US5232970A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic-filled thermally-conductive-composites containing fusible semi-crystalline polyamide and/or polybenzocyclobutenes for use in microelectronic applications
Assignee: Dow Chemical Co
•
Filing: 1992-01-10
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Granted: 1993-08-03
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Expires: 2012-01-10
Abstract
Abstract A ceramic-filled thermally-conductive composite for use in microelectronic applications includes a substantially homogeneous mixture of a solidified polymeric material and an adamantine-structured ceramic filler, such as aluminum nitride or boron nitride, wherein the solidified polymeric material is substantially continuous. The solidified polymeric material may be a material containing a predominant amount of a fusible semi-crystalline polyamide having a melting point of greater than about 250° C. or a polybenzocyclobutene.
Inventors
- 👤 Jitka Solc
- 👤 Douglas G. Kleweno
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 20:37
CPC Classifications
C; C08; C08L; C08L77/00; C08L77/06; C08K; C08K3/00; C08K3/01; C08K3/013
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
144 words
A ceramic-filled thermally-conductive composite for use in microelectronic applications, comprising a substantially homogeneous mixture of: (A) a fusible semi-crystalline polyamide having a melting point of greater than about 250° C. and polymerized from a combination selected from the group consisting of (I) p, p'-diphenylmethane diisocyanate and azelaic acid and (II) p, p'-diphenylmethane diamine and azelaic acid present in an amount up to about 65 parts by volume; and (B) an adamantine-structured ceramic filler selected from the group consisting of diamond, boron nitride, silicon carbide, beryllium oxide, boron phosphide, aluminum nitride, beryllium sulfide, boron arsenide, gallium nitride, silicon, aluminum phosphide, gallium phosphide, and mixtures thereof, the ceramic filler present in an amount at least about 35 parts by volume wherein the total parts by volume of the fusible semi-crystalline polyamide and the ceramic filler equal 100 parts, wherein the solidified polymeric material is substantially continuous.
Claim 2
Dependent Claim
144 words
A ceramic-filled thermally-conductive composite for use in microelectronic applications, comprising a substantially homogeneous mixture of: (A) a fusible semi-crystalline polyamide having a melting point of greater than about 250° C. and polymerized from a combination selected from the group consisting of (I) p, p'-diphenylmethane diisocyanate and azelaic acid and (II) p, p'-diphenylmethane diamine and azelaic acid present in an amount up to about 65 parts by volume; and (B) an adamantine-structured ceramic filler selected from the group consisting of diamond, boron nitride, silicon carbide, beryllium oxide, boron phosphide, aluminum nitride, beryllium sulfide, boron arsenide, gallium nitride, silicon, aluminum phosphide, gallium phosphide, and mixtures thereof, the ceramic filler present in an amount at least about 35 parts by volume wherein the total parts by volume of the fusible semi-crystalline polyamide and the ceramic filler equal 100 parts, wherein the solidified polymeric material is substantially continuous.
Claim 3
Dependent Claim
37 words
The thermally-conductive composite of claim 1, wherein the polymer is a fusible semi-crystalline polyamide having a melting point greater than about 250° C., a glass transition temperature greater than about 100° C., and the following structure: ##STR7##
Claim 4
Dependent Claim
36 words
The thermally-conductive composite of claim 1, wherein the mixture further includes fused silica present in a ratio of from about 0.25:4 to about 4:0.25 weight parts fused silica to weight parts of the adamantine-structured ceramic filler.
Claim 5
Dependent Claim
61 words
The thermally-conductive composite of claim 1, wherein the solidified polymeric material is present in an amount from about 15 to about 45 parts by volume and the ceramic filler is present in an amount from about 55 to about 85 parts by volume wherein the total parts by volume of the solidified polymeric material and the ceramic filler equal 100 parts.
Claim 6
Dependent Claim
24 words
The thermally-conductive composite of claim 1, wherein the thermally-conductive composite has a thermal conductivity from about 0.8 to about 10 Watts/m°K. at 30° C.
Claim 7
Dependent Claim
38 words
The thermally-conductive composite of claim 1, wherein the thermally-conductive composite has a coefficient of linear thermal expansion from about 10 to about 28 microns/m°C. as measured at a temperature below the glass transition temperature of the thermally-conductive composite.
Claim 8
Dependent Claim
38 words
The thermally-conductive composite of claim 1, wherein the thermally-conductive composite has a coefficient of linear thermal expansion from about 12 to about 22 microns/m°C. as measured at a temperature below the glass transition temperature of the thermally-conductive composite.
Claim 9
Dependent Claim
20 words
The thermally-conductive composite of claim 1, wherein the thermally-conductive composite has a glass transition temperature of at least 150° C.
Claim 10
Dependent Claim
23 words
The thermally-conductive composite of claim 1, wherein the thermally-conductive composite has a dielectric constant from about 3 to about 8 at 1 kHz.
Claim 11
Dependent Claim
25 words
The thermally-conductive composite of claim 1, wherein the solidified polymeric material has a thermal conductivity from about 0.15 to about 0.5 Watts/m°K. at 30° C.
Claim 12
Dependent Claim
22 words
The thermally-conductive composite of claim 1, wherein the solidified polymeric material has a glass transition temperature of at least about 150° C.
Claim 13
Dependent Claim
102 words
A ceramic-filled thermally-conductive composite for use in microelectronic applications, comprising a substantially homogeneous mixture of: (A) a polybenzocyclobutene present in an amount up to about 65 parts by volume and (B) an adamantine-structured ceramic filler selected from the group consisting of diamond, boron nitride, silicon carbide, beryllium oxide, boron phosphide, aluminum nitride, beryllium sulfide, boron arsenide, gallium nitride, silicon, aluminum phosphide, gallium phosphide, and mixtures thereof, the ceramic filler present in an amount at least about 35 parts by volume wherein the total parts by volume of the polybenzocyclobutene and the ceramic filler equal 100 parts, wherein the polybenzocyclobutene is substantially continuous.
Claim 14
Dependent Claim
102 words
A ceramic-filled thermally-conductive composite for use in microelectronic applications, comprising a substantially homogeneous mixture of: (A) a polybenzocyclobutene present in an amount up to about 65 parts by volume and (B) an adamantine-structured ceramic filler selected from the group consisting of diamond, boron nitride, silicon carbide, beryllium oxide, boron phosphide, aluminum nitride, beryllium sulfide, boron arsenide, gallium nitride, silicon, aluminum phosphide, gallium phosphide, and mixtures thereof, the ceramic filler present in an amount at least about 35 parts by volume wherein the total parts by volume of the polybenzocyclobutene and the ceramic filler equal 100 parts, wherein the polybenzocyclobutene is substantially continuous.
Claim 15
Dependent Claim
26 words
The thermally-conductive composite of claim 12, wherein the polymer is a polybenzcyclobutene based on a monomer selected from the group consisting of di(vinylbenzocyclobutenyl) tetramethyldisiloxane and isophthaloyldibenzocyclobutene.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-08-02 | 1997-02-01 | 1997-08-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-08-02 | 2001-02-01 | 2001-08-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-08-02 | 2005-02-01 | 2005-08-03 | $7700.00 | Window Closed / Lapsed |