US5214844A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of assembling integrated circuits to a silicon board
Assignee: nCHIP Inc
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Filing: 1990-12-17
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Granted: 1993-06-01
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Expires: 2010-12-17
Abstract
Abstract An assembly structure and process for attaching integrated circuits to multichip modules and attaching the module to a printed circuit board. An epoxy loaded with diamond dust or boron nitride is used to attach the integrated circuit to the module. The dust material increases the thermal conductance of the epoxy for improved heat dissipation without substantially increasing the capacitance of interconnect routed underneath the epoxy. Reverse wedge wire bonding is also used to electrically connect the integrated circuit to the module allowing greater chip densities on the module surface. The chip/module assembly can then be mounted on a printed circuit board and the module leads wired directly to the board.
Inventors
- 👤 Bruce M. McWilliams
- 👤 Nicholas E. Brathwaite
- 👤 David B. Tuckerman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 13:48
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/601; H05; H05K; H05K1/00; H05K1/16; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
73 words
A method for mechanically and electrically connecting an integrated circuit to a silicon circuit board comprising the steps of: dispensing an electrically nonconductive and thermally conductive adhesive on a surface of said silicon circuit board, wherein said adhesive is deposited to have a void to expose an underlying bond pad of said silicon circuit board; and attaching an electrically conductive material to said bond pad and a back side of said integrated circuit.
Claim 2
Independent Claim
73 words
A method for mechanically and electrically connecting an integrated circuit to a silicon circuit board comprising the steps of: dispensing an electrically nonconductive and thermally conductive adhesive on a surface of said silicon circuit board, wherein said adhesive is deposited to have a void to expose an underlying bond pad of said silicon circuit board; and attaching an electrically conductive material to said bond pad and a back side of said integrated circuit.
Claim 3
Dependent Claim
38 words
The method for mechanically and electrically connecting of claim 1 wherein said step of dispensing an electrically nonconductive and thermally conductive adhesive comprises the step of: dispensing an epoxy material having boron nitride dispersed throughout the epoxy material.
Claim 4
Dependent Claim
38 words
The method for mechanically and electrically connecting of claim 1 wherein said step of dispensing an electrically nonconductive and thermally conductive adhesive comprises the step of: dispensing an epoxy material having diamond dust dispersed throughout the epoxy material.
Claim 5
Independent Claim
82 words
A method for mechanically and electrically connecting an integrated circuit to a silicon circuit board comprising the steps of: dispensing an electrically conductive and thermally conductive adhesive on a surface of said silicon circuit board, wherein said adhesive is deposited to have a void to expose an underlying bond pad of said silicon circuit board; dispensing an electrically conductive adhesive over said electrically nonconductive and thermally conductive adhesive and within said void; and placing the integrated circuit on said electrically conductive adhesive.
Claim 6
Independent Claim
82 words
A method for mechanically and electrically connecting an integrated circuit to a silicon circuit board comprising the steps of: dispensing an electrically conductive and thermally conductive adhesive on a surface of said silicon circuit board, wherein said adhesive is deposited to have a void to expose an underlying bond pad of said silicon circuit board; dispensing an electrically conductive adhesive over said electrically nonconductive and thermally conductive adhesive and within said void; and placing the integrated circuit on said electrically conductive adhesive.
Claim 7
Dependent Claim
38 words
The method for mechanically and electrically connecting of claim 4 wherein said step of dispensing an electrically nonconductive and thermally conductive adhesive comprises the step of: dispensing an epoxy material having boron nitride dispersed throughout the epoxy material.
Claim 8
Dependent Claim
38 words
The method for mechanically and electrically connecting of claim 4 wherein said step of dispensing an electrically nonconductive and thermally conductive adhesive comprises the step of: dispensing an epoxy material having diamond dust dispersed throughout the epoxy material.
Claim 9
Independent Claim
127 words
The method for assembling a plurality of integrated circuits to form a multichip module and connecting said multichip module to a printed circuit board comprising the steps of: mounting a rigid support material on a bottom surface of a silicon circuit board; mechanically attaching said plurality of integrated circuits to a top surface of said silicon circuit board to form a multichip module; electrically connecting said plurality of integrated circuits to said silicon circuit board; encapsulating at least an interior region of a top surface portion of said multichip module; mounting said multichip module on said printed circuit board wherein said top surface of said multichip module faces said printed circuit board; and electrically connecting said printed circuit board to a bond pad of said multichip module.
Claim 10
Independent Claim
127 words
The method for assembling a plurality of integrated circuits to form a multichip module and connecting said multichip module to a printed circuit board comprising the steps of: mounting a rigid support material on a bottom surface of a silicon circuit board; mechanically attaching said plurality of integrated circuits to a top surface of said silicon circuit board to form a multichip module; electrically connecting said plurality of integrated circuits to said silicon circuit board; encapsulating at least an interior region of a top surface portion of said multichip module; mounting said multichip module on said printed circuit board wherein said top surface of said multichip module faces said printed circuit board; and electrically connecting said printed circuit board to a bond pad of said multichip module.
Claim 11
Dependent Claim
22 words
The method for assembling of claim 7 further comprising the step of: encapsulating a resulting printed circuit board and multichip module structure.
Claim 12
Dependent Claim
28 words
The method of assembling of claim 7 wherein said step of electrically connecting said plurality of integrated circuits to said silicon circuit board comprises reverse wedge wire bonding.
Claim 13
Dependent Claim
42 words
The method of assembling of claim 7 wherein said step of mechanically attaching said plurality of integrated circuits to said silicon circuit board comprises the steps of: dispensing an epoxy material having a high atomic weight material dispersed throughout the epoxy material.
Claim 14
Dependent Claim
39 words
The method of assembling of claim 7 wherein said step of mechanically attaching said plurality of integrated circuits to said silicon circuit board comprises the step of: dispensing an epoxy material having diamond dust dispersed throughout the epoxy material.
Claim 15
Dependent Claim
39 words
The method of assembling of claim 7 wherein said step of mechanically attaching said plurality of integrated circuits to said silicon circuit board comprises the step of: dispensing an epoxy material having boron nitride dispersed throughout the epoxy material.
Claim 16
Dependent Claim
41 words
The method of assembling of claim 7 wherein said step of mechanically attaching said plurality of integrated circuits to said silicon circuit board comprises the step of: dispensing an adhesive material wherein said adhesive material is electrically nonconductive and thermally conductive.
Claim 17
Dependent Claim
24 words
The method of assembling of claim 7 wherein said step of electrically connecting said printed circuit board to a bond pad comprises wire bonding.
Claim 18
Dependent Claim
83 words
The method of assembling of claim 7 wherein said steps of mechanically attaching and electrically connecting said plurality of integrated circuits to said silicon circuit board comprise the steps of: dispensing an electrically nonconductive and thermally conductive adhesive on a surface of said silicon circuit board, wherein said adhesive is deposited to have a void to expose an underlying bond pad of said silicon circuit board; and dispensing an electrically conductive adhesive over said electrically nonconductive, thermally conductive adhesive and within said void.
Claim 19
Dependent Claim
67 words
The method of assembling of claim 7, further comprising the step of dispensing an electrically nonconductive and thermally conductive adhesive on a surface of said silicon circuit board wherein said adhesive is deposited to have a void to expose an underlying bond pad of said silicon circuit board; and attaching an electrically conductive material to a back side of said integrated circuit and to said bond pad.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-05-31 | 1996-11-30 | 1997-06-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-05-31 | 2000-11-30 | 2001-06-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-05-31 | 2004-11-30 | 2005-06-01 | $7700.00 | Window Closed / Lapsed |