US4923825A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of treating a semiconductor body
Assignee: Scientific Imaging Technologies Inc
•
Filing: 1989-05-01
•
Granted: 1990-05-08
•
Expires: 2009-05-01
Abstract
Abstract A semiconductor body is treated by providing a layer of dielectric material over a peripheral region of the front face of the body, mounting the body on a support member with the front face of the body in confronting relationship with the support member, and removing material of the body in the peripheral region, so as to expose at least a portion of the layer of dielectric material. A layer of metal is formed on the back face of the body and is connected to an electrical terminal.
Inventors
- 👤 Morley M. Blouke
- 👤 Thaian N. Tran
- 👤 Marjorie L. Lust
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 17:32
CPC Classifications
H; H10; H10D; H10D44/00; H10D44/01; H10D44/041; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/20; H10W72/251; H10W72/29; H10W72/50; H10W72/541; H10W72/547; H10W72/90; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
196 words
A method of treating a semiconductor body having a front face and a back face, comprising the steps of: (a) providing a layer of dielectric material having at least one aperture over a peripheral region of the front face of the body and depositing conductive material in the aperture so that the layer of metal on the exposed dielectric material contacts the conductive material, (b) mounting the body on a support member, with the front face of the body in confronting relationship with the support member, (c) removing material of the body in the peripheral region, so as to expose at least a portion of the layer of dielectric material, (d) forming a layer of metal on the back face of the body and a layer of metal on the exposed dielectric material, the layer of metal on the back face of the body being electrically separate from the layer of metal on the exposed dielectric material and removing metal from a selected are of the exposed dielectric material, without removing the metal that overlies the conductive material, and (e) connecting the layer of metal on the back face of the body to an electrical terminal.
Claim 2
Independent Claim
196 words
A method of treating a semiconductor body having a front face and a back face, comprising the steps of: (a) providing a layer of dielectric material having at least one aperture over a peripheral region of the front face of the body and depositing conductive material in the aperture so that the layer of metal on the exposed dielectric material contacts the conductive material, (b) mounting the body on a support member, with the front face of the body in confronting relationship with the support member, (c) removing material of the body in the peripheral region, so as to expose at least a portion of the layer of dielectric material, (d) forming a layer of metal on the back face of the body and a layer of metal on the exposed dielectric material, the layer of metal on the back face of the body being electrically separate from the layer of metal on the exposed dielectric material and removing metal from a selected are of the exposed dielectric material, without removing the metal that overlies the conductive material, and (e) connecting the layer of metal on the back face of the body to an electrical terminal.
Claim 3
Dependent Claim
20 words
A method according to claim 1, comprising connecting the metal that overlies the conductive material to a second electrical terminal.
Claim 4
Dependent Claim
38 words
A method according to claim 1, wherein step (d) comprises depositing a single continuous layer of metal on the back face of the body and the exposed dielectric material, and selectively removing metal of the single continuous layer.
Claim 5
Dependent Claim
47 words
A method according to claim 1, further comprising, between steps (d) and (e): removing metal from a selected area of the back face of the body, and wherein step (e) comprises connecting the metal that remains on the back face of the body to the electrical terminal.
Claim 6
Dependent Claim
37 words
A method according to claim 4, wherein the semiconductor body has an optically active region surrounded by said peripheral region, and the step between step (d) and step (e) comprises removing metal over the optically active region.
Claim 7
Dependent Claim
22 words
A method according to claim 1, further comprising, between steps (b) and (c), thinning the body by way of its back face.
Claim 8
Independent Claim
114 words
A method of treating a treating a semiconductor body having a front face and a back face and having a charge-coupled device formed therein over a selected area of the front face, said method comprising the steps of: mounting the body on a support member, with the front face of the body in confronting relationship with the support member, thinning the body by way of its back face, forming a layer of metal on the back face of the thinned body, said layer of metal not extending over that area of the back face which directly overlies said selected area of the front face, and connecting the layer of metal to an electrical terminal.
Claim 9
Independent Claim
114 words
A method of treating a treating a semiconductor body having a front face and a back face and having a charge-coupled device formed therein over a selected area of the front face, said method comprising the steps of: mounting the body on a support member, with the front face of the body in confronting relationship with the support member, thinning the body by way of its back face, forming a layer of metal on the back face of the thinned body, said layer of metal not extending over that area of the back face which directly overlies said selected area of the front face, and connecting the layer of metal to an electrical terminal.
Claim 10
Independent Claim
113 words
A method of treating a semiconductor body having a front face and a back face, comprising the steps of: (a) providing a layer of dielectric material over a peripheral region of the front face of the body, (b) mounting the body on a support member, with the front face of the body in confronting relationship with the support member, (c) removing material of the body in the peripheral region, so as to expose at least a portion of the layer of dielectric material, (d) forming a layer of metal on the back face of the body, and (e) bonding a wire to the layer of metal on the back face of the body.
Claim 11
Independent Claim
113 words
A method of treating a semiconductor body having a front face and a back face, comprising the steps of: (a) providing a layer of dielectric material over a peripheral region of the front face of the body, (b) mounting the body on a support member, with the front face of the body in confronting relationship with the support member, (c) removing material of the body in the peripheral region, so as to expose at least a portion of the layer of dielectric material, (d) forming a layer of metal on the back face of the body, and (e) bonding a wire to the layer of metal on the back face of the body.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-05-07 | 1993-11-06 | 1994-05-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-05-07 | 1997-11-06 | 1998-05-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-05-07 | 2001-11-06 | 2002-05-08 | $7700.00 | Window Closed / Lapsed |