Abstract It is among the principal objects of invention to provide a composition and a method for improving the adhesion between a copper foil and a printed circuit substrate by the provision of an adhesion promoting copper oxide layer on the copper film. The provision of copper oxide layers on the surface of copper films by immersion in a chlorite-hydroxide bath as conventionally conducted presents problems of safety and reproducibility. This process is improved by employing an oxidizing solution containing an alkali or alkaline earth metal chlorite at a concentration of from 100 grams per liter to complete saturation, and sodium or potassium hydroxide at a concentration of from 5 to 25 grams per liter. The process preferably forms an adhesion improving copper oxide film within commercially practical periods of time, on the order of 7 minutes or less, at practically low temperatures, on the order of from 80° F. to 200° F., and preferably less than about 140° F. The solution can be sprayed by conventional spray etchers. The copper oxide films produced according to the most preferred conditions are brown in coloration and provide adhesion values according to the standard peel test of greater than about 5 pounds per inch with contact times of from about 3 to about 5 minutes.
A printed circuit board having at least one copper layer laminated directly to a polymeric substrate by heat and pressure, the surface of said copper layer bonded to said substrate having been subjected, prior to lamination, to the action of an aqueoussolution containing an alkali metal chlorite or alkaline earth metal chlorite at a concentration of from 100 grams per liter to complete saturation, and sodium or potassium hydroxide at a concentration of from 5 to 25 grams per liter at a temperature of from 80° F. to 200° F. for a period of time effective to form a thin, brown layer of cupric oxide on said surface.
Claim 2
Dependent Claim
108 words
A printed circuit board having at least one copper layer laminated directly to a polymeric substrate by heat and pressure, the surface of said copper layer bonded to said substrate having been subjected, prior to lamination, to the action of an aqueoussolution containing an alkali metal chlorite or alkaline earth metal chlorite at a concentration of from 100 grams per liter to complete saturation, and sodium or potassium hydroxide at a concentration of from 5 to 25 grams per liter at a temperature of from 80° F. to 200° F. for a period of time effective to form a thin, brown layer of cupric oxide on said surface.
Claim 3
Dependent Claim
47 words
A printed circuit board in accordance with claim 1 wherein the action of the aqueous solution extends for a period of time of about 1 minute at the higher end of the temperature range up to about 7 minutes at the lower end of the temperature range.
Claim 4
Dependent Claim
20 words
A printed circuit board as claimed in claim 1 wherein said printed circuit substrate is a reinforced epoxy resin board.
Claim 5
Dependent Claim
20 words
A printed circuit board as claimed in claim 1 wherein said printed circuit substrate is a reinforced polyimide resin board.