Patent US5237269A successfully refreshed from Google Patents.
US5237269A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Connections between circuit chips and a temporary carrier for use in burn-in tests
Assignee: International Business Machines Corp
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Filing: 1991-03-27
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Granted: 1993-08-17
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Expires: 2011-03-27
Abstract
Abstract An apparatus for conducting burn-in tests of circuit chips in which frangible connections are made between contact points of a reusable carrier and a chip to be tested. At the end of the burn-in test, shear force is imparted such that the frangible connections are broken without causing damage to the chip or the carrier. The carrier has at least one lead line or pad made of solder wettable material such as copper for making electrical connections with solder balls of the chip. The lead line is covered with an overlay which is made of non-wettable material to which solder will not adhere. Holes are provided in the overlay such that a restricted connection may be made between the solder balls and the underlaying lead line when the solder is reflowed. At the end of the test, linear shear force is imparted such that the connections between the solder balls and the lead line are broken. The solder balls are then reflowed to reshape them for subsequent use.
Inventors
- 👤 Bruno R. Aimi
- 👤 Ralph F. Antonucci
- 👤 Ferdinand D. Dimaria
- 👤 Hamid R. Torabi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 20:47
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/04
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
129 words
A circuit chip test apparatus comprising: a carrier having contact points for making contact with a chip to be tested; contact restricting means for controlling the area of solid bond between the chip and said contact points to an area less than the area used to make permanent bonds at said contact points; bond means for bonding the chip to be tested to said carrier at said contact points during a test, the area of said solid bonding being restricted by said contact restricting means for limiting the force required to break the solid bond between said carrier and the circuit chip formed by said bond means; and removing means for breaking the bond formed by said bond means for removing the chip from said carrier after the test.
Claim 2
Dependent Claim
129 words
A circuit chip test apparatus comprising: a carrier having contact points for making contact with a chip to be tested; contact restricting means for controlling the area of solid bond between the chip and said contact points to an area less than the area used to make permanent bonds at said contact points; bond means for bonding the chip to be tested to said carrier at said contact points during a test, the area of said solid bonding being restricted by said contact restricting means for limiting the force required to break the solid bond between said carrier and the circuit chip formed by said bond means; and removing means for breaking the bond formed by said bond means for removing the chip from said carrier after the test.
Claim 3
Dependent Claim
23 words
The apparatus of claim 1 wherein said contact restricting means is made of non-wettable material to which said bond means does not adhere.
Claim 4
Dependent Claim
27 words
The apparatus of claim 2 wherein said bond means comprises solder balls on the chip such that, when reflowed, the solder therefrom adheres to said contact points.
Claim 5
Dependent Claim
45 words
The apparatus of claim 1 wherein said removing means comprises: restraining means for restraining the chip and said carrier after said test; and force imparting means for imparting shear force between the chip and said carrier to break the bond formed by said bond means.
Claim 6
Dependent Claim
36 words
The apparatus of claim 4 wherein said restraining means comprises a module holder having a cavity for trapping said carrier therein, and an arm having an edge engageable along at least one side of the chip.
Claim 7
Dependent Claim
49 words
The apparatus of claim 5 wherein said force imparting means imparts linear shear force by moving said module holder with said carrier trapped therein such that the chip is engaged with the edge of said arm, thereby causing the connections between the chip and said carrier to be broken.
Claim 8
Dependent Claim
133 words
A reusable chip carrier for use in chip testing, said chip carrier comprising: a carrier substrate; at least one carrier contact of solder wettable material on the surface of said carrier substrate for making electrical connection to a chip to be tested; an overlay over said carrier contact, said overlay having a restricting means for restricting the bonding of a solid connection between said underlaying carrier contact and a chip contact on the chip to be tested, the area of the solid connection provided by said restricting means being less than the area used to make permanent bonds such that the force needed to separate the bond between the carrier contact and the chip contact is reduced to a desired value when the chip is separated from the chip carrier after the test.
Claim 9
Dependent Claim
133 words
A reusable chip carrier for use in chip testing, said chip carrier comprising: a carrier substrate; at least one carrier contact of solder wettable material on the surface of said carrier substrate for making electrical connection to a chip to be tested; an overlay over said carrier contact, said overlay having a restricting means for restricting the bonding of a solid connection between said underlaying carrier contact and a chip contact on the chip to be tested, the area of the solid connection provided by said restricting means being less than the area used to make permanent bonds such that the force needed to separate the bond between the carrier contact and the chip contact is reduced to a desired value when the chip is separated from the chip carrier after the test.
Claim 10
Dependent Claim
18 words
The reusable chip carrier of claim 7 wherein said overlay is made of a material non-wettable to solder.
Claim 11
Dependent Claim
14 words
The reusable chip carrier of claim 8 wherein said overlay is made of chrome.
Claim 12
Dependent Claim
28 words
The reusable chip carrier of claim 7 wherein said restricting means includes a hole through said overlay such that contact can be made with the underlaying carrier contact.
Claim 13
Dependent Claim
43 words
The reusable chip carrier of claim 10 wherein said hole has a diameter of from about 0.8 mils to about 2.4 mils for restricting contact between said copper lead line and a solder ball having a diameter of about 4 mils or greater.
Claim 14
Independent Claim
158 words
A method for testing a circuit chip comprising the steps of: placing a chip to be tested on a temporary substrate, said chip having at least one solder ball between a carrier contact on said temporary substrate and a chip contact on said chip; heating said chip and said temporary substrate to reflow said solder ball; restricting solder flow between said carrier contact and said chip contact to an area less than the area used to make a permanent bond by means of an overlay between said solder ball and said carrier contact, said overlay being made of a material which is non-wettable to solder; cooling said chip and said temporary substrate to solidify a restricted solid solder connection between said temporary carrier and said chip; conducting a burn-in test of said chip; and applying force between said chip and said temporary substrate to break said restricted solid solder connection for separating said chip from said temporary carrier.
Claim 15
Independent Claim
158 words
A method for testing a circuit chip comprising the steps of: placing a chip to be tested on a temporary substrate, said chip having at least one solder ball between a carrier contact on said temporary substrate and a chip contact on said chip; heating said chip and said temporary substrate to reflow said solder ball; restricting solder flow between said carrier contact and said chip contact to an area less than the area used to make a permanent bond by means of an overlay between said solder ball and said carrier contact, said overlay being made of a material which is non-wettable to solder; cooling said chip and said temporary substrate to solidify a restricted solid solder connection between said temporary carrier and said chip; conducting a burn-in test of said chip; and applying force between said chip and said temporary substrate to break said restricted solid solder connection for separating said chip from said temporary carrier.
Claim 16
Dependent Claim
33 words
The method of claim 12 further comprising the step of heating said chip after its separation from said temporary substrate for reflowing said solder ball thereby reshaping said solder ball for subsequent use.
References Cited (Backward Citations)
US3163709A
Cited
US3243498A
Cited
US3839727A
Cited
US4015328A
Cited
US4234666A
Cited
US4290079A
Cited
US4373778A
Cited
US4551914A
Cited
US4635092A
Cited
US4833402A
Cited
US4689556A
Cited
US4689875A
Cited
US5002895A
Cited
US5001544A
Cited
US5048744A
Cited
US4949148A
Cited
US4975079A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-08-16 | 1997-02-15 | 1997-08-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-08-16 | 2001-02-15 | 2001-08-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-08-16 | 2005-02-15 | 2005-08-17 | $7700.00 | Window Closed / Lapsed |