US4826896A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Encapsulating electronic components
Assignee: Henkel Loctite Corp
•
Filing: 1987-03-19
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Granted: 1989-05-02
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Expires: 2007-03-19
Abstract
Abstract Encapsulating an electronic component with an encapsulating resin having a filler that includes silicon carbide to form a composite with improved thermal conductivity (e.g., greater than 25×10 -4 cal/cm-sec-°C.) and improved stress characteristics (e.g. a thermal shock cycle number of at least 30).
Inventors
- 👤 Philip J. Procter
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 12:05
CPC Classifications
C; C08; C08K; C08K3/00; C08K3/10; C08K3/14; H; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/40; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W74/473
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
55 words
A non-conductive composition for encapsulating an electronic component comprising an encapsulating resin blended with at least 50 percent by weight of a filler including sufficient silicon carbide particles to cause the thermal conductivity of said encapsulating composition to be at least 25×10 -4 cal/cm-sec-°C. and the thermal shock cycle number to be at least 30.
Claim 2
Dependent Claim
55 words
A non-conductive composition for encapsulating an electronic component comprising an encapsulating resin blended with at least 50 percent by weight of a filler including sufficient silicon carbide particles to cause the thermal conductivity of said encapsulating composition to be at least 25×10 -4 cal/cm-sec-°C. and the thermal shock cycle number to be at least 30.
Claim 3
Dependent Claim
30 words
The composition of claim 1 wherein said silicon carbide is treated with a coupling agent to improve adhesion to said encapsulating resin and reduce the electrical conductivity of said composition.
Claim 4
Dependent Claim
15 words
The composition of claim 2 wherein said coupling agent comprises an organosilane, organosilazane, or organotitanate.
Claim 5
Dependent Claim
18 words
The composition of claim 2 wherein said thermal conductivity of said composition is at least 60×10 -4 cal/cm-sec-°C.
Claim 6
Dependent Claim
18 words
The composition of claim 2 wherein said thermal shock cycle number of said composition is at least 40.
Claim 7
Dependent Claim
23 words
The composition of claim 1 wherein said filler further comprises silica, alumina, boron nitride, magnesium aluminosilicate, and magnesium oxide, or a combination thereof.
Claim 8
Dependent Claim
20 words
The composition of claim 6 wherein the weight percent of said silica in said composition is between 10 and 40.
Claim 9
Dependent Claim
20 words
The composition of claim 6 wherein the weight percent of said alumina in said composition is between 10 and 40.
Claim 10
Dependent Claim
21 words
The composition of claim 6 wherein the weight percent of said boron nitride in said composition is between 1 and 10.
Claim 11
Dependent Claim
21 words
The composition of claim 6 wherein the weight percent of said magnesium aluminosilicate in said composition is between 5 and 20.
Claim 12
Dependent Claim
21 words
The composition of claim 6 wherein the weight percent of said magnesium oxide in said composition is between 1 and 50.
Claim 13
Dependent Claim
80 words
The composition of claim 6 wherein the weight percent of said silica in said composition is between 10 and 40, the weight percent of said alumina in said composition is between 10 and 40, the weight percent of said boron nitride in said composition is between 1 and 10, the weight percent of said magnesium aluminosilicate in said composition is between 5 and 20, and the weight percent of said magnesium oxide in said composition is between 1 and 50.
Claim 14
Dependent Claim
20 words
The composition of claim 1 wherein the weight percent of said silicon carbide in said composition is at least 10.
Claim 15
Dependent Claim
21 words
The composition of claim 1 wherein the weight percent of said silicon carbide in said composition is between 30 and 70.
Claim 16
Dependent Claim
12 words
The composition of claim 1 wherein said encapsulating resin comprises epoxy resin.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-05-01 | 1992-10-31 | 1993-05-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-05-01 | 1996-10-31 | 1997-05-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-05-01 | 2000-10-31 | 2001-05-02 | $7700.00 | Window Closed / Lapsed |