Method of manufacturing tape automated bonding semiconductor package

Claim 1

In the process of manufacturing a tape automated bonding semiconductor package, the tape automated bonding semiconductor package having a tape automated bonding section mounted within a carrier frame, the tape automated bonding section having a central aperture and a plurality of electrical conductors, each electrical conductor having an inner lead located at the perimeter of the central aperture, an outer lead distally located from the inner lead, and a test pad distally located from the outer lead, a method of selectively plating the outer leads comprising the steps of: a) providing the tape automated bonding section with a plurality of debus areas, each debus area located around the outer perimeter of the tape automatic bonding section between the test pads and a common plane conductor, each debus area interconnecting a plurality of the test pads to the common plane conductor; b) applying an electromative potential to the common plane conductor; c) mounting an inner and an outer gasket over, respectively, an inner and an outer portion of the outer leads, said inner and outer gaskets defining therebetween a region of said outer leads to which a solder coating is to be applied; d) applying a barrier material to the outer leads in the region between the inner and the outer gaskets; e) applying a solder coating to the outer leads over the barrier material in the region; and f) excising the debus areas from the tape automated bonding section.

Claim 5

A method of manufacturing a tape automated bonding semiconductor package comprising the steps of: a) mounting an individual tape automated bonding section within a carrier frame, the tape automated bonding section having a central aperture and a plurality of electrical conductors, each electrical conductor having an inner lead located around the perimeter of the central aperture, an outer lead distally located from the inner lead, and a test pad distally located from the outer lead along the outer perimeter of the tape automated bonding section, each test pad electrically connected to a common plane conductor by a plurality of debus areas; b) aligning each specific inner lead with a specific contact pad on a semiconductor chip; c) bonding each specific inner lead to each specific contact pad on the semiconductor chip; d) mounting a housing member on opposite faces of the tape automated bonding section so as to enclose the semiconductor chip and the inner leads therebetween; e) after said mounting step, selectively plating the outer leads with a barrier material and then a solder layer; and f) excising the tape automated bonding semiconductor package from the carrier frame.

Claim 6

A method of manufacturing a tape automated bonding semiconductor package comprising the steps of: a) mounting an individual tape automated bonding section within a carrier frame, the tape automated bonding section having a central aperture and a plurality of electrical conductors, each electrical conductor having an inner lead located around the perimeter of the central aperture, an outer lead distally located from the inner lead, and a test pad distally located from the outer lead along the outer perimeter of the tape automated bonding section, each test pad electrically connected to a common plane conductor by a plurality of debus areas; b) aligning each specific inner lead with a specific contact pad on a semiconductor chip; c) bonding each specific inner lead to each specific contact pad on the semiconductor chip; d) mounting a housing member on opposite faces of the tape automated bonding section so as to enclose the semiconductor chip and the inner leads therebetween; e) after said mounting step, selectively plating the outer leads with a barrier material and then a solder layer; and f) excising the tape automated bonding semiconductor package from the carrier frame.