

Claim 11

In a process for manufacturing a patterned circuitry innerlayer for a multilayer printed circuit, wherein a copper-clad insulating substrate is provided with a layer of photoactive organic resin by electrophoretic deposition; followed by imagewise exposure of said layer of photoactive resin to activating radiation, and development of said image, to produce from said resin an etch resist in the pattern of the desired circuitry; followed by etching away of said copper, down to the insulating substrate surface, at areas not protected by said etch resist; followed by removal of said etch resist to reveal an underlying pattern of copper circuitry; the improvement comprising providing on said copper cladding, prior to the provision thereon of said layer of photoactive organic resin, a layer of a phosphate conversion coating, and thereafter electrophoretically depositing said layer of photoactive organic resin over said layer of phosphate conversion coating.

Claim 12

In a process for manufacturing a printed circuit wherein a copper-clad insulating substrate has through-holes drilled therein; followed by metallization of said through-holes, and coating said copper cladding with electroless copper; followed by application to the electrolessly copper coated copper cladding of a layer of photoresist which is imaged and developed to form a plating resist over selected areas of said electrolessly copper coated copper cladding corresponding to a negative of a pattern of eventually desired circuitry; followed by provision of additional copper over the electrolessly copper coated copper cladding not covered by said plating resist and over the electrolessly copper coated throughholes; followed by electrophoretic deposition of an organic etch resist over said additional copper, which is over said electrolessly copper-coated copper cladding; followed by removal of said plating resist and etching away the copper thereunder; and followed by removal of said organic etch resist; the improvement comprising providing said additional copper, which is over said electrolessly copper-coated copper cladding, with a layer of phosphate conversion coating before the electrophoretic deposition of said organic etch resist thereover, and thereafter electrophoretically depositing said organic etch resist over said layer of phosphate conversion coating.

Claim 13

In a process for manufacturing a printed circuit wherein a copper-clad insulating substrate has through-holes drilled therein; followed by metallization of said through-holes, and coating said copper cladding with electroless copper; followed by application to the electrolessly copper coated copper cladding of a layer of photoresist which is imaged and developed to form a plating resist over selected areas of said electrolessly copper coated copper cladding corresponding to a negative of a pattern of eventually desired circuitry; followed by provision of additional copper over the electrolessly copper coated copper cladding not covered by said plating resist and over the electrolessly copper coated throughholes; followed by electrophoretic deposition of an organic etch resist over said additional copper, which is over said electrolessly copper-coated copper cladding; followed by removal of said plating resist and etching away the copper thereunder; and followed by removal of said organic etch resist; the improvement comprising providing said additional copper, which is over said electrolessly copper-coated copper cladding, with a layer of phosphate conversion coating before the electrophoretic deposition of said organic etch resist thereover, and thereafter electrophoretically depositing said organic etch resist over said layer of phosphate conversion coating.

Claim 14

A process according to claim 10 wherein said additional copper is a layer of electrolytic copper.