US4373778A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Connector implemented with fiber optic means and site therein for integrated circuit chips
Assignee: International Business Machines Corp
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Filing: 1980-12-30
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Granted: 1983-02-15
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Expires: 2000-12-30
Abstract
Abstract A single level packaging arrangement and connector for large or very large scale integrated circuit chips is disclosed. This arrangement utilizes dual function optical transducers and fiber optic cables as the transmission medium by which most, if not all, chip I/O communication is effected. The top portion of the connector acts as a conductive collar which serves as both a heat sink and a shield against stray external signals. A chip site is formed in the top portion of the connector and the chip removably lodged therein. The top portion of the connector also includes connector pads which are utilized to make solderless connection to deformable chip pads and to dual purpose optical transducers. Thermal grease, which is forced into and fills site cavities provided for that purpose, assists in conducting heat from within the connector to thereby enhance the heat dissipation characteristics of the chip site. The chip itself is retained in the site by the use of wedges and retaining strips secured to the connector at appropriate locations therein. The bottom portion of the connector is provided with a first group of holes that house the optical transducers in operative alignment with the bottoms of predetermined ones of the site connector pins. A second group of holes in the bottom portion includes the optical cables that couple the chip's I/O pads to selected circuits and/or devices. The top and bottom connector portions are joined together by suitable means.
Inventors
- 👤 Jawad F. Adham
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 05:05
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1053; H05K7/1061; G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4202; G02B6/4249; G02B6/4292; H01; H01R; H01R12/00; H01R12/70; H01R12/71; H01R12/712; H01R12/714; H10; H10W; H10W78/00
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
427 words
Apparatus for detachably connecting a high density, integrated circuit chip having deformable chip connection pads thereon within said apparatus and for coupling said chip pads to predefined connection points, said apparatus comprising: (a) a top portion including a distinct conductive layer at the top thereof, said conductive layer having an opening formed therein which extends partially through said conductive layer; (b) a floor at the bottom of said top portion opening having a first plurality of holes formed therein which extend from said floor completely through the remainder of said top portion and a second plurality of holes also formed in the remainder of said top portion between predetermined ones of said first plurality of holes and extending from the bottom of and partially upward into said top portion; (c) a plurality of conductive site connection pins mounted one each in said first plurality of holes, said pins including connection pads at the head thereof, said pads extending upwardly from said floor toward said opening; (d) a bottom portion including an upper insulating layer and at least one conductive layer therebeneath which includes printed circuit leads formed therein, said insulating layer having a third plurality of holes formed therethrough and said bottom portion conductive layer having a fourth plurality of holes formed therein coaxial with each one of said third plurality of holes; (e) a plurality of light transmission means mounted one each in said fourth plurality of holes and extending therefrom to said connection points; (f) a plurality of optical transducers, mounted one each in operative association with one of said site connection pins and one of said light transmission means in predetermined ones of said third plurality of holes, for converting electrical signals received from its said associated site connection pin into light signals suitable for transmission along its associated light transmission means to at least one of said remote connection points; (g) a plurality of optical transducers, mounted one each in operative association with one of said site connection pads and one of said light transmission means in predetermined ones of said third plurality of holes, for converting light signals received from its said associated light transmission means and at least one of said remote connection points into electrical signals suitable for use in the chip by applying said electrical signals to its associated site connection pin; and (h) chip retention means, secured to said apparatus at the top of said opening, for retaining a chip in said opening with said site connection pads and said chip connection pads operatively coupled to each other.
Claim 2
Dependent Claim
427 words
Apparatus for detachably connecting a high density, integrated circuit chip having deformable chip connection pads thereon within said apparatus and for coupling said chip pads to predefined connection points, said apparatus comprising: (a) a top portion including a distinct conductive layer at the top thereof, said conductive layer having an opening formed therein which extends partially through said conductive layer; (b) a floor at the bottom of said top portion opening having a first plurality of holes formed therein which extend from said floor completely through the remainder of said top portion and a second plurality of holes also formed in the remainder of said top portion between predetermined ones of said first plurality of holes and extending from the bottom of and partially upward into said top portion; (c) a plurality of conductive site connection pins mounted one each in said first plurality of holes, said pins including connection pads at the head thereof, said pads extending upwardly from said floor toward said opening; (d) a bottom portion including an upper insulating layer and at least one conductive layer therebeneath which includes printed circuit leads formed therein, said insulating layer having a third plurality of holes formed therethrough and said bottom portion conductive layer having a fourth plurality of holes formed therein coaxial with each one of said third plurality of holes; (e) a plurality of light transmission means mounted one each in said fourth plurality of holes and extending therefrom to said connection points; (f) a plurality of optical transducers, mounted one each in operative association with one of said site connection pins and one of said light transmission means in predetermined ones of said third plurality of holes, for converting electrical signals received from its said associated site connection pin into light signals suitable for transmission along its associated light transmission means to at least one of said remote connection points; (g) a plurality of optical transducers, mounted one each in operative association with one of said site connection pads and one of said light transmission means in predetermined ones of said third plurality of holes, for converting light signals received from its said associated light transmission means and at least one of said remote connection points into electrical signals suitable for use in the chip by applying said electrical signals to its associated site connection pin; and (h) chip retention means, secured to said apparatus at the top of said opening, for retaining a chip in said opening with said site connection pads and said chip connection pads operatively coupled to each other.
Claim 3
Dependent Claim
29 words
The apparatus according to claim 1 wherein said conductive layer of said top portion is provided with a shoulder at least partially around the edge perimeter of said opening.
Claim 4
Dependent Claim
32 words
The apparatus according to claim 2 wherein said chip retention means includes a first plurality of strips of plastic material of predetermined thickness and means for fastening said strips to said shoulder.
Claim 5
Dependent Claim
42 words
The apparatus according to claim 3 wherein said first plurality of strips each include deformable projection means on the chip contacting surface thereof which tend, when firmly pressed against by said chip upon its insertion, to lock said chip within said opening.
Claim 6
Dependent Claim
59 words
The apparatus according to claim 4 wherein said chip retention means includes a second plurality of strips of plastic material of predetermined thickness and flexibility and means for fastening said strips to the top of said conductive layer of said top portion with said strips extending therefrom out over and in restraining contact with the top of said chip.
Claim 7
Dependent Claim
41 words
The apparatus according to claim 5 wherein said second plurality of strips each include deformable projection means on their surfaces which contact said chip which tend, when said chip is in proper position within said opening, to lock said chip therewithin.
Claim 8
Dependent Claim
58 words
The apparatus according to claim 6 wherein said site connection pins only partially fill said first plurality of holes in which they are located leaving a cavity at the bottom thereof and which further includes thermal conductive fluid situated in and completely filling said cavity in each of said first plurality of holes below said site connection pin.
Claim 9
Dependent Claim
28 words
The apparatus according to claim 7 which additionally comprises a conductive oxide resistant permanent coating applied over each of said pads of said plurality of site connection pins.
Claim 10
Dependent Claim
58 words
The apparatus according to claim 1 wherein said site connection pins only partially fill said first plurality of holes in which they are located leaving a cavity at the bottom thereof and which further includes thermal conductive fluid situated in and completely filling said cavity in each of said first plurality of holes below said site connection pin.
Claim 11
Dependent Claim
28 words
The apparatus according to claim 9 which additionally comprises a conductive oxide resistant permanent coating applied over each of said pads of said plurality of site connection pins.
Claim 12
Dependent Claim
28 words
The apparatus according to claim 1 which additionally comprises a conductive oxide resistant permanent coating applied over each of said pads of said plurality of site connection pins.
Claim 13
Dependent Claim
399 words
Apparatus for detachably connecting a high density, integrated circuit chip having deformable chip connection pads thereon within said apparatus and for coupling said chip pads to predefined connection points, said apparatus comprising: (a) a top portion including a distinct conductive layer at the top thereof, said conductive layer having an opening formed therein which extends partially through said conductive layer; (b) a floor at the bottom of said top portion opening having a first plurality of holes formed therein which extend from said floor completely through the remainder of said top portion and a second plurality of holes also formed in the remainder of said top portion between predetermined ones of said first plurality of holes and extending from the bottom of and partially upward into said top portion; (c) a plurality of conductive site connection pins mounted one each in said first plurality of holes, said pins including connection pads at the head thereof, said pads extending upwardly from said floor toward said opening; (d) a bottom portion including an upper insulating layer and at least one conductive layer therebeneath which includes printed circuit leads formed therein, said insulating layer having a third plurality of holes formed therethrough and said bottom portion conductive layer having a fourth plurality of holes formed therein coaxial with each one of said third plurality of holes; (e) a plurality of light transmission means mounted one each in said fourth plurality of holes and extending therefrom to said connection points; (f) a plurality of dual function optical transducers, mounted one each in operative association with at least one of said site connection pins and at least one of said light transmission means in predetermined ones of said third plurality of holes, for converting electrical signals received from its said associated site connection pin into light signals suitable for transmission along its associated light transmission means to at least one of said remote connection points or for converting light signals received from its said associated light transmission means and at least one of said remote connection points into electrical signals suitable for use in said chip by applying said electrical signals to an associated site connection pin; and (g) chip retention means, secured to said apparatus at the top of said opening, for retaining a chip in said opening with said site connection pads and said chip connection pads operatively coupled to each other.
Claim 14
Dependent Claim
399 words
Apparatus for detachably connecting a high density, integrated circuit chip having deformable chip connection pads thereon within said apparatus and for coupling said chip pads to predefined connection points, said apparatus comprising: (a) a top portion including a distinct conductive layer at the top thereof, said conductive layer having an opening formed therein which extends partially through said conductive layer; (b) a floor at the bottom of said top portion opening having a first plurality of holes formed therein which extend from said floor completely through the remainder of said top portion and a second plurality of holes also formed in the remainder of said top portion between predetermined ones of said first plurality of holes and extending from the bottom of and partially upward into said top portion; (c) a plurality of conductive site connection pins mounted one each in said first plurality of holes, said pins including connection pads at the head thereof, said pads extending upwardly from said floor toward said opening; (d) a bottom portion including an upper insulating layer and at least one conductive layer therebeneath which includes printed circuit leads formed therein, said insulating layer having a third plurality of holes formed therethrough and said bottom portion conductive layer having a fourth plurality of holes formed therein coaxial with each one of said third plurality of holes; (e) a plurality of light transmission means mounted one each in said fourth plurality of holes and extending therefrom to said connection points; (f) a plurality of dual function optical transducers, mounted one each in operative association with at least one of said site connection pins and at least one of said light transmission means in predetermined ones of said third plurality of holes, for converting electrical signals received from its said associated site connection pin into light signals suitable for transmission along its associated light transmission means to at least one of said remote connection points or for converting light signals received from its said associated light transmission means and at least one of said remote connection points into electrical signals suitable for use in said chip by applying said electrical signals to an associated site connection pin; and (g) chip retention means, secured to said apparatus at the top of said opening, for retaining a chip in said opening with said site connection pads and said chip connection pads operatively coupled to each other.
Claim 15
Dependent Claim
29 words
The apparatus according to claim 12 wherein said conductive layer of said top portion is provided with a shoulder at least partially around the edge perimeter of said opening.
Claim 16
Dependent Claim
32 words
The apparatus according to claim 13 wherein said chip retention means includes a first plurality of strips of plastic material of predetermined thickness and means for fastening said strips to said shoulder.
Claim 17
Dependent Claim
42 words
The apparatus according to claim 14 wherein said first plurality of strips each include deformable projection means on the chip contacting surface thereof which tend, when firmly pressed against by said chip upon its insertion, to lock said chip within said opening.
Claim 18
Dependent Claim
59 words
The apparatus according to claim 15 wherein said chip retention means includes a second plurality of strips of plastic material of predetermined thickness and flexibility and means for fastening said strips to the top of said conductive layer of said top portion with said strips extending therefrom out over and in restraining contact with the top of said chip.
Claim 19
Dependent Claim
41 words
The apparatus according to claim 16 wherein said second plurality of strips each include deformable projection means on their surfaces which contact said chip which tend, when said chip is in proper position within said opening, to lock said chip therewithin.
Claim 20
Dependent Claim
58 words
The apparatus according to claim 17 wherein said site connection pins only partially fill said first plurality of holes in which they are located leaving a cavity at the bottom thereof and which further includes thermal conductive fluid situated in and completely filling said cavity in each of said first plurality of holes below said site connection pin.
Claim 21
Dependent Claim
28 words
The apparatus according to claim 18 which additionally comprises a conductive oxide resistant permanent coating applied over each of said pads of said plurality of site connection pins.
Claim 22
Dependent Claim
58 words
The apparatus according to claim 12 wherein said site connection pins only partially fill said first plurality of holes in which they are located leaving a cavity at the bottom thereof and which further includes thermal conductive fluid situated in and completely filling said cavity in each of said first plurality of holes below said site connection pin.
Claim 23
Dependent Claim
28 words
The apparatus according to claim 20 which additionally comprises a conductive oxide resistant permanent coating applied over each of said pads of said plurality of site connection pins.
Claim 24
Dependent Claim
28 words
The apparatus according to claim 12 which additionally comprises a conductive oxide resistant permanent coating applied over each of said pads of said plurality of site connection pins.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-02-14 | 1986-08-16 | 1987-02-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-02-14 | 1990-08-16 | 1991-02-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-02-14 | 1994-08-16 | 1995-02-15 | $7700.00 | Window Closed / Lapsed |