Patent US5219795A successfully refreshed from Google Patents.
US5219795A
Expired / Lapsed
US
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Dual in-line packaging and method of producing the same
Assignee: Fujitsu Ltd
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Filing: 1992-04-28
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Granted: 1993-06-15
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Expires: 2012-04-28
Abstract
Abstract A dual in-line packaging comprises a substrate having a top surface, a bottom surface and a peripheral surface, semiconductor chips mounted on the top and bottom surfaces of the substrate, a plurality of terminals fixed to the substrate and projecting from the bottom surface of the substrate, a first layer made of a first material and covering the bottom surface of the substrate and the semiconductor chips, and a second layer made of a second material and covering the top surface of the substrate and the semiconductor chips. The first material is resilient and moisture resistant and the second material is hard compared to the first material.
Inventors
- 👤 Toshio Kumai
- 👤 Takaki Kokubun
- 👤 Shingo Nojiri
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 08:27
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/284; H10W74/10; H10W74/111; H10W74/121; H10W90/00; H10W90/701; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
180 words
A method of producing a dual in-line packaging comprising the steps of: preparing a substrate having semiconductor chips mounted on top and bottom surfaces of the substrate and having a plurality of terminals projecting from the bottom surface of the substrate; forming a first layer made of a first material over the bottom surface of the substrate and the semiconductor chips, wherein a portion of said first layer is in direct contact with the bottom surface of the substrate, and wherein said first layer has side portions having inner surfaces in direct contact with a peripheral surface of said substrate; and forming a second layer made of a second material over the top surface of the substrate and the semiconductor chips, wherein a portion of said second layer is in direct contact with the top surface of the substrate, and wherein said second layer has side portions having inner surfaces in direct contact with outer surfaces of said first layer side portions, said first material being resilient and moisture resistant, said second material being hard compared to said first material.
Claim 2
Independent Claim
180 words
A method of producing a dual in-line packaging comprising the steps of: preparing a substrate having semiconductor chips mounted on top and bottom surfaces of the substrate and having a plurality of terminals projecting from the bottom surface of the substrate; forming a first layer made of a first material over the bottom surface of the substrate and the semiconductor chips, wherein a portion of said first layer is in direct contact with the bottom surface of the substrate, and wherein said first layer has side portions having inner surfaces in direct contact with a peripheral surface of said substrate; and forming a second layer made of a second material over the top surface of the substrate and the semiconductor chips, wherein a portion of said second layer is in direct contact with the top surface of the substrate, and wherein said second layer has side portions having inner surfaces in direct contact with outer surfaces of said first layer side portions, said first material being resilient and moisture resistant, said second material being hard compared to said first material.
Claim 3
Dependent Claim
70 words
The method as claimed in claim 1 wherein said step of forming the first layer further covers a peripheral surface of the substrate by the first material, and said step of forming the second layer submerges the substrate which has the first layer into a liquid of the second material so that the second layer further covers a portion of the first layer covering the peripheral surface of the substrate.
Claim 4
Dependent Claim
27 words
The method as claimed in claim 2 wherein said first material is a silicone resin, and said second material is a phenolic resin which contains glass fiber.
Claim 5
Dependent Claim
27 words
The method as claimed in claim 1 wherein said first material is a silicone resin, and said second material is a phenolic resin which contains glass fiber.
Claim 6
Dependent Claim
26 words
The method as claimed in claim 1 wherein said first material is selected from a group which includes polyurethane, polyurethane rubber, silicon rubber and flexible epoxy.
Claim 7
Dependent Claim
26 words
The method as claimed in claim 1 wherein said second material is selected from a group which includes melamine resin and epoxy resin containing fiber glass.
Claim 8
Dependent Claim
25 words
The method as claimed in claim 1 wherein said substrate is made of a material selected from a group which includes ceramics and glass epoxy.
Claim 9
Dependent Claim
46 words
The method as claimed in claim 1, wherein said terminals are arranged in-line along parallel sides of the substrate and penetrated through said first layer to thereby maintain the moisture resistance of said dual in-line packaging even when an external force is applied to said terminals.
Claim 10
Dependent Claim
30 words
The method as claimed in claim 1, wherein the coefficient of thermal expansion of the second material is substantially the same as the coefficient of thermal expansion of the substrate.
Claim 11
Independent Claim
174 words
A method of producing a dual in-line packaging comprising the steps of: preparing a substrate having semiconductor chips mounted on top and bottom surfaces of the substrate and having a plurality of terminals projecting from the bottom surface of the substrate, said terminals being arranged in-line along parallel sides of the substrate; forming a first layer made of a first material over the bottom surface of the substrate and the semiconductor chips; and forming a second layer made of a second material over the top surface of the substrate and the semiconductor chips, said first material being resilient and moisture resistant, said second material being hard compared to said first material, wherein said step of forming the first layer further covers a peripheral surface of the substrate by the first material, and said step of forming the second layer submerges the substrate which has the first layer into a liquid of the second material so that the second layer further covers a portion of the first layer covering the peripheral surface of the substrate.
Claim 12
Independent Claim
174 words
A method of producing a dual in-line packaging comprising the steps of: preparing a substrate having semiconductor chips mounted on top and bottom surfaces of the substrate and having a plurality of terminals projecting from the bottom surface of the substrate, said terminals being arranged in-line along parallel sides of the substrate; forming a first layer made of a first material over the bottom surface of the substrate and the semiconductor chips; and forming a second layer made of a second material over the top surface of the substrate and the semiconductor chips, said first material being resilient and moisture resistant, said second material being hard compared to said first material, wherein said step of forming the first layer further covers a peripheral surface of the substrate by the first material, and said step of forming the second layer submerges the substrate which has the first layer into a liquid of the second material so that the second layer further covers a portion of the first layer covering the peripheral surface of the substrate.
Claim 13
Dependent Claim
27 words
The method as claimed in claim 10, wherein said first material is a silicone resin, and said second material is a phenolic resin which contains glass fiber.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-06-14 | 1996-12-14 | 1997-06-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-06-14 | 2000-12-14 | 2001-06-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-06-14 | 2004-12-14 | 2005-06-15 | $7700.00 | Window Closed / Lapsed |