Patent US5178318A successfully refreshed from Google Patents.
US5178318A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same
Assignee: Hewlett Packard Development Co LP
•
Filing: 1991-06-06
•
Granted: 1993-01-12
•
Expires: 2011-06-06
Abstract
Abstract A rigid-flex printed circuit board having a rigid section and a flexible section extending from the rigid section is disclosed. The rigid-flex printed circuit board is capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens by providing spacers and covers for protecting the flexible section from high temperatures. A process for assembling components and devices on the rigid-flex printed circuit board in a high volume production environment utilizing infrared reflow ovens is also disclosed.
Inventors
- 👤 Eric R. Edwin
- 👤 James J. Tumlinson
- 👤 Jerome A. Wilson
- 👤 Thad C. McMillan, Jr.
- 👤 Rollin G. Meyer
- 👤 Darryl J. McKenney
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:25
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4688; H05K3/4691; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0366; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/0909; H05K2203/00; H05K2203/05; H05K2203/0548; H05K2203/0557; H05K2203/30; H05K2203/308; H05K3/341
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
139 words
A process for assembling components and devices on a rigid-flex printed circuit board in a high volume production environment utilizing an infrared reflow oven wherein rigid-flex printed circuit board includes a rigid section, a flexible section extending from the rigid section, a top spacer and a top insulating cover spaced above the flexible section, and a bottom spacer and a bottom insulating cover spaced below the flexible section, comprising the steps of: screening solder paste to selected areas on a top surface of the printed circuit board; placing components and devices on the selected areas on the top surface of the printed circuit board; soldering the components and devices on the top surface of the printed circuit board in the infrared reflow oven; and removing the top insulating cover and the bottom insulating cover from the printed circuit board.
Claim 2
Dependent Claim
139 words
A process for assembling components and devices on a rigid-flex printed circuit board in a high volume production environment utilizing an infrared reflow oven wherein rigid-flex printed circuit board includes a rigid section, a flexible section extending from the rigid section, a top spacer and a top insulating cover spaced above the flexible section, and a bottom spacer and a bottom insulating cover spaced below the flexible section, comprising the steps of: screening solder paste to selected areas on a top surface of the printed circuit board; placing components and devices on the selected areas on the top surface of the printed circuit board; soldering the components and devices on the top surface of the printed circuit board in the infrared reflow oven; and removing the top insulating cover and the bottom insulating cover from the printed circuit board.
Claim 3
Dependent Claim
24 words
The process according to claim 1, further comprising the step of: removing the top spacer and the bottom spacer from the printed circuit board.
Claim 4
Dependent Claim
206 words
A process for assembling components and devices on a rigid-flex printed circuit board in a high volume production environment utilizing an infrared reflow oven wherein the rigid-flex printed circuit board includes a rigid section, a flexible section extending from the rigid section, a top spacer and a top insulating cover spaced above the flexible section, and a bottom spacer and a bottom insulating cover spaced below the flexible section, comprising the steps of: screening solder paste to selected areas on a top surface of the printed circuit board; placing components and devices on the selected areas on the top surface of the printed circuit board; soldering the components and devices on the top surface of the printed circuit board in the infrared reflow oven; and turning the printed circuit board over so that a bottom surface is facing upwards; screening solder paste to selected areas on the bottom surface of the printed circuit board; placing components and devices on the selected areas of the bottom surface of the printed circuit board; soldering the components and devices on the bottom surface of the printed circuit board in the infrared reflow oven; and removing the top insulating cover and the bottom insulating cover from the printed circuit board.
Claim 5
Dependent Claim
206 words
A process for assembling components and devices on a rigid-flex printed circuit board in a high volume production environment utilizing an infrared reflow oven wherein the rigid-flex printed circuit board includes a rigid section, a flexible section extending from the rigid section, a top spacer and a top insulating cover spaced above the flexible section, and a bottom spacer and a bottom insulating cover spaced below the flexible section, comprising the steps of: screening solder paste to selected areas on a top surface of the printed circuit board; placing components and devices on the selected areas on the top surface of the printed circuit board; soldering the components and devices on the top surface of the printed circuit board in the infrared reflow oven; and turning the printed circuit board over so that a bottom surface is facing upwards; screening solder paste to selected areas on the bottom surface of the printed circuit board; placing components and devices on the selected areas of the bottom surface of the printed circuit board; soldering the components and devices on the bottom surface of the printed circuit board in the infrared reflow oven; and removing the top insulating cover and the bottom insulating cover from the printed circuit board.
Claim 6
Dependent Claim
24 words
The process according to claim 3, further comprising the step of: removing the top spacer and the bottom spacer from the printed circuit board.
References Cited (Backward Citations)
US3409732A
Cited
US4075420A
Cited
US4424095A
Cited
US4965227A
Cited
US4838475A
Cited
US5048166A
Cited
US4800461A
Cited
US4885841A
Cited
US4998342A
Cited
US5072074A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-01-12 | 1996-07-13 | 1997-01-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-01-12 | 2000-07-13 | 2001-01-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-01-12 | 2004-07-13 | 2005-01-12 | $7700.00 | Window Closed / Lapsed |