EP0324244A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Tape automated bonding package for a semiconductor chip with decoupling
Assignee: International Business Machines Corp
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Filing: 1988-12-13
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Granted: —
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Expires: 2008-12-13
Abstract
Abstract A tape automated bonding package has a polymer layer (64) supporting leads, including ground and power leads, for coupling the chip to a printed circuit board. One or more decoupling capacitors (52,54,56,58) are connected directly to ground (62) and power (60) leads at positions closely adjacent the chip.
Inventors
- 👤 Richard Francis Frankeny
- 👤 James Mitchell Rakes
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-07 11:59
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453; H10W44/00; H10W44/601
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
59 words
A tape automated bonding package for a semiconductor chip comprising an electrically insulating polymer layer, and a pattern of electrical leads on the layer, including signal, ground and power leads, for interconnecting the semiconductor chip to a printed circuit substrate, characterised by a decoupling capacitor directly connected to a ground and to a power lead on the polymer layer.
Claim 2
Dependent Claim
59 words
A tape automated bonding package for a semiconductor chip comprising an electrically insulating polymer layer, and a pattern of electrical leads on the layer, including signal, ground and power leads, for interconnecting the semiconductor chip to a printed circuit substrate, characterised by a decoupling capacitor directly connected to a ground and to a power lead on the polymer layer.
Claim 3
Dependent Claim
60 words
A package according to claim 1 in which the semiconductor chip is rectangular and including a ground and a power lead positioned on the layer as a pair of adjacent leads passing to a corner area on the chip, said decoupling capacitor being connected to the leads in the pair at a position adjacent the corner areas of the chip.
Claim 4
Dependent Claim
50 words
A package according to claim 2 including three further pairs of adjacent ground and earth leads, each pair being attached to the chip at an associated corner area thereof, and each pair having an associated decoupling capacitor connected thereto at a position adjacent the corner area associated with that pair.
Claim 5
Dependent Claim
37 words
A package according to any one of claims 1 to 3 in which the, or each, capacitor lies at least partially within an area of the polymer layer defined by contact of the chip and the layer.
Claim 6
Dependent Claim
71 words
A package according to claim 1 in which said layer includes a plurality of apertures for passing leads on the layer, in an area of the layer defined by contact of the layer and the chip, through to connections on the chip, two of said apertures connecting ground and power leads in said area to the chip, said capacitor being connected directly to said ground and power leads in said area.
References Cited (Backward Citations)
No citation records indexed.
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