US4838475A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for EMI/RFI shielding an infrared energy reflow soldered device
Assignee: Motorola Solutions Inc
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Filing: 1987-08-28
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Granted: 1989-06-13
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Expires: 2007-08-28
Abstract
Abstract An EMI/RFI shield (10) comprises a box like structure formed of a metal integral member having a plurality of apertures (16) formed therethrough. The apertures (16) are of a size appropriate to substantially pass infrared energy (22) and to substantially block EMI/RFI energy (26). When placed on a substrate (18), infrared energy (22) can be utilized to reflow solder a device (19) encapsulated by the shield (10) to the substrate (18).
Inventors
- 👤 Aaron B. Mullins
- 👤 Michael H. Bartlett
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 21:17
CPC Classifications
H; H05; H05K; H05K9/00; H05K9/0007; H05K9/002; H05K9/0022; H05K9/0024; H05K9/0026; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/0969; H05K2201/10; H05K2201/10227; H05K2201/10371; H05K3/3494; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10S; Y10S174/00; Y10S174/35; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49146
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
102 words
A method of reflow soldering a device to a substrate with infrared energy, the method comprising: (A) positioning said device on said substrate; (B) positioning an EMI/RFI shield on said substrate and about said device to thereby substantially encapsulate said device, wherein said EMI/RFI shield comprises a box having apertures formed therethrough, which apertures are of a size to substantially allow infrared energy to pass therethrough and to substantially block EMI/RFI energy; (C) exposing said EMI/RFI shield to infrared energy, such that said infrared energy substantially passes through said EMI/RFI shield to cause said device to be reflow soldered to said substrate.
Claim 2
Independent Claim
102 words
A method of reflow soldering a device to a substrate with infrared energy, the method comprising: (A) positioning said device on said substrate; (B) positioning an EMI/RFI shield on said substrate and about said device to thereby substantially encapsulate said device, wherein said EMI/RFI shield comprises a box having apertures formed therethrough, which apertures are of a size to substantially allow infrared energy to pass therethrough and to substantially block EMI/RFI energy; (C) exposing said EMI/RFI shield to infrared energy, such that said infrared energy substantially passes through said EMI/RFI shield to cause said device to be reflow soldered to said substrate.
Claim 3
Dependent Claim
29 words
The method of claim 1 wherein, in step C, exposure of said EMI/RFI shield to said infrared energy also causes said shield to be reflow soldered to said substrate.
Claim 4
Dependent Claim
99 words
The method of claim 1 comprising the additional step of (A) positioning said device on said substrate; (B) positioning an EMI/RFI shield on said substrate and about said device to thereby substantially encapsulate said device, wherein said EMI/RFI shield has apertures formed therethrough that are substantially opaque to EMI/RFI energy; (C) exposing said device and shield to energy, such that said device and said shield are soldered to said substrate; (D) exposing, through said apertures in said EMI/RFI shield, said substrate that is proximal to said device to a cleaning substance to allow flux residue to be removed therefrom.
Claim 5
Dependent Claim
54 words
The method of claim 1 wherein said substrate includes at least one surface feature, and said EMI/RFI shield includes at least one notch, and wherein said step of positioning the EMI/RFI shield on the substrate includes the step of positioning the EMI/RFI shield such that the notch accommodates the surface feature on the substrate.
Claim 6
Dependent Claim
52 words
The method of claim 1 wherein the EMI/RFI shield includes at least one mounting tab and the substrate includes at least one mounting tab reception hole, and wherein the step of positioning the EMI/RFI shield on the substrate includes the step of positioning the mounting tab within the mounting tab reception hole.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-06-12 | 1992-12-12 | 1993-06-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-06-12 | 1996-12-12 | 1997-06-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-06-12 | 2000-12-12 | 2001-06-13 | $7700.00 | Window Closed / Lapsed |