EP0259222A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Outer lead tape automated bonding system
Assignee: Digital Equipment Corp
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Filing: 1987-08-26
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Granted: —
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Expires: 2007-08-26
Abstract
Abstract A method for aligning and bonding the outer leads (20) of the conductive fingers (16, Fig.3) of a tape-and-semiconductor-chip sub-assembly to a package substrate (12) is disclosed. Each section of tape is provided with an inner support ring (18) and an outer support ring (22). The conductive fingers extend from under the inner support ring (18) to under the outer support ring (22). The outer support ring (22) is spaced away from the inner support ring (18) to expose portions (23) of the tape outer leads (20) therebetween. The tape-and-chip sub-assembly (10) is positioned over the package substrate (12) so the outer leads (20) are in register with the appropriate package substrate leads (26). A deposit of flux (28) is applied to at least one location (30) between the substrate (18) and outer support ring (22) to bond the sub-assembly to the substrate. The bonded outer support ring prevents the sub-assembly from moving so the leads do not become out of register with the substrate prior to and during the lead bonding process.
Inventors
- 👤 David L. Hallowell
- 👤 John W. Sofia
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-30 17:51
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H10; H10W; H10W70/00; H10W70/40; H10W70/453; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10424; H05K2201/10613; H05K2201/10621; H05K2201/10681; H10W72/00; H10W72/071; H10W72/077; H10W72/701; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
144 words
A method of bonding a lead tape-and-chip sub-assembly to a package substrate, the lead tape having a plurality of conductive fingers electrically connected to the chip, each conductive fingers having an outer lead that is distally located from the chip and is to be bonded with a specific substrate lead on the package substrate, the method comprising the steps of: A. providing the tape-and-chip assembly with a tape outer support ring section overlying and adhered to the outer ends of the tape outer leads so as to restrict the movement of individual outer leads; B. positioning the tape and semiconductor chip sub-assembly on the substrate so that individual tape outer leads are are in register with the appropriate package substrate leads; and C. bonding the outer support ring to the substrate so as to restrain the movement of the aligned sub-assembly tape outer leads.
Claim 2
Independent Claim
144 words
A method of bonding a lead tape-and-chip sub-assembly to a package substrate, the lead tape having a plurality of conductive fingers electrically connected to the chip, each conductive fingers having an outer lead that is distally located from the chip and is to be bonded with a specific substrate lead on the package substrate, the method comprising the steps of: A. providing the tape-and-chip assembly with a tape outer support ring section overlying and adhered to the outer ends of the tape outer leads so as to restrict the movement of individual outer leads; B. positioning the tape and semiconductor chip sub-assembly on the substrate so that individual tape outer leads are are in register with the appropriate package substrate leads; and C. bonding the outer support ring to the substrate so as to restrain the movement of the aligned sub-assembly tape outer leads.
Claim 3
Dependent Claim
34 words
The method of claim 1 wherein the outer support ring is bonded to the substrate by applying an adhesive substance between the tape outer ring and the substrate at at least one selected location.
Claim 4
Dependent Claim
144 words
The method of claim 2 wherein the adhesive substance is a flux, said flux being hard at a first temperature, and adhesive and viscous at a second temperature above said first temperature, and the tape outer support ring is bonded to the substrate, according to the steps of: A. applying a deposit of flux heated to the second temperature to at least one location on the substrate where the outer support ring is to be positioned over the substrate; B. heating said substrate to said second temperature so said flux is adhesive and viscous; C. positioning the tape-and-chip sub-assembly so the tape outer leads are in register with the appropriate package substrate leads and the outer support ring is located in the flux deposit; and D. cooling said substrate to said first temperature so the flux hardens, bonding the tape-and-chip sub-assembly to the substrate.
Claim 5
Dependent Claim
33 words
The method of claim 2 wherein the selected locations said flux is applied between said tape outer support ring and the package substrate are free of package substrate leads and tape outer leads.
Claim 6
Dependent Claim
43 words
The method of claim 4 wherein the outer support ring is a polygon, and the tape outer leads are spaced away from the corners of the polygon having corners, and at least one corner of said polygon is located in a flux deposit.
Claim 7
Dependent Claim
17 words
The method of claim 3 wherein said flux is a rosin-paste flux with the solvents therein removed.
Claim 8
Dependent Claim
122 words
A lead tape section for electrically connecting a semiconductor chip to a package substrate, the tape having a plurality of conductive fingers for electrically connecting the bond points on the semiconductor chip to a substrate lead on the package substrate, comprising: A. each conductive finger having an inner lead for bonding to a semiconductor chip bond point, and an outer lead distally located from the inner lead for bonding to a substrate lead; B. an inner support ring over said conductive fingers between said inner leads and said outer leads, said support ring having an aperture for receiving the semiconductor chip, said inner leads extending into said central aperture; and C. A restraining means for restricting the movement of individual outer leads.
Claim 9
Dependent Claim
122 words
A lead tape section for electrically connecting a semiconductor chip to a package substrate, the tape having a plurality of conductive fingers for electrically connecting the bond points on the semiconductor chip to a substrate lead on the package substrate, comprising: A. each conductive finger having an inner lead for bonding to a semiconductor chip bond point, and an outer lead distally located from the inner lead for bonding to a substrate lead; B. an inner support ring over said conductive fingers between said inner leads and said outer leads, said support ring having an aperture for receiving the semiconductor chip, said inner leads extending into said central aperture; and C. A restraining means for restricting the movement of individual outer leads.
Claim 10
Dependent Claim
34 words
The lead tape section of claim 7 wherein the restraining means comprises providing said tape with an outer support ring over the ends of the outer leads spaced away from said inner support ring.
Claim 11
Dependent Claim
22 words
The tape section of claim 8 wherein there is at least one location on said outer support ring free of outer leads.
Claim 12
Dependent Claim
42 words
The tape section of claim 7 wherein a plurality of lead tape sections are attached together to form a tape, and said tape is adapted to be processed through an automatic bonding machine to bond a semiconductor chip to each tape section.
Claim 13
Dependent Claim
22 words
The lead tape section of claim 7 wherein said outer lead securing means is adapted for being bonded to the package substrate.
Claim 14
Dependent Claim
22 words
The lead section of claim 8 wherein said outer support lead is of a polygon shape having a plurality of corner regions.
Claim 15
Dependent Claim
24 words
The lead section of claim 12 wherein the outer leads are spaced away from at least one corner region of said outer support ring.
References Cited (Backward Citations)
No citation records indexed.
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